JPH0423324Y2 - - Google Patents
Info
- Publication number
- JPH0423324Y2 JPH0423324Y2 JP1986099861U JP9986186U JPH0423324Y2 JP H0423324 Y2 JPH0423324 Y2 JP H0423324Y2 JP 1986099861 U JP1986099861 U JP 1986099861U JP 9986186 U JP9986186 U JP 9986186U JP H0423324 Y2 JPH0423324 Y2 JP H0423324Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- arm
- lever
- clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986099861U JPH0423324Y2 (enExample) | 1986-07-01 | 1986-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986099861U JPH0423324Y2 (enExample) | 1986-07-01 | 1986-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636733U JPS636733U (enExample) | 1988-01-18 |
| JPH0423324Y2 true JPH0423324Y2 (enExample) | 1992-05-29 |
Family
ID=30969133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986099861U Expired JPH0423324Y2 (enExample) | 1986-07-01 | 1986-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423324Y2 (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5854500B2 (ja) * | 1979-04-17 | 1983-12-05 | 株式会社新川 | ワイヤボンデイング装置 |
-
1986
- 1986-07-01 JP JP1986099861U patent/JPH0423324Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636733U (enExample) | 1988-01-18 |
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