JPH0420257U - - Google Patents
Info
- Publication number
- JPH0420257U JPH0420257U JP6046190U JP6046190U JPH0420257U JP H0420257 U JPH0420257 U JP H0420257U JP 6046190 U JP6046190 U JP 6046190U JP 6046190 U JP6046190 U JP 6046190U JP H0420257 U JPH0420257 U JP H0420257U
- Authority
- JP
- Japan
- Prior art keywords
- rigid multilayer
- wiring board
- circuit wiring
- flexibility
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は、考案明の一実施例の一部破断斜視図
で、第２図は、同他の回路配線板に接続した状態
を示す斜視図である。
１１，１２，１３，１４，１５，１６，１７…
…パターン化された銅層が両面に形成されたガラ
スエポキシ板、２１，２２，２３，２４……スル
ーホール、３１……剛性多層部、４１……可撓性
部、５１，５２……表面露出部、６１，６２……
端子部、７１……その他の回路配線板。
FIG. 1 is a partially cutaway perspective view of an embodiment of the invention, and FIG. 2 is a perspective view showing the state connected to another circuit wiring board. 11, 12, 13, 14, 15, 16, 17...
...Glass epoxy plate with patterned copper layers formed on both sides, 21, 22, 23, 24...Through hole, 31...Rigid multilayer part, 41...Flexible part, 51, 52...Surface Exposed part, 61, 62...
Terminal section, 71...Other circuit wiring board.
Claims (1)
、前記剛性多層部の一部が延設された可撓性部と
により構成されている回路配線板。 A circuit wiring board comprising a rigid multilayer part with almost no flexibility and a flexible part in which a part of the rigid multilayer part extends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6046190U JPH0420257U (en) | 1990-06-07 | 1990-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6046190U JPH0420257U (en) | 1990-06-07 | 1990-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420257U true JPH0420257U (en) | 1992-02-20 |
Family
ID=31587845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6046190U Pending JPH0420257U (en) | 1990-06-07 | 1990-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420257U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064468A1 (en) * | 2003-01-09 | 2004-07-29 | Sony Chemicals Corp. | Board piece, composite wiring board using the board piece, and openable/closable device |
-
1990
- 1990-06-07 JP JP6046190U patent/JPH0420257U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064468A1 (en) * | 2003-01-09 | 2004-07-29 | Sony Chemicals Corp. | Board piece, composite wiring board using the board piece, and openable/closable device |