JPH0423000B2 - - Google Patents
Info
- Publication number
- JPH0423000B2 JPH0423000B2 JP59108906A JP10890684A JPH0423000B2 JP H0423000 B2 JPH0423000 B2 JP H0423000B2 JP 59108906 A JP59108906 A JP 59108906A JP 10890684 A JP10890684 A JP 10890684A JP H0423000 B2 JPH0423000 B2 JP H0423000B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nickel
- tank
- plating solution
- empty
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 58
- 238000001914 filtration Methods 0.000 claims description 12
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 45
- 229910052759 nickel Inorganic materials 0.000 description 22
- 239000002253 acid Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- PQMFVUNERGGBPG-UHFFFAOYSA-N (6-bromopyridin-2-yl)hydrazine Chemical compound NNC1=CC=CC(Br)=N1 PQMFVUNERGGBPG-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10890684A JPS60251294A (ja) | 1984-05-28 | 1984-05-28 | ニッケルめっき装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10890684A JPS60251294A (ja) | 1984-05-28 | 1984-05-28 | ニッケルめっき装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60251294A JPS60251294A (ja) | 1985-12-11 |
| JPH0423000B2 true JPH0423000B2 (ru) | 1992-04-21 |
Family
ID=14496628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10890684A Granted JPS60251294A (ja) | 1984-05-28 | 1984-05-28 | ニッケルめっき装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60251294A (ru) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8911566D0 (en) * | 1989-05-19 | 1989-07-05 | Sun Ind Coatings | Plating system |
| JP4645114B2 (ja) * | 2004-09-22 | 2011-03-09 | 凸版印刷株式会社 | 配線基板の製造方法 |
| JP2009099548A (ja) * | 2007-09-26 | 2009-05-07 | Furukawa Electric Co Ltd:The | 可動接点用銀被覆複合材料およびその製造方法 |
| WO2009041481A1 (ja) * | 2007-09-26 | 2009-04-02 | The Furukawa Electric Co., Ltd. | 可動接点用銀被覆複合材料およびその製造方法 |
| JP4558823B2 (ja) * | 2007-09-26 | 2010-10-06 | 古河電気工業株式会社 | 可動接点用銀被覆複合材料およびその製造方法 |
| KR100922505B1 (ko) * | 2007-12-07 | 2009-10-21 | 한국과학기술원 | 니켈 도금액을 이용한 유연성을 가진 스탬프의 제조방법 |
| JP6180893B2 (ja) * | 2013-11-13 | 2017-08-16 | 矢崎総業株式会社 | メッキ装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948526A (ru) * | 1972-05-08 | 1974-05-10 | ||
| JPS58121375A (ja) * | 1982-01-09 | 1983-07-19 | Jitsuo Sakamoto | ガス漏れ遮断器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58121375U (ja) * | 1982-02-10 | 1983-08-18 | 上村工業株式会社 | 電気メツキ装置 |
-
1984
- 1984-05-28 JP JP10890684A patent/JPS60251294A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948526A (ru) * | 1972-05-08 | 1974-05-10 | ||
| JPS58121375A (ja) * | 1982-01-09 | 1983-07-19 | Jitsuo Sakamoto | ガス漏れ遮断器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60251294A (ja) | 1985-12-11 |
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