JPH04188623A - Protective film forming method - Google Patents
Protective film forming methodInfo
- Publication number
- JPH04188623A JPH04188623A JP31350490A JP31350490A JPH04188623A JP H04188623 A JPH04188623 A JP H04188623A JP 31350490 A JP31350490 A JP 31350490A JP 31350490 A JP31350490 A JP 31350490A JP H04188623 A JPH04188623 A JP H04188623A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- substrate
- vibrator
- film material
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000010408 film Substances 0.000 abstract description 59
- 239000002184 metal Substances 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000004299 exfoliation Methods 0.000 abstract 2
- -1 acryl Chemical group 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は 半導体素子、および液晶デイスプレィ用のカ
ラーフィルタ等において、基板上に形成した微細パター
ン上に平滑な面を作成するための保護膜の形成方法に関
するものであム
従来の技術
従来 保護膜の形成方法としては 以下の２つの形成方
法が主に用いられている。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for forming a protective film for creating a smooth surface on a fine pattern formed on a substrate in semiconductor devices, color filters for liquid crystal displays, etc. Conventional Technology The following two methods are mainly used to form a protective film.
先ず、第１の形成方法としてスピンコード法について説
明する。First, the spin code method will be explained as a first forming method.
第４図（ａ）に示すように微細パターン１を形成した基
板２上に保護膜材料３を滴下すも次へ 第４図（ｂ）に
示すようく この保護膜材料３を滴下した基板２をスピ
ンコータ４に設置し 回転することにより、保護膜表面
を平滑にすム
その後、第４図（ｃ）に示すよう？、：、ＵＶｗＡＩｔ
。As shown in FIG. 4(a), the protective film material 3 is dropped onto the substrate 2 on which the fine pattern 1 is formed, and then the next step is as shown in FIG. 4(b). The protective film is placed on the spin coater 4 and rotated to smooth the surface of the protective film, as shown in FIG. 4(c). , :, UVwAIt
.
ホットプレート５加熱等を用いて保護膜材料３を硬化す
ム
次に印刷法について説明すも
第５図（ａ）に示すように微細パターン１を形成した基
板２１Ｚ−保護膜材料３を付着させたローラ６を押し付
けて、保護膜材料３を微細パターン１上に塗布すム
その後、第５図（ｂ）に示すように ＵＶ照蝕ホットプ
レート５加熱等を用いて保護膜材料３を硬化す４
発明が解決しようとする課題
しかし このような保護膜の形成方法では以下のような
課題があった
微細パターン１の凹凸が形成された基板２上ｉミ上記方
法で保護膜材料３を塗布すると、保護膜材料３表面にも
１４に４図（ｅ）あるいは第５図（ｂ）に示すように凹
凸が生じる。The protective film material 3 is cured by heating the hot plate 5, etc. Next, the printing method will be explained. As shown in FIG. The protective film material 3 is applied onto the fine pattern 1 by pressing the roller 6. Thereafter, as shown in FIG. 4 Problems to be Solved by the Invention However, this method of forming a protective film has the following problems. When the protective film material 3 is applied by the above method on the substrate 2 on which the unevenness of the fine pattern 1 is formed, Also, the surface of the protective film material 3 has irregularities as shown in FIG. 4(e) or FIG. 5(b).
