JPH0419704B2 - - Google Patents
Info
- Publication number
- JPH0419704B2 JPH0419704B2 JP57000432A JP43282A JPH0419704B2 JP H0419704 B2 JPH0419704 B2 JP H0419704B2 JP 57000432 A JP57000432 A JP 57000432A JP 43282 A JP43282 A JP 43282A JP H0419704 B2 JPH0419704 B2 JP H0419704B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- photoresist
- layer
- opening
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 102
- 238000000034 method Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 23
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 33
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910014033 C-OH Inorganic materials 0.000 description 1
- 229910014570 C—OH Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP43282A JPS58118117A (ja) | 1982-01-06 | 1982-01-06 | パタン状厚膜の形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP43282A JPS58118117A (ja) | 1982-01-06 | 1982-01-06 | パタン状厚膜の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58118117A JPS58118117A (ja) | 1983-07-14 |
JPH0419704B2 true JPH0419704B2 (zh) | 1992-03-31 |
Family
ID=11473647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP43282A Granted JPS58118117A (ja) | 1982-01-06 | 1982-01-06 | パタン状厚膜の形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58118117A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6001302B2 (ja) * | 2012-04-06 | 2016-10-05 | Jx金属株式会社 | スポットめっき装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5623746A (en) * | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
-
1982
- 1982-01-06 JP JP43282A patent/JPS58118117A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5623746A (en) * | 1979-08-01 | 1981-03-06 | Matsushita Electronics Corp | Manufacture of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS58118117A (ja) | 1983-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4597826A (en) | Method for forming patterns | |
JPS6323657B2 (zh) | ||
US4413051A (en) | Method for providing high resolution, highly defined, thick film patterns | |
US4278710A (en) | Apparatus and method for submicron pattern generation | |
US6797963B2 (en) | Deflector of a micro-column electron beam apparatus and method for fabricating the same | |
JPH0419704B2 (zh) | ||
US7354699B2 (en) | Method for producing alignment mark | |
US3673018A (en) | Method of fabrication of photomasks | |
JPH0458167B2 (zh) | ||
JPS588129B2 (ja) | 放射感応層をx線に露出する方法 | |
JPH04284620A (ja) | 半導体装置の製造方法 | |
JPH01128522A (ja) | レジストパターンの形成方法 | |
JPS5857908B2 (ja) | 薄膜構造体の形成方法 | |
JPS63307739A (ja) | 半導体装置の製造方法 | |
JP2752022B2 (ja) | 微細パターン形成方法 | |
JPS5934632A (ja) | X線マスクの製造方法 | |
JPS59103343A (ja) | 半導体装置の製造方法 | |
JPH01216525A (ja) | 半導体装置のパターン形成方法 | |
JP2000150419A (ja) | 金属膜の堆積方法、配線パターンの形成方法及び配線パターンの構造 | |
JPH01304457A (ja) | パターン形成方法 | |
US20060105550A1 (en) | Method of depositing material on a substrate for a device | |
JPS6081830A (ja) | アルミニウム膜のテ−パ−エツチング方法 | |
JPS60231331A (ja) | リフトオフ・パタ−ンの形成方法 | |
JPS60224286A (ja) | トンネル接合型ジヨセフソン素子の製法 | |
JPH07273113A (ja) | リフトオフプロセスパターン形成方法 |