JPH0418743A - Inspecting device for flat pack ic - Google Patents

Inspecting device for flat pack ic

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Publication number
JPH0418743A
JPH0418743A JP12232790A JP12232790A JPH0418743A JP H0418743 A JPH0418743 A JP H0418743A JP 12232790 A JP12232790 A JP 12232790A JP 12232790 A JP12232790 A JP 12232790A JP H0418743 A JPH0418743 A JP H0418743A
Authority
JP
Japan
Prior art keywords
laser beam
flat pack
reflected
lead terminals
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12232790A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Nagatani
永谷 光弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP12232790A priority Critical patent/JPH0418743A/en
Publication of JPH0418743A publication Critical patent/JPH0418743A/en
Pending legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To decide go/no go of a flat pack IC on the basis of the shift of the IC in the case of reflection of a laser beam from lead terminals and the shift of the IC in the case of reflection of the laser beam from a laser beam reflective plate and to improve the accuracy of inspection by a method wherein the flat pack IC is corrected so that it is situated at a normal position and the laser beam is scanned while being spotted from an installed laser beam scanner. CONSTITUTION:A flat pack IC (B) is placed on the upper surface of a laser beam reflective plate 16 via a transparent plate 17. In the case a laser beam scanner A is moved at a constant speed along lead terminal rows while the peripheral parts of the IC, that is, the prescribed positions closer to the end parts of lead terminals a, a..., b, b..., are scanned with a laser beam L which is emitted from the scanner, a detection level of a reflected laser beam L' at the time when the beam L is reflected from the lead terminals, a detection level of a reflected laser beam L'' in the case the beam L passes through between the terminals (a) and (a) and is reflected by the plate 16 via the plate 17 and a time difference between the times when the levels are obtained are compared with design values which are previously stored in a laser displacement detecting device. Thereby, the reflection resolution of the laser beam is enhanced, the levitation of the lead terminals of the IC, the intervals between the lead terminals and the like can be grasped more accurately and a decision an go/no go of the IC becomes more correct.

Description

【発明の詳細な説明】 ゛、産業上の利用分野〉 プリン斗L(板上の所定位置へフラットパック<r f
at  packe)7c) I Cを自動実装するに
際し、該フラットパックICが自動実装するのに適した
状態にあるか否かを予め検査する為の装置に関するムの
である。
[Detailed description of the invention] ゛, Industrial application field〉 Pudding L (Flat pack to a predetermined position on a board <r f
This invention relates to a device for inspecting in advance whether or not a flat pack IC is in a state suitable for automatic mounting when an IC is automatically mounted.

〈従来の技術。<Conventional technology.

従来この種検査装置には第7図に示すようにXY力方向
移動するようにした吸着ノズル24によってフラッIへ
バックIC,Bを部品供給装置からカメラ22の直」二
位置へ移行し、蛍光灯21によって該ICを照射し、’
3Aカメラ22てフラッ1〜バックTCの状態を写し取
り、図示しない画(象処理装置によってリード端子のピ
ッチ、部品のセンターポイン1へ等を算出する。そして
リー1−の浮上(曲がりa’)については検出画面23
におけるフラジl−パックB′の状態からり−1・の短
いものて判断するようにした画像認識による手段がある
Conventionally, in this type of inspection apparatus, as shown in FIG. Irradiate the IC with the light 21,
The 3A camera 22 takes a picture of the state of the flap 1 to the back TC, and an image (not shown) is used to calculate the pitch of the lead terminals, the center point 1 of the component, etc., and the levitation of the flap 1 (bend a'). For detection screen 23
There is a means based on image recognition that determines whether the flange l-pack B' is short or not based on the condition of the flange l-pack B'.