第６図に示すように この保護膜上に蒸着法等を用いて
金属薄膜７等を形成すると、保護膜材料３の凹凸のため
に膜厚のばらつき部Ａや段差部における割れ部Ｋ 剥離
部Ｃ等を生じも
このた八 保護膜上部に形成する薄膜の歩留りが低くな
るという問題があった
本発明は上記のような問題点を解決するたべ表面が平滑
な保護膜の形成方法を提供するものであム
課題を解決（るための手段
上記課題を解決するた八 本発明の保護膜の形成方法１
ｉ 基板上に形成されたパターンを保護するために前
記パターン士に形成する保護膜の形成方法であって、パ
ターン−Ｌに保護膜材料を塗布時、または塗布後、前記
基板を振動させる保護膜の形成方法であム
作 用
手段による作用
上記手段によれば 基板の加振によって基板に塗布した
保護膜材料の流動は促進され 基板上に形成された微細
パターンの凸部上に厚く付着している保護膜材料の一部
は微細パターンの凹部に供給されて、凹凸の無しく 平
泪な表面の保護膜が得られるのであム
実施例
以下、本発明の保護膜の形成方法をその実施例に基づい
て説明すも
第１図は本発明の保護膜の形成力法の一実施例における
工程説明図であム な耘 第４、５図で説明した従来例
の構成要素と同一機能の構成要素については同一番号を
付けて説明を省略する。As shown in FIG. 6, when a metal thin film 7, etc. is formed on this protective film using a vapor deposition method or the like, unevenness of the protective film material 3 causes variations in film thickness A, cracks K at stepped parts, and peeled parts. The present invention solves the above problems and provides a method for forming a protective film with a smooth surface. Means for Solving the Problems (Means for Solving the Problems) Eight Methods for Forming a Protective Film of the Present Invention 1
i A method for forming a protective film formed on the patterner to protect a pattern formed on a substrate, the protective film being vibrated during or after applying a protective film material to pattern-L. According to the above method, the vibration of the substrate promotes the flow of the protective film material applied to the substrate, causing it to thickly adhere to the convex portions of the fine pattern formed on the substrate. A portion of the protective film material is supplied to the concave portions of the fine pattern to obtain a protective film with a smooth surface without any unevenness. Fig. 1 is a process explanatory diagram of an embodiment of the protective film forming method of the present invention. Elements are given the same numbers and their explanations are omitted.
微細パターン１が形成された基板２上に保護膜１料３、
例えばＥＣＡを溶媒とするアクリル系樹脂を塗布する（
スピンコード法または印刷法による処理でもよい）。A protective film 1 material 3 is formed on a substrate 2 on which a fine pattern 1 is formed.
For example, apply acrylic resin using ECA as a solvent (
processing by a spin code method or a printing method).
その後、保護膜材料３を塗布した基板２を振動子として
の超音波振動子８上に設置し 振動子８を作動させも
この振動が基板２および微細パターン１に伝わり、粘性
の高い保護膜材料３でも流動し易くなもこのため微細パ
ターン１の凸部］、に存在する保護膜材料３の一部（よ
微細パターン１の凹部に供給され４
これにより段差の無（＼ 平滑な表面の保護膜が得られ
も
この後、ＵＶ照舷 ホットプレート５による加熱等を行
って保護膜材料３を硬化ずム
以上のようにして平滑な表面の保護膜を得ることができ
も
な耘 本実施例で（よ 振動子８を作動させ、保護膜材
料３を平滑にした後、ＵＶ’照舷 ホットプレート５に
よる加熱等を行（入 保護膜材料３を硬化した方丈 第
２図に示ずように振動子８を作動東ＵＶ照舷 ホット・
プレー ト５による加熱等を行ってよく、振動子の動作
時期と保護材料の硬化時期の関係は本実施例に限定され
るものではな（ちまた 本実施例で（よ 保護膜材料３
を塗布後、振動子８上に設置し 振動子８を作動させ、
保護膜材料３を平滑にした力＜、第２図（ａ）に示すよ
うに振動子ｓ上に基板２を設置し 保護膜材料３を塗布
時に 振動子８を作動させ、保護膜表面を平滑にしても
よく、保護材料３の塗布工程と振動子８の動作工程との
関係（よ 本実施例に限定されるものではな賎
第３図は本発明の保護膜の形成方法の他の実施例を具現
化した装置構成図であ４
な紅 第４、５図で説明した従来例の構成要素と同一機
能の構成要素については同一番号を付けて説明を省略す
る。After that, the substrate 2 coated with the protective film material 3 is placed on the ultrasonic vibrator 8 as a vibrator, and even when the vibrator 8 is operated, this vibration is transmitted to the substrate 2 and the fine pattern 1, and the highly viscous protective film material Therefore, a part of the protective film material 3 present in the convex portions of the fine pattern 1 is supplied to the concave portions of the fine pattern 1, so that there is no step (Protection of the smooth surface). Even if a film is obtained, it is not possible to obtain a protective film with a smooth surface by heating the protective film material 3 using a UV hot plate 5 or the like to harden it. After activating the vibrator 8 and smoothing the protective film material 3, heating etc. are performed using the UV hot plate 5. Activate transducer 8
Heating, etc., may be performed using the plate 5, and the relationship between the operating time of the vibrator and the hardening time of the protective material is not limited to this example.
