JPH0423500A - Appearance inspection device for electronic part - Google Patents
Appearance inspection device for electronic partInfo
- Publication number
- JPH0423500A JPH0423500A JP2129600A JP12960090A JPH0423500A JP H0423500 A JPH0423500 A JP H0423500A JP 2129600 A JP2129600 A JP 2129600A JP 12960090 A JP12960090 A JP 12960090A JP H0423500 A JPH0423500 A JP H0423500A
- Authority
- JP
- Japan
- Prior art keywords
- height
- position detection
- reflection
- reflection point
- detection element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 6
- 238000001514 detection method Methods 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 abstract description 18
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子部品の外観検査装置に関し、詳しくは、レ
ーザ光の２次反射による高さの誤検出を解消するための
手段に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for inspecting the appearance of electronic components, and more particularly to means for eliminating erroneous detection of height due to secondary reflection of laser light.
（従来の技術）
基板に実装された電子部品は、半田形状の良否、位置ず
れ等を検査する為に、外観検査が行われるが、この外観
検査として、レーザスポット光による検査手段が知られ
ている。(Prior Art) Electronic components mounted on a board are visually inspected to check the quality of the solder shape, misalignment, etc. For this visual inspection, an inspection method using laser spot light is known. There is.
第２図は、その従来手段を示すものであって、１０１は
基板、１０２は電子部品のリードであり、回路パターン
１０３上に形成された半田部１０４に接着されている。FIG. 2 shows a conventional means, in which 101 is a substrate, 102 is an electronic component lead, which is bonded to a solder portion 104 formed on a circuit pattern 103.
このものは、半田部１０４の長さ方向（Ｘ方向）にレー
ザスポット光をスキャンニングさせながら照射し、その
反射光をＰＳＤのような位置検出素子１０５に入射させ
て、その入射位置から、反射点の高さを検出して、半田
部１０４の形状の良否を判断するようになっている。This device irradiates the solder part 104 with scanning laser spot light in the length direction (X direction), makes the reflected light enter a position detection element 105 such as a PSD, and from the incident position, the reflected light The height of the point is detected to determine whether the shape of the solder portion 104 is good or bad.
（発明が解決しようとする課題）
ところで、半田部１０４に照射されたレーザ光は、例え
ばポイントａ、ｂにおいて破線矢印にて示すように、近
傍の回路バクーン１０３上などへ強く反射され、回路パ
ターン１０３上のポイントａ’ 、 ｂ’ で強く２
次反射された光が、位置検出１０５に入射する場合があ
る。この場合、位置検出素子１０５は２次ポイントａｂ
° の高さを、ポイントａ、ｂの高さと誤って検出しや
すく、その結果、半田部１０４の表面の高さを、鎖線１
０７で示すように、実際の高さよりもかなり低く検出し
てしまう問題があった。(Problem to be Solved by the Invention) By the way, the laser beam irradiated onto the solder portion 104 is strongly reflected onto the nearby circuit backing 103, for example, as shown by broken line arrows at points a and b, and the circuit pattern is Strongly 2 at points a' and b' on 103
The reflected light may then be incident on the position detection 105. In this case, the position sensing element 105 detects the secondary point ab
° It is easy to mistakenly detect the height as the height of points a and b, and as a result, the height of the surface of the solder part 104 is
As shown in 07, there was a problem in which the height was detected to be considerably lower than the actual height.
このような誤検出の原因となる２次反射は、回路パター
ン１０３だけでなく、リード１０２や手口］部１０４等
の鏡面性を有する部分においても発生しやすいものであ
る。Secondary reflection, which causes such false detection, is likely to occur not only in the circuit pattern 103 but also in specular parts such as the lead 102 and the signature section 104.
そこで本発明は、レーザ光の２次反射による高さの誤検
出を解消できる電子部品の外観検査装置を提供すること
を目的とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component visual inspection apparatus that can eliminate height detection errors caused by secondary reflection of laser light.
（課題を解決するための手段）
本発明は、基板に搭載された電子部品に向って、レーザ
スポット光をスキャンニングさせながら照射するレーザ
装置と、その反射光を受光することにより、反射点の高
さを検出する位置検出素子と、この位置検出素子の前方
にあって、上記スキャンニングと同期してこの位置検出
素子の前面を部分的に開いていくことにより、所定の反
射点で反射された反射光のみを、この位置検出素子に入
射させるシャッター手段とから半田部の外観検査装置を
構成している。(Means for Solving the Problems) The present invention provides a laser device that scans and irradiates electronic components mounted on a board with laser spot light, and a laser device that receives reflected light from the laser spot to detect a reflection point. There is a position detection element that detects height, and the front surface of this position detection element is partially opened in synchronization with the scanning, so that the light is reflected at a predetermined reflection point. A solder part visual inspection apparatus is comprised of a shutter means that allows only the reflected light to enter the position detection element.
