JPH0419319B2 - - Google Patents
Info
- Publication number
- JPH0419319B2 JPH0419319B2 JP19128983A JP19128983A JPH0419319B2 JP H0419319 B2 JPH0419319 B2 JP H0419319B2 JP 19128983 A JP19128983 A JP 19128983A JP 19128983 A JP19128983 A JP 19128983A JP H0419319 B2 JPH0419319 B2 JP H0419319B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- parts
- insulating film
- plated
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 229920001971 elastomer Polymers 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical group NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- -1 urethane acrylic Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Punching Or Piercing (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19128983A JPS6082689A (ja) | 1983-10-13 | 1983-10-13 | 部分鍍金法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19128983A JPS6082689A (ja) | 1983-10-13 | 1983-10-13 | 部分鍍金法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6082689A JPS6082689A (ja) | 1985-05-10 |
| JPH0419319B2 true JPH0419319B2 (hu) | 1992-03-30 |
Family
ID=16272083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19128983A Granted JPS6082689A (ja) | 1983-10-13 | 1983-10-13 | 部分鍍金法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6082689A (hu) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003105512A (ja) * | 2001-09-26 | 2003-04-09 | Honda Motor Co Ltd | 車体パネル用亜鉛鋼板の製造方法 |
-
1983
- 1983-10-13 JP JP19128983A patent/JPS6082689A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6082689A (ja) | 1985-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4024631A (en) | Printed circuit board plating process | |
| EP0778618A3 (en) | Lead frame and method for manufacturing it | |
| EP0391314A3 (de) | Verfahren zur Herstellung eines Musters auf einem Träger | |
| CA2047502C (en) | Selectively plating electrically conductive pin | |
| DE19628264A1 (de) | Verfahren zum Bilden eines Leitermusters und Verfahren zum Herstellen einer Leiterplatte | |
| JPH0419319B2 (hu) | ||
| DE1446214A1 (de) | Verfahren zum Aufbringen von metallischen UEberzuegen auf Dielektrika | |
| US5766674A (en) | Method of producing a printed wiring board | |
| MY108081A (en) | Anode for chromium plating and processes for producing and using the same. | |
| JPS5718342A (en) | Manufacture of lead frame | |
| US3179575A (en) | Method of producing silver layer on non-metallic electrically non-conductive support | |
| DE19631565A1 (de) | Verfahren zum Herstellen von Palladiumkontaktbumps auf Halbleiterschaltungsträgern | |
| KR100243369B1 (ko) | 연속적인 리드프레임 제조방법 | |
| KR100243373B1 (ko) | 리드 프레임 제조방법 | |
| US20080230926A1 (en) | Surface Treatments for Contact Pads Used in Semiconductor Chip Packagages and Methods of Providing Such Surface Treatments | |
| JP3655029B2 (ja) | 電着レジスト皮膜の露光方法 | |
| RU2114522C1 (ru) | Способ изготовления печатных плат | |
| DE19820345C2 (de) | Verfahren zum selektiven galvanischen Aufbringen von Lotdepots auf Leiterplatten | |
| JP3191686B2 (ja) | 印刷配線板の製造方法 | |
| KR100250151B1 (ko) | 반도체 리드프레임의 제조방법 | |
| DE3719219A1 (de) | Verfahren zur herstellung einer leiterplatte | |
| EP0386709A2 (de) | Edelmetallfreie Chipleiterbrücke und Verfahren zu ihrer Herstellung | |
| JPS6335780A (ja) | 貴金属メツキ方法 | |
| JPH0846113A (ja) | 部分メッキされた半導体用リードフレームの形成方法 | |
| CA2040482A1 (en) | Photosensitive resin composition and method of forming conductive pattern |