After applying, place it on the vibrator 8, operate the vibrator 8,
The force that smoothed the protective film material 3 <, as shown in Figure 2 (a), the substrate 2 is placed on the vibrator s, and when the protective film material 3 is applied, the vibrator 8 is activated to smooth the surface of the protective film. The relationship between the process of applying the protective material 3 and the process of operating the vibrator 8 (the relationship between the process of applying the protective material 3 and the process of operating the vibrator 8) is not limited to this embodiment. Components having the same functions as the components of the conventional example explained in FIGS. 4 and 5 are given the same numbers and their explanations will be omitted.
微細パターン１が形成された基板２上に保護膜材料３を
塗布した後、テーブル９に設置する。After coating the protective film material 3 on the substrate 2 on which the fine pattern 1 is formed, the substrate 2 is placed on a table 9.
このテーブル９は振動系１０を具備していも振動子８は
テーブル９と棒１１を介して設置されていも 振動子８
を作動させると、この振動が棒１１、テーブル９という
媒介物を介して基板２および微細パターン１に伝わム
よって粘性の高い保護膜材料３でも流動し易くなり、微
細パターン１の凸部上に存在する保護膜材料３の一部は
微細パターン１の凹部に供給されも
これにより段差の無し＼ 平滑な表面の保護膜が得られ
も
この也 ＵＶ照触 ホットプレート５による加熱等を行
って保護膜材料３を硬化すム
以上のようにして平滑な表面の保護膜を得ることができ
も
な耘 本実施例で（よ 振動子８を作動させ、保護膜材
料３を平滑にしたａ ＵＶ照舷 ホットプレート５に
よる加熱等を行し＼ 保護膜材料３を硬化した力（振動
子８を作動東 ＵＶ照舷 ホットプレート５による加熱
等を行ってよく、本実施例に限定されるものではない。Even if this table 9 is equipped with a vibration system 10 or the vibrator 8 is installed via the table 9 and the rod 11, the vibrator 8
When activated, this vibration is transmitted to the substrate 2 and the fine pattern 1 through the rod 11 and the table 9, which makes it easier for even the highly viscous protective film material 3 to flow. A part of the existing protective film material 3 is supplied to the concave portion of the fine pattern 1, so that a protective film with a smooth surface without any steps is obtained. In this example, the vibrator 8 was activated and the protective film material 3 was smoothed by UV irradiation. Heating, etc. using the hot plate 5 may be performed to harden the protective film material 3 (the force that activates the vibrator 8).Heating, etc. using the hot plate 5 may be performed, and is not limited to this example. .
また、本実施例では、保護膜材料３を塗布後、基板２を
テーブル９に設置し、振動子８を作動させ保護膜材料３
を平滑にしたか、基板２をテーブル９に設置し、保護膜
材料３を塗布時に、振動子８を作動させ、保護膜表面を
平滑にしてもよく、本実施例に限定されるものではない
。Further, in this embodiment, after applying the protective film material 3, the substrate 2 is placed on the table 9, and the vibrator 8 is activated to apply the protective film material 3.
Alternatively, the substrate 2 may be placed on the table 9 and the vibrator 8 may be activated when applying the protective film material 3 to smooth the surface of the protective film, but this is not limited to this example. .
発明の効果
本発明の保護膜の形成方法によれば、平滑な表面の保護
膜が得られるので、保護膜上に形成する薄膜の膜厚のば
らつき、段差部での割れ、剥離等を防ぐことができる。Effects of the Invention According to the method for forming a protective film of the present invention, a protective film with a smooth surface can be obtained, thereby preventing variations in the thickness of the thin film formed on the protective film, cracking at stepped portions, peeling, etc. I can do it.