又、第8図に示すようにX−)′方向へ移動するように
した吸着ノズル24に」;つてフラットパッククIC,
Bを部品供給装置からカメラの直上位置へ移行し、17
−ザビーム送受信装置Aの上方てX)′方向に該吸着ノ
ズル24を移動させて、該フラツl−パックIC,Bの
、1辺をレーザビームにて照射さゼ、該レーザビーノ\
の反射光を捉えて、フランI・パ・ツク■C力4辺に設
けたリード端子の高さ及び該フラットパッククICの移
動速度とにより、レーザ反射光の変位を波形に変換し、
リ−1・の端子間隔及びり−トグ)浮きく曲がり)を検
査するようにしたし−リ゛尤による1段等がある。
In addition, as shown in FIG. 8, a flat pack IC,
Move B from the parts supply device to the position directly above the camera, 17
-Move the suction nozzle 24 in the direction
Converts the displacement of the laser reflected light into a waveform using the height of the lead terminals provided on the four sides of the flat pack IC and the moving speed of the flat pack IC.
I inspected the terminal spacing of the lead (1) and the tog (lifting and bending).

て発明が解決しようとする課題゛ しかし、上記前者検査手段は、カメラの分解能により測
定精度が決まり、1■り込み両面の大きさ、k・1象部
品の大きさ等により精度が変動する。そして安定した照
明と対象部品の色、反射状態が−・定したものが要求さ
れ 又、外部光や、対象部品のメーカの違い等によ・つ
ても結果が異なるのでこれらへのり・1応が複雑になる
However, in the former inspection means, the measurement accuracy is determined by the resolution of the camera, and the accuracy varies depending on the size of both sides of the inspection, the size of the k-1 part, etc. Stable illumination and a constant color and reflection state of the target parts are required.Also, results may vary depending on external light, differences in the manufacturer of the target parts, etc. It gets complicated.

又、役名゛検査手段ては、リーI:端子間のトーザビー
ノ\の反射状態(こ不安定要素があり、検査精度が悪く
なる。
In addition, the inspection means is: Lee I: Reflection state of Tozabino between terminals (there is an unstable element in this, and the inspection accuracy deteriorates.

史に、上記何れの従来例においても吸着ノズルの吸着面
と、り一斗九n;の平行度がばr、ついている場りはフ
ラッI−バックICの検査結果が不正確となるなどの欠
点があった3 そこで本発明は上記従来例の欠点に対処し、より測定精
度の高い検査装置を提供I7ようとするものである。
Historically, in any of the above conventional examples, if the parallelism between the suction surface of the suction nozzle and the lever is too large, the inspection results of the flat I-back IC may become inaccurate. Disadvantages 3 Therefore, the present invention addresses the above-mentioned disadvantages of the conventional example and attempts to provide an inspection device with higher measurement accuracy.

ご課題を解決する為の手段〕・ 台座十にあって直角2方向へ移動するようにしたX−Y
6動架台と、該X Y移動架台十に支持されたレーザビ
ー71反111=1板を介して載置しtl:透明板と、
前記台座上に定清さi′L珪つ該透明板−1−にお(“
する隣接2辺に対応するようにしl:2方向位置決め盤
ど、前記透明板上に載支せしめたフラットパックICの
・1辺よりある間隔をおいて該ICのリード端子の状態
をレーザビームにより走査するようにしたレーザビーノ
\スキへ一ナーと、前記反射板にて反射したレーザビー
ムを受信しこれを解析して良否をvl+定する装置とか
らなる。
Measures to solve the problem] - X-Y that is on a pedestal and moves in two directions at right angles.
6 movable frame, and a laser beam 71 x 111 = 1 plate supported by the XY movable frame tl: transparent plate;
On the pedestal, there is a transparent plate i′L (“
A laser beam is used to check the state of the lead terminals of the flat pack IC mounted on the transparent plate at a certain interval from one side of the flat pack IC mounted on the transparent plate using a two-way positioning board. It consists of a laser beam scanner configured to scan, and a device that receives the laser beam reflected by the reflector and analyzes it to determine pass/fail.

