JPH0419798Y2 - - Google Patents
Info
- Publication number
- JPH0419798Y2 JPH0419798Y2 JP1986043982U JP4398286U JPH0419798Y2 JP H0419798 Y2 JPH0419798 Y2 JP H0419798Y2 JP 1986043982 U JP1986043982 U JP 1986043982U JP 4398286 U JP4398286 U JP 4398286U JP H0419798 Y2 JPH0419798 Y2 JP H0419798Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin part
- semiconductor device
- board
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986043982U JPH0419798Y2 (US07860544-20101228-C00003.png) | 1986-03-27 | 1986-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986043982U JPH0419798Y2 (US07860544-20101228-C00003.png) | 1986-03-27 | 1986-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62157155U JPS62157155U (US07860544-20101228-C00003.png) | 1987-10-06 |
| JPH0419798Y2 true JPH0419798Y2 (US07860544-20101228-C00003.png) | 1992-05-06 |
Family
ID=30861359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986043982U Expired JPH0419798Y2 (US07860544-20101228-C00003.png) | 1986-03-27 | 1986-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419798Y2 (US07860544-20101228-C00003.png) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083249U (ja) * | 1983-11-15 | 1985-06-08 | 松下電器産業株式会社 | 集積回路部品 |
-
1986
- 1986-03-27 JP JP1986043982U patent/JPH0419798Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62157155U (US07860544-20101228-C00003.png) | 1987-10-06 |
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