よって、製品の性能向上および低コスト化に多大な効果
を発揮する。Therefore, it is highly effective in improving product performance and reducing costs.
第１図、第２図は、本発明の保護膜の形成方法の実施例
を示す工程説明図、第３図は本発明の他の実施例を具現
化した装置構成図、第４図、第５図は従来の保護膜の形
成方法の工程説明図、第６図は従来の保護膜の形成方法
における課題の説明図であも
１・・・微細パターン、 ２・・・基板、 ３・・・保
護膜材料、４・・・スビンコー久 ５・・・ホットプレ
ート、 ６・・・ローラ、 ７・・・金属薄風 ８・・
・振動子、 ９・・・テーブル、１０・・・振動系 １
１・・・亀
代理人の氏名 弁理士 小鍜治 明 ほか２名ｌＩ ｌ
ｒ３
ＣＱ）
３保ｎＲＨ唇
第 ２ 図
（α）
３１νｎｓ社−
第 ３ｖ／Ｊ
／
ノ（Ｊ）Ｈｒ勢ｈｙｇ
第４図
（Ｉ２）
業 ５ 図
（ａ）
（ｂ） ’
Ｉｐｉ６ｆ！ｉｌｌ1 and 2 are process explanatory diagrams showing an embodiment of the method for forming a protective film of the present invention, FIG. 3 is a configuration diagram of an apparatus embodying another embodiment of the present invention, and FIGS. Figure 5 is a process explanatory diagram of the conventional method for forming a protective film, and Figure 6 is an explanatory diagram of the problems in the conventional method for forming a protective film.・Protective film material, 4... Subinkokyu 5... Hot plate, 6... Roller, 7... Metal thin wind 8...
・Vibrator, 9...Table, 10...Vibration system 1
1... Name of Kame's agent Patent attorney Akira Okaji and 2 others lI l
r3 CQ) 3ho nRH lip Fig. 2 (α) 31νns company - No. 3v/J / ノ (J) Hr force hyg Fig. 4 (I2) Work 5 Fig. (a) (b) 'Ipi6f! ill
Claims (2)
記パターン上に形成する保護膜の形成方法であって、パ
ターン上に保護膜材料を塗布時、または塗布後、前記基
板を振動させる保護膜の形成方法。(1) A method for forming a protective film on a pattern to protect the pattern formed on the substrate, the method comprising vibrating the substrate during or after applying the protective film material on the pattern. How to form a film.
記パターン上に形成する保護膜の形成方法であって、パ
ターン上に保護膜材料を塗布時、または塗布後、前記基
板に媒介物を介して接触させた振動子により前記基板を
振動させる保護膜の形成方法。(2) A method for forming a protective film on a pattern to protect the pattern formed on the substrate, wherein a medium is applied to the substrate during or after applying the protective film material on the pattern. A method for forming a protective film in which the substrate is vibrated by a vibrator brought into contact with the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31350490A JPH04188623A (en) | 1990-11-19 | 1990-11-19 | Protective film forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31350490A JPH04188623A (en) | 1990-11-19 | 1990-11-19 | Protective film forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04188623A true JPH04188623A (en) | 1992-07-07 |
Family
ID=18042110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31350490A Pending JPH04188623A (en) | 1990-11-19 | 1990-11-19 | Protective film forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04188623A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0654831A2 (en) * | 1993-11-18 | 1995-05-24 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing solar cell |
| JP2009049339A (en) * | 2007-08-23 | 2009-03-05 | Denso Corp | Method of manufacturing semiconductor device |
-
1990
- 1990-11-19 JP JP31350490A patent/JPH04188623A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0654831A2 (en) * | 1993-11-18 | 1995-05-24 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing solar cell |
| US5538903A (en) * | 1993-11-18 | 1996-07-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing solar cell |
| EP0654831A3 (en) * | 1993-11-18 | 1998-01-14 | Matsushita Battery Industrial Co Ltd | Method of manufacturing solar cell |
| JP2009049339A (en) * | 2007-08-23 | 2009-03-05 | Denso Corp | Method of manufacturing semiconductor device |
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