JPS5718342A - Manufacture of lead frame - Google Patents

Manufacture of lead frame

Info

Publication number
JPS5718342A
JPS5718342A JP9266580A JP9266580A JPS5718342A JP S5718342 A JPS5718342 A JP S5718342A JP 9266580 A JP9266580 A JP 9266580A JP 9266580 A JP9266580 A JP 9266580A JP S5718342 A JPS5718342 A JP S5718342A
Authority
JP
Japan
Prior art keywords
parts
lead wires
metal ribbon
press
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9266580A
Other languages
Japanese (ja)
Other versions
JPS6050349B2 (en
Inventor
Seiichi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP9266580A priority Critical patent/JPS6050349B2/en
Publication of JPS5718342A publication Critical patent/JPS5718342A/en
Publication of JPS6050349B2 publication Critical patent/JPS6050349B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To manufacture a lead frame having favorable quality by a method wherein after tin plating is performed on a metal ribbon being performed with a press to form outside lead wires masking the part other then the outside lead wire parts as to expose the parts thereof, the mask is removed and inside lead wires and element loading parts are formed on the removed part. CONSTITUTION:The metal ribbon 1 is punched with the press to provide plural openings 2(a)-3(a)-, and the outside lead wires 4 and connecting bars 5 are formed. Then precious metal plating is performed on a programed region 7 of the metal ribbon 1 to form connector wire connecting parts and semiconductor element loading parts. A masking resin 8 is coated on the precious metal plated part 7, and the exposing outside lead wire parts 9 are plated with tin or a tin alloy. The masking resin is removed and the metal ribbon 1 is processed again with the press to form plural inside lead wires containing the connector connecting parts and the semiconductor element loading parts. Accordingly the lead frame being performed with plating treatment having favorable quality can be manufactured efficiently and economically.
JP9266580A 1980-07-09 1980-07-09 Lead frame manufacturing method Expired JPS6050349B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9266580A JPS6050349B2 (en) 1980-07-09 1980-07-09 Lead frame manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9266580A JPS6050349B2 (en) 1980-07-09 1980-07-09 Lead frame manufacturing method

Publications (2)

Publication Number Publication Date
JPS5718342A true JPS5718342A (en) 1982-01-30
JPS6050349B2 JPS6050349B2 (en) 1985-11-08

Family

ID=14060765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9266580A Expired JPS6050349B2 (en) 1980-07-09 1980-07-09 Lead frame manufacturing method

Country Status (1)

Country Link
JP (1) JPS6050349B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925257A (en) * 1982-07-30 1984-02-09 Shinko Electric Ind Co Ltd Manufacture of lead frame for low melting-point glass seal type semiconductor device
JPS62210659A (en) * 1986-03-11 1987-09-16 Mitsui Haitetsuku:Kk Manufacture of lead frame
JPS63148667A (en) * 1986-12-12 1988-06-21 Shinko Electric Ind Co Ltd Manufacture of lead frame
JPH03120047U (en) * 1990-03-22 1991-12-10
WO1994013015A1 (en) * 1992-11-24 1994-06-09 Hitachi Construction Machinery Co., Ltd. Lead frame manufacturing method
EP1406300A1 (en) * 2001-07-09 2004-04-07 Sumitomo Metal Mining Company Limited Lead frame and its manufacturing method
EP1854133A2 (en) * 2005-02-18 2007-11-14 Texas Instruments Incorporated Low cost, high volume lead frame production

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925257A (en) * 1982-07-30 1984-02-09 Shinko Electric Ind Co Ltd Manufacture of lead frame for low melting-point glass seal type semiconductor device
JPS62210659A (en) * 1986-03-11 1987-09-16 Mitsui Haitetsuku:Kk Manufacture of lead frame
JPS63148667A (en) * 1986-12-12 1988-06-21 Shinko Electric Ind Co Ltd Manufacture of lead frame
JPH03120047U (en) * 1990-03-22 1991-12-10
WO1994013015A1 (en) * 1992-11-24 1994-06-09 Hitachi Construction Machinery Co., Ltd. Lead frame manufacturing method
US5548890A (en) * 1992-11-24 1996-08-27 Hitachi Construction Machinery Co., Ltd. Lead frame processing method
EP1406300A1 (en) * 2001-07-09 2004-04-07 Sumitomo Metal Mining Company Limited Lead frame and its manufacturing method
EP1406300A4 (en) * 2001-07-09 2007-11-21 Sumitomo Metal Mining Co Lead frame and its manufacturing method
US7521295B2 (en) 2001-07-09 2009-04-21 Sumitomo Metal Mining Co., Ltd. Leadframe and method of manufacturing the same
EP2312630A1 (en) * 2001-07-09 2011-04-20 Sumitomo Metal Mining Company Limited Leadframe and method of manufacturing the same
EP1854133A2 (en) * 2005-02-18 2007-11-14 Texas Instruments Incorporated Low cost, high volume lead frame production
EP1854133A4 (en) * 2005-02-18 2011-09-07 Texas Instruments Inc Low cost, high volume lead frame production

Also Published As

Publication number Publication date
JPS6050349B2 (en) 1985-11-08

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