JPH0422976Y2 - - Google Patents
Info
- Publication number
- JPH0422976Y2 JPH0422976Y2 JP1987142771U JP14277187U JPH0422976Y2 JP H0422976 Y2 JPH0422976 Y2 JP H0422976Y2 JP 1987142771 U JP1987142771 U JP 1987142771U JP 14277187 U JP14277187 U JP 14277187U JP H0422976 Y2 JPH0422976 Y2 JP H0422976Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- reciprocating sliding
- servo motor
- sliding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 82
- 239000011347 resin Substances 0.000 claims description 82
- 230000007246 mechanism Effects 0.000 claims description 74
- 239000004065 semiconductor Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 description 36
- 238000000465 moulding Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 15
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001879 gelation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987142771U JPH0422976Y2 (US20100268047A1-20101021-C00003.png) | 1987-09-17 | 1987-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987142771U JPH0422976Y2 (US20100268047A1-20101021-C00003.png) | 1987-09-17 | 1987-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6446209U JPS6446209U (US20100268047A1-20101021-C00003.png) | 1989-03-22 |
| JPH0422976Y2 true JPH0422976Y2 (US20100268047A1-20101021-C00003.png) | 1992-05-27 |
Family
ID=31409000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987142771U Expired JPH0422976Y2 (US20100268047A1-20101021-C00003.png) | 1987-09-17 | 1987-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422976Y2 (US20100268047A1-20101021-C00003.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61242795A (ja) * | 1985-04-22 | 1986-10-29 | Mitsubishi Electric Corp | 加圧プレス制御装置 |
-
1987
- 1987-09-17 JP JP1987142771U patent/JPH0422976Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61242795A (ja) * | 1985-04-22 | 1986-10-29 | Mitsubishi Electric Corp | 加圧プレス制御装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6446209U (US20100268047A1-20101021-C00003.png) | 1989-03-22 |
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