JPH04206480A - Surface fitting terminal for printed wiring board with surface circuit - Google Patents
Surface fitting terminal for printed wiring board with surface circuitInfo
- Publication number
- JPH04206480A JPH04206480A JP2339362A JP33936290A JPH04206480A JP H04206480 A JPH04206480 A JP H04206480A JP 2339362 A JP2339362 A JP 2339362A JP 33936290 A JP33936290 A JP 33936290A JP H04206480 A JPH04206480 A JP H04206480A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- terminal
- fitting terminal
- surface fitting
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 43
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 102100025490 Slit homolog 1 protein Human genes 0.000 abstract 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、表面回路付印刷配線板に装着される表面実
装用端子に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a surface mounting terminal mounted on a printed wiring board with a surface circuit.
〈従来の技術〉
通常、表面実装用端子のピッチが小さく、かつ多ピンの
ＱＦＰ （Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）
を実装する際の表面実装用端子形状は、表面実装部品の
リード線幅や接触部の寸法等により決定されるのが一般
的である。<Conventional technology> QFP (Quad Flat Package) usually has a small pitch of surface mounting terminals and a large number of pins.
The shape of the terminal for surface mounting when mounting is generally determined by the width of the lead wire of the surface mount component, the dimensions of the contact portion, etc.
したがって、はんたの流動性をも考慮したパターン形状
ではなく、はんたの流れ防止としては、はんだブリッジ
も防止できるツルターレジストを使用しているのが現状
である。Therefore, instead of creating a pattern shape that takes into account the fluidity of the solder, the current situation is to use a sulter resist that can also prevent solder bridging to prevent solder flow.
〈発明が解決しようとする課題〉
このように、従来ては表面実装用端子からのはんだの流
動を防止するために、第５図に示すように、ソルダーレ
ジスト１か必要となる。そのため、表面実装部品の実装
密度にかかわらすソルダーレジス）・１の必要性か生じ
、高密度界でなくてもコスト高になる。<Problems to be Solved by the Invention> As described above, conventionally, a solder resist 1 is required as shown in FIG. 5 in order to prevent solder from flowing from the surface mounting terminal. Therefore, a solder resist (1) is required regardless of the mounting density of surface-mounted components, resulting in high costs even in a non-high-density field.
さらに、ソルダーレジスト１を必要とする部分の表面実
装用端子２の形状、特にパターン間隔や表面実装用端子
２の導体厚みによりソルダーレジスト１の塗布面積が増
減し、ソルダーレジスト１のシワや剥離が生じる可能性
かあり、このソルダーレジスト１の剥離が生じた場合、
第６図に示すように、ソルダーレジス１〜１か表面実装
用端子２」二に飛び散り、表面実装部品との接続信頼性
が低下する要因ともなり得る。Furthermore, the application area of the solder resist 1 increases or decreases depending on the shape of the surface mount terminal 2 in the area where the solder resist 1 is required, especially the pattern spacing and the conductor thickness of the surface mount terminal 2, which may cause wrinkles or peeling of the solder resist 1. There is a possibility that this may occur, and if this solder resist 1 peels off,
As shown in FIG. 6, the solder resists 1 to 1 or the surface mount terminals 2'' may be scattered, which may cause a decrease in the connection reliability with the surface mount components.
さらに、今後高密度化が進むにつれて、表面信号ライン
の幅か０．１０ｍｍになった場合、ソルダーレジス）・
の密着性を高めるための表面研磨（実装端子」二や絶縁
層を荒らす）が必要となるため、表面信号ラインの断線
や欠は等の発生要因ともなる。Furthermore, as density increases in the future, if the width of the surface signal line becomes 0.10 mm, solder resist)
Surface polishing (which roughens the mounting terminals and insulating layer) is required to improve the adhesion of the surface signal line, which may cause disconnections or chips in the surface signal line.
さらに、前述したようなφ０．１０ｍｍ程度の表面信号
ラインを有する実装用端子は、端子ピッチか極めて小さ
くなり、実装用端子上へのはんだ量を増加させるための
ペーストはんだ印刷がブリッジの発生により不可能とな
り、一般的に基板製造」二で施されるはんためつきのみ
のはんだ量で表面実装を行なわなければならなくなる。Furthermore, the pitch of the mounting terminals having a surface signal line of about 0.10 mm in diameter as described above is extremely small, and paste solder printing to increase the amount of solder on the mounting terminals is not possible due to the occurrence of bridging. This makes it possible to perform surface mounting using only the amount of solder that is generally applied during board manufacturing.
本発明は、このような事情に鑑みてなされたもので、本
発明の目的とするところは、ソルダーレジストによるは
んた流れ防止てはなく、表面実装用端子の形状により、
はんた流れを防止できる表面回路付印刷配線板における
表面実装用端子を提供することにある。The present invention was made in view of the above circumstances, and the purpose of the present invention is not to prevent solder flow by using a solder resist, but to prevent solder from flowing due to the shape of a surface mounting terminal.
