JPH0422961Y2 - - Google Patents
Info
- Publication number
- JPH0422961Y2 JPH0422961Y2 JP8623686U JP8623686U JPH0422961Y2 JP H0422961 Y2 JPH0422961 Y2 JP H0422961Y2 JP 8623686 U JP8623686 U JP 8623686U JP 8623686 U JP8623686 U JP 8623686U JP H0422961 Y2 JPH0422961 Y2 JP H0422961Y2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- brazed
- chip
- agent
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000010953 base metal Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- TZHYBRCGYCPGBQ-UHFFFAOYSA-N [B].[N] Chemical compound [B].[N] TZHYBRCGYCPGBQ-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Harvester Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8623686U JPH0422961Y2 (de) | 1986-06-06 | 1986-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8623686U JPH0422961Y2 (de) | 1986-06-06 | 1986-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199303U JPS62199303U (de) | 1987-12-18 |
| JPH0422961Y2 true JPH0422961Y2 (de) | 1992-05-27 |
Family
ID=30942362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8623686U Expired JPH0422961Y2 (de) | 1986-06-06 | 1986-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422961Y2 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5582386B2 (ja) * | 2010-02-17 | 2014-09-03 | 株式会社トリガー | チップソー及びその製造方法 |
-
1986
- 1986-06-06 JP JP8623686U patent/JPH0422961Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62199303U (de) | 1987-12-18 |
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