（作用）
上記構成において、レーザ装置から半田部へ照射された
レーザ光は、半田部に反射されて位置検出素子に入射し
、反射点の高さが検出される。この場合、上記反射点に
おいて、レーザ光が側方などへ反射され、２次反射点か
ら位置検出素子へ向って反射されたレーザ光は、シャッ
ターによりノイズ光として遮光される。(Function) In the above configuration, the laser beam irradiated from the laser device to the solder portion is reflected by the solder portion and enters the position detection element, and the height of the reflection point is detected. In this case, the laser light is reflected to the side at the reflection point, and the laser light reflected from the secondary reflection point toward the position detection element is blocked by the shutter as noise light.
（実施例） 次に、図面を参照しながら本発明の詳細な説明する。(Example) Next, the present invention will be described in detail with reference to the drawings.
第１図において、■は基板、２は基板１に実装された電
子部品８のリードである。３は基板１に形成された回路
パターンであって、その表面には、半田メツキが施され
ており、リード２は、半田部４により、回路パターン３
上に接着されている。５はＰＳＤのような位置検出素子
であって、反射点の高さ（Ｘ方向）を検出する。In FIG. 1, ■ is a board, and 2 is a lead of an electronic component 8 mounted on the board 1. In FIG. 3 is a circuit pattern formed on the substrate 1, the surface of which is solder-plated, and the lead 2 is connected to the circuit pattern 3 by the solder portion 4.
glued on top. 5 is a position detection element such as a PSD, which detects the height (X direction) of the reflection point.
１０はレーザ装置、１１はミラーであり、ミラー１１を
２方向に回転させることにより、レーザ装置１０から照
射されたレーザスポット光をｘｙＸ方向スキャンニング
させながら、リード２や半田部４に照射する。10 is a laser device, and 11 is a mirror. By rotating the mirror 11 in two directions, the laser spot light irradiated from the laser device 10 is scanned in the xyx directions and irradiated onto the leads 2 and the solder portion 4.
６は液晶装置から成るシャッター手段であって、多数個
の透明電極部７１〜７ｎを備えている。本手段は、レー
ザスポット光を、リード２から半田部４へ向ってＸ方向
にスキャンニングさせながら、各反射点Ａ−Ｉで反射さ
れたレーザ光を位置検出素子５に入射させ、Ｘ方向の入
射点ｙａ”−ｙｉの位置から、リード２や半田部４の表
面の高さを検出し、半田部４の形状を判断するものであ
る。シャッター手段６は、位置検出素子５の前方にこれ
に近接させて配設されており、レーザスポット光のＸ方
向のスキャンニングに同期させて、各電極部７１〜７ｎ
を制御することにより、各電極部７．１〜７ｎを順に部
分的に開いていく。すると所定の反射点で反射されたレ
ーザ光のみが、電極部７１〜７ｎを通過して位置検出素
子５に入射し、その反射点Ａ−１の高さを検出する。Reference numeral 6 denotes a shutter means made of a liquid crystal device, and is provided with a large number of transparent electrode parts 71 to 7n. This means scans the laser spot light in the X direction from the lead 2 toward the solder part 4, and makes the laser light reflected at each reflection point A-I enter the position detection element 5, and scans the laser spot light in the X direction. The height of the surface of the lead 2 and the solder part 4 is detected from the position of the incident point ya''-yi, and the shape of the solder part 4 is determined. The electrode portions 71 to 7n are arranged close to each other in synchronization with the scanning of the laser spot light in the X direction.
By controlling , each electrode section 7.1 to 7n is partially opened in sequence. Then, only the laser light reflected at the predetermined reflection point passes through the electrode sections 71 to 7n and enters the position detection element 5, and the height of the reflection point A-1 is detected.
ところで、リード２や半田部４に照射されたレーザ光は
、側方へ強く反射される場合がある。Incidentally, the laser light irradiated onto the leads 2 and the solder portions 4 may be strongly reflected laterally.
反射点り、Ｆはそのような場合を示している。Reflection point F shows such a case.
反射点り、Ｆで反射されたレーザ光は、破線矢印で示す
ように、計測対象外である側方の回路パターン３上の２
次反射点Ｄ’ 、 Ｆ’ から、位置検出素子５へ向
って２次反射されている。この場合、回路パターン３の
表面は、半田メツキが施されていることから、その鏡面
性によりレーザ光は反射点り、Ｆよりも２次反射点Ｄ”
。The laser beam reflected at the reflection point F, as shown by the broken line arrow, hits two points on the side circuit pattern 3 that are not subject to measurement.