An object of the present invention is to provide a terminal for surface mounting on a printed wiring board with a surface circuit that can prevent solder flow.
〈課題を解決するための１段〉
」二記ロ的を達成するために、本発明は、表面に銅箔と
めっきにより形成される表面回路ｆ＝１印刷配線板に実
装される表面実装端子であって、この表面実装端子には
、熱伝導を妨げる放熱用スリットあるいは放熱用くびれ
部か形成されていることを特徴とする。<First Step for Solving the Problem> In order to achieve the second objective, the present invention provides a surface mount terminal mounted on a surface circuit f=1 printed wiring board formed on the surface by copper foil and plating. This surface mount terminal is characterized in that a heat dissipation slit or a heat dissipation constriction that prevents heat conduction is formed.
〈作用〉
以上の構成から明らかなように、表面実装用端子に熱伝
導を妨げる放熱用スリットあるいは放熱用くびれ部を設
定したため、従来の形状の表面実装用端子に比べ、熱伝
導量を小さく制御でき、このことにより、実装用端子部
のはんだ流れが少なくなり、実装用端子部上のはんた量
の確保ができ−る。<Function> As is clear from the above configuration, the surface mount terminal has a heat dissipation slit or heat dissipation constriction that prevents heat conduction, so the amount of heat conduction can be controlled to be smaller than that of the conventionally shaped surface mount terminal. As a result, the flow of solder on the mounting terminal portion is reduced, and the amount of solder on the mounting terminal portion can be secured.
〈実施例〉
以下、本発明における表面回路イー１印刷配線板におけ
る表面実装用端子の実施例について、添付図面を参照し
ながら詳細に説明する。<Example> Hereinafter, an example of the surface mounting terminal on the surface circuit E1 printed wiring board according to the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明による表面実装用端子を示す平面図、第
２図ないし第３図は本発明の別実施例を示す表面実装用
端ｒ・の各平面図、第４図は第１実施例の表面実装用端
子の熱伝導状態を示す説明図である。FIG. 1 is a plan view showing a surface mount terminal according to the present invention, FIGS. 2 and 3 are plan views of a surface mount terminal according to another embodiment of the present invention, and FIG. 4 is a plan view of a surface mount terminal according to the first embodiment. FIG. 3 is an explanatory diagram showing a heat conduction state of an example surface mounting terminal.
第１図において、表面実装用端子１０には、ピンホール
程度の放熱用スリット１１か開設されている。In FIG. 1, a heat dissipation slit 11 of the size of a pinhole is formed in a surface mounting terminal 10.
そして、この放熱用スリット１１により、表面実装用端
子１０の熱伝導度を妨げる結果となり、表面実装端子上
へのはんだ量を十分に確保できることになり、表面実装
時の不具合を有効に防止できる。The heat dissipation slits 11 impede the thermal conductivity of the surface mounting terminals 10, ensuring a sufficient amount of solder on the surface mounting terminals, and effectively preventing problems during surface mounting.
このように、本発明によれは、表面実装端子１０上のは
んた♀確保のために、ペーストはんだ印刷後の加熱によ
り発生するはんだの流動性を、上記実装用端子１０に放
熱用スリット１１を設けることにより制御でき、表面実
装用端子１０」二へのはんだ量を十分に確保でき、表面
実装時の不具合を有効に防止できる。As described above, according to the present invention, in order to secure the solder on the surface mount terminal 10, the fluidity of the solder generated by heating after printing the paste solder is transferred to the heat dissipation slit 11 in the mounting terminal 10. It is possible to control this by providing a sufficient amount of solder to the surface mounting terminal 10'2, and it is possible to effectively prevent problems during surface mounting.
なお、第２図に示すように、放熱用スリット１１を実装
用端子１０の２箇所に開設してもよい。Note that, as shown in FIG. 2, the heat dissipation slits 11 may be provided at two locations in the mounting terminal 10.
次いで、第３図は本発明による表面実装用端子２０の別
実施例を示すもので、この実装用端子２０の両側には放
熱用くびれ部２１が形成されており、この放熱用くびれ
部２１を通して外部に熱が拡散されるため、熱伝導を妨
げることかでき、上述実施例同様、表面実装用端子２０
」二へのはんだ量を十分に確保てきる。Next, FIG. 3 shows another embodiment of the surface mounting terminal 20 according to the present invention, in which a heat dissipating constriction 21 is formed on both sides of the mounting terminal 20, and a heat dissipating constriction 21 is formed through the heat dissipating constriction 21. Since heat is diffused to the outside, heat conduction can be hindered, and as in the above embodiment, the surface mounting terminal 20
” Make sure you have enough solder for the second part.
