JPH0419554B2 - - Google Patents

Info

Publication number

JPH0419554B2

JPH0419554B2 JP13242884A JP13242884A JPH0419554B2 JP H0419554 B2 JPH0419554 B2 JP H0419554B2 JP 13242884 A JP13242884 A JP 13242884A JP 13242884 A JP13242884 A JP 13242884A JP H0419554 B2 JPH0419554 B2 JP H0419554B2

Authority

JP

Japan

Prior art keywords

layer

electrode

thin film

glass substrate

transparent

Prior art date

1984-06-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000010409 thin film Substances 0.000 claims description 33
• 239000011521 glass Substances 0.000 claims description 20
• 239000000758 substrate Substances 0.000 claims description 18
• 239000006059 cover glass Substances 0.000 claims description 12
• 238000010030 laminating Methods 0.000 claims description 3
• 239000010410 layer Substances 0.000 description 51
• 239000000853 adhesive Substances 0.000 description 7
• 230000001070 adhesive effect Effects 0.000 description 7
• 239000010408 film Substances 0.000 description 7
• 229910000679 solder Inorganic materials 0.000 description 6
• 239000012530 fluid Substances 0.000 description 5
• 230000001681 protective effect Effects 0.000 description 5
• 230000005684 electric field Effects 0.000 description 4
• 230000000694 effects Effects 0.000 description 3
• 238000005566 electron beam evaporation Methods 0.000 description 3
• 238000004519 manufacturing process Methods 0.000 description 3
• 239000011347 resin Substances 0.000 description 3
• 229920005989 resin Polymers 0.000 description 3
• -1 Si 3 N 4 Inorganic materials 0.000 description 2
• 239000004020 conductor Substances 0.000 description 2
• 239000000470 constituent Substances 0.000 description 2
• 230000005283 ground state Effects 0.000 description 2
• 238000002347 injection Methods 0.000 description 2
• 239000007924 injection Substances 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• 239000011159 matrix material Substances 0.000 description 2
• 239000008188 pellet Substances 0.000 description 2
• 230000035699 permeability Effects 0.000 description 2
• 229920002545 silicone oil Polymers 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 238000004544 sputter deposition Methods 0.000 description 2
• 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000004698 Polyethylene Substances 0.000 description 1
• 229910004298 SiO 2 Inorganic materials 0.000 description 1
• 229910006404 SnO 2 Inorganic materials 0.000 description 1
• 239000013543 active substance Substances 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 230000015556 catabolic process Effects 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000007547 defect Effects 0.000 description 1
• 230000032798 delamination Effects 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 230000008021 deposition Effects 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 239000004519 grease Substances 0.000 description 1
• 230000017525 heat dissipation Effects 0.000 description 1
• 230000020169 heat generation Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229920000573 polyethylene Polymers 0.000 description 1
• SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 239000002356 single layer Substances 0.000 description 1
• 230000003685 thermal hair damage Effects 0.000 description 1