The light is secondarily reflected toward the position detection element 5 from the second reflection points D' and F'. In this case, since the surface of the circuit pattern 3 is soldered, its specularity causes the laser beam to be reflected at a secondary reflection point D"
.
Ｆ”でより強く２次反射され、強いノイズとなって位置
検出素子５に入射しやすい。このため、従来は、２次反
射点Ｄ′、Ｆｏ の高さを、反射点り、Ｆの高さと誤っ
て検出しやすいものであった。しかしながら本手段は、
この２次反射点Ｄ” 、Ｆ′ で反射されたレーザ光は
、シャッター手段６により遮光されるので、この２次反
射点Ｄ”、Ｆ′ の高さを、反則点り、 Ｆの高さと
誤って検出するのを防止できる。It is more strongly secondary reflected at F'', becomes strong noise, and easily enters the position detection element 5.For this reason, conventionally, the height of the secondary reflection point D', Fo is set to the height of the reflection point, F. However, with this method,
The laser beams reflected at these secondary reflection points D", F' are blocked by the shutter means 6, so the heights of these secondary reflection points D", F' can be expressed as the height of the foul point, F. Erroneous detection can be prevented.
（発明の効果）
以上説明したように本発明は、基板に搭載された電子部
品に向って、レーザスポット光をスキャンニングさセな
がら照射するレーザ装置と、その反射光を受光すること
により、反射点の高さを検出する位置検出素子と、この
位置検出素子の前方にあって、上記スキャンニングと同
期してこの位置検出素子の前面を部分的に開いていくこ
とにより、所定の反射点で反射された反射光のみを、こ
の位置検出素子に入射させるシャッター手段とから電子
部品の外観検査装置を構成しているので、２次反射によ
る高さの誤検出を防止し、半田部やリードなどの鏡面性
を有する部分の外観検査を精度よく行うことができ(Effects of the Invention) As explained above, the present invention provides a laser device that scans and irradiates a laser spot light toward an electronic component mounted on a board, and a laser device that receives the reflected light. There is a position detection element that detects the height of a point, and a position detection element is located in front of this position detection element, and by partially opening the front side of this position detection element in synchronization with the above scanning, it is possible to detect the height of a given reflection point. Since the external appearance inspection device for electronic components is composed of a shutter means that allows only the reflected light to enter the position detection element, it is possible to prevent erroneous detection of height due to secondary reflection, and to detect solder parts, leads, etc. It is possible to accurately inspect the appearance of mirror-like parts.
図は本発明の実施例を示すものであって、第１図は半田
部を計測中の斜視図、第２図は従来手段の計測中の側面
図である。
１・・・基板
５・・・位置検出素子
６・・・シャッター手段
８・・・電子部品
１０・・・レーザ装置
Ａ〜■・・・反射点The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of a solder portion being measured, and FIG. 2 is a side view of a conventional means being measured. 1...Substrate 5...Position detection element 6...Shutter means 8...Electronic component 10...Laser device A~■...Reflection point
Claims (1)
をスキャンニングさせながら照射するレーザ装置と、そ
の反射光を受光することにより、反射点の高さを検出す
る位置検出素子と、この位置検出素子の前方にあって、
上記スキャンニングと同期してこの位置検出素子の前面
を部分的に開いていくことにより、所定の反射点で反射
された反射光のみを、この位置検出素子に入射させるシ
ャッター手段とから成ることを特徴とする電子部品の外
観検査装置。A laser device that scans and irradiates electronic components mounted on a board with laser spot light, a position detection element that detects the height of the reflection point by receiving the reflected light, and a position detection device that detects the height of the reflection point by receiving the reflected light. In front of the element,
A shutter means that partially opens the front surface of the position detecting element in synchronization with the scanning to allow only the reflected light reflected at a predetermined reflection point to enter the position detecting element. Features: Appearance inspection equipment for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2129600A JP2767975B2 (en) | 1990-05-18 | 1990-05-18 | Appearance inspection equipment for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2129600A JP2767975B2 (en) | 1990-05-18 | 1990-05-18 | Appearance inspection equipment for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0423500A true JPH0423500A (en) | 1992-01-27 |
| JP2767975B2 JP2767975B2 (en) | 1998-06-25 |
Family
ID=15013464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2129600A Expired - Fee Related JP2767975B2 (en) | 1990-05-18 | 1990-05-18 | Appearance inspection equipment for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2767975B2 (en) |
-
1990
- 1990-05-18 JP JP2129600A patent/JP2767975B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2767975B2 (en) | 1998-06-25 |
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