第４図は、第１図に示す実施例の表面実装用端子１０に
おける熱伝導状態を説明したもので、放熱用スリット１
１により、熱電導か妨げられることか明らかである。FIG. 4 explains the state of heat conduction in the surface mounting terminal 10 of the embodiment shown in FIG.
1, it is clear that thermal conduction is hindered.
〈発明の効果〉
以上説明した通り、本発明による表面回路付印刷配線板
における表面実装用端子は、熱伝導を妨げる放熱用スリ
ットあるいは放熱用くびれ部を形成することにより、ソ
ルダーレジストによるはんだ流れ防止ではなく、表面実
装用端子の形状によりはんだ流れを防止することができ
、実装端子上のはんだ量の確保か有効に行なえるという
効果がある。<Effects of the Invention> As explained above, the surface mounting terminal in the printed wiring board with surface circuit according to the present invention prevents solder flow by the solder resist by forming a heat dissipation slit or a heat dissipation constriction that prevents heat conduction. Rather, it is possible to prevent solder flow due to the shape of the surface mounting terminal, and the amount of solder on the mounting terminal can be effectively ensured.
さらに、今後の高密変化において、表面実装用端子の小
ピツチ化、多ピン化か進み、ペーストはんだによるはん
だ量の確保が困難な状況においても、はんだ量の確保と
同時に、はんだブリッジも有効に防止できるという効果
を有する。Furthermore, as the density of surface mount terminals increases in the future, the pitch of surface mount terminals will become smaller and the number of pins will increase, and even in situations where it is difficult to secure the amount of solder using paste solder, it will be possible to secure the amount of solder and at the same time effectively prevent solder bridging. It has the effect of being able to.
第１図は本発明の第１実施例である表面実装用端子を示
す平面図、第２図、第３図は本発明の表面実装用端子の
別実施例を示す各平面図、第４図は本発明による表面実
装用端子における熱伝導状態を示す説明図、第５図は従
来のはんだ流れ防止構造を示す説明図、第６図はソルダ
ーレジスト方法の不具合を示す説明図である。
１０．２０・・・表面実装用端子
１１・・・放熱用スリットFIG. 1 is a plan view showing a surface mount terminal according to a first embodiment of the present invention, FIGS. 2 and 3 are plan views showing another embodiment of a surface mount terminal according to the present invention, and FIG. FIG. 5 is an explanatory diagram showing a state of heat conduction in a surface mounting terminal according to the present invention, FIG. 5 is an explanatory diagram showing a conventional solder flow prevention structure, and FIG. 6 is an explanatory diagram showing a problem with the solder resist method. 10.20...Surface mounting terminal 11...Slit for heat radiation
Claims (1)
刷配線板に実装される表面実装端子であって、この表面
実装端子には、熱伝導を妨げる放熱用スリットあるいは
放熱用くびれ部が形成されていることを特徴とする表面
回路付印刷配線板における表面実装用端子。1. A surface mount terminal mounted on a printed wiring board with a surface circuit formed by copper foil and plating on the surface, and this surface mount terminal has a heat dissipation slit or heat dissipation constriction that prevents heat conduction. A terminal for surface mounting on a printed wiring board with a surface circuit, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339362A JPH04206480A (en) | 1990-11-30 | 1990-11-30 | Surface fitting terminal for printed wiring board with surface circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339362A JPH04206480A (en) | 1990-11-30 | 1990-11-30 | Surface fitting terminal for printed wiring board with surface circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04206480A true JPH04206480A (en) | 1992-07-28 |
Family
ID=18326749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2339362A Pending JPH04206480A (en) | 1990-11-30 | 1990-11-30 | Surface fitting terminal for printed wiring board with surface circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04206480A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0922635A (en) * | 1995-07-05 | 1997-01-21 | Hokuriku Electric Ind Co Ltd | Push switch |
| WO1998033365A1 (en) * | 1997-01-28 | 1998-07-30 | Telefonaktiebolaget Lm Ericsson (Publ) | A circuit board assembly having surface-mount radio frequency components |
| WO1999059387A1 (en) * | 1998-05-08 | 1999-11-18 | Nokia Networks Oy | A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| JP2007324407A (en) * | 2006-06-01 | 2007-12-13 | Mitsubishi Electric Corp | Optical module |
-
1990
- 1990-11-30 JP JP2339362A patent/JPH04206480A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0922635A (en) * | 1995-07-05 | 1997-01-21 | Hokuriku Electric Ind Co Ltd | Push switch |
| WO1998033365A1 (en) * | 1997-01-28 | 1998-07-30 | Telefonaktiebolaget Lm Ericsson (Publ) | A circuit board assembly having surface-mount radio frequency components |
| WO1999059387A1 (en) * | 1998-05-08 | 1999-11-18 | Nokia Networks Oy | A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| JP2007324407A (en) * | 2006-06-01 | 2007-12-13 | Mitsubishi Electric Corp | Optical module |
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