JPH0423321Y2 - - Google Patents

Info

Publication number
JPH0423321Y2
JPH0423321Y2 JP438186U JP438186U JPH0423321Y2 JP H0423321 Y2 JPH0423321 Y2 JP H0423321Y2 JP 438186 U JP438186 U JP 438186U JP 438186 U JP438186 U JP 438186U JP H0423321 Y2 JPH0423321 Y2 JP H0423321Y2
Authority
JP
Japan
Prior art keywords
substrates
insulating film
conductive path
press
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP438186U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62116545U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP438186U priority Critical patent/JPH0423321Y2/ja
Publication of JPS62116545U publication Critical patent/JPS62116545U/ja
Application granted granted Critical
Publication of JPH0423321Y2 publication Critical patent/JPH0423321Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP438186U 1986-01-16 1986-01-16 Expired JPH0423321Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP438186U JPH0423321Y2 (enExample) 1986-01-16 1986-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP438186U JPH0423321Y2 (enExample) 1986-01-16 1986-01-16

Publications (2)

Publication Number Publication Date
JPS62116545U JPS62116545U (enExample) 1987-07-24
JPH0423321Y2 true JPH0423321Y2 (enExample) 1992-05-29

Family

ID=30784995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP438186U Expired JPH0423321Y2 (enExample) 1986-01-16 1986-01-16

Country Status (1)

Country Link
JP (1) JPH0423321Y2 (enExample)

Also Published As

Publication number Publication date
JPS62116545U (enExample) 1987-07-24

Similar Documents

Publication Publication Date Title
JPS6011809B2 (ja) 混成集積回路
JPH0423321Y2 (enExample)
EP0835046B1 (en) Component mounting board, process for producing the board, and process for producing the module
JPH0423322Y2 (enExample)
JPH0442937Y2 (enExample)
JPS6242548Y2 (enExample)
JPH0442938Y2 (enExample)
JPH0412680Y2 (enExample)
JPH0220860Y2 (enExample)
JPH0429590Y2 (enExample)
JPS61176139A (ja) 混成集積回路およびその製造方法
JPH0423323Y2 (enExample)
JPH0528907B2 (enExample)
JPH0543499Y2 (enExample)
JPH056715Y2 (enExample)
JPS60242693A (ja) 印刷配線板とその製造方法
JPH0359591B2 (enExample)
JPS58164130U (ja) スイツチ回路板
JPS62115761A (ja) 混成集積回路
JPS62145895A (ja) 混成集積回路の製造方法
JPH0533839B2 (enExample)
JPH0421346B2 (enExample)
JPS62149147A (ja) 混成集積回路
JPH0152916B2 (enExample)
JPS62149145A (ja) 混成集積回路