二作用〕・ 透明板上に静置したフラン1.,1<ツクTCをXY移
動架台のX−Y移動によって、該フラッI−パックTC
の直角2辺を2方向位置決め盤の2つの位置決め辺に接
触せしめて、該フラン)へパックICを正規の位置にあ
るように矯正し、該フラン)・パックICの外縁り方に
設置したレーザビームスキャナーからレーザビーノ、を
該フラットパックICの外縁に突:(シたリード端子の
端部寄りにスポットを当て乍らフランI・パックICの
4辺を巡って走査することにより、リード端子から反射
した場合と、前記透明板下位に設けられたレーザビーノ
\反射板から反射とのずれを求めて、その結果を良否判
定装置により標準状態と比較してリード線の状態の良否
を判定し、良品と不良部品とを振り分は乍t、自動実装
に備えるようにしている。
Two actions] Furan placed on a transparent plate 1. ,1<Tsuku TC by X-Y movement of the
The two right-angled sides of the flange are brought into contact with the two positioning sides of the two-way positioning board, and the pack IC is corrected so that it is in the correct position. A laser beam from a beam scanner is applied to the outer edge of the flat pack IC: (By scanning around the four sides of the flat pack IC while aiming a spot near the end of the lead terminal, the laser beam is reflected from the lead terminal. The difference between the case where the lead wire is used and the reflection from the laser beam reflector installed below the transparent plate is determined, and the result is compared with the standard state using a quality judgment device to determine whether the condition of the lead wire is good or bad. We are trying to sort out defective parts and prepare for automatic mounting.

て実施例〕・ 1゛J、下水発明に−)いて図面に示す実施例により詳
細に説明すると、第1図及び第2図に示すように、台座
1上に定設したレール2によって)′軸方向へ案内され
る摺動台3を支持すると共(5こ台座1の摺動台3が移
動する方向の側面部に定設した支持板11に、シリンダ
ー12の先端をす・ノド13に、1:り螺首し、K>リ
ンダ−12のビス1〜ン杆14の先端を前記摺動台3グ
)側面にナツト15により調整自由に連結し、ビス1〜
ン杆14の出没によ−)て前記摺動台3をレール2に従
−〕で)′方向に摺動自由に支持する。
Embodiment] 1. J, Sewage Invention -) To explain in detail by the embodiment shown in the drawings, as shown in Figs. 1 and 2, by a rail 2 set on a pedestal 1)' In addition to supporting the sliding table 3 that is guided in the axial direction, the tip of the cylinder 12 is placed on the support plate 11 set on the side surface of the five-piece pedestal 1 in the direction in which the sliding table 3 moves. , 1: Thread the neck, and connect the ends of the screws 1 to 14 of the cylinder 12 to the side surface of the sliding table 3g) with nuts 15, and adjust the screws 1 to 14.
By protruding and retracting the lever 14, the sliding table 3 is supported so as to be able to slide freely in the direction of the rail 2.

次に該摺動台3+には前記レール2と直交方向に取付け
たレール4によってX方向へ案内される摺動台5を装着
し、更に該摺動台3のレール4が延びる方向の側面に支
持板6を取付け、該支持板6にシリンダー7をその先端
でナラI−8により取(=Jけると共に、該シリンダー
7のピストン杆9の先端を摺動台5の側面にナラ1〜1
0によって調整自由に連結して、該シリンダー7のビス
1〜ン杆9の出没によって該摺動台5をレール11に従
ってX方向へ摺動自由に保持する。
Next, a sliding table 5 is attached to the sliding table 3+, which is guided in the X direction by a rail 4 installed orthogonally to the rail 2, and further attached to the side surface of the sliding table 3 in the direction in which the rail 4 extends. Attach the support plate 6, and attach the cylinder 7 to the support plate 6 at its tip with a nut I-8 (=J), and at the same time, attach the tip of the piston rod 9 of the cylinder 7 to the side of the slide table 5 with a nut 1-1.
0, and the slide table 5 is held freely slidable in the X direction along the rail 11 by the protrusion and retraction of the screws 1 to 9 of the cylinder 7.

モして該摺動台5の上面にはレーザビームを反射する反
射板16を介してその」二面に屈折を伴わないような−
・定厚みの透明板17を密着定設し、該透明板17の前
記各シリンダー7.12と相対する2辺上縁に軽く接す
る互いに直角な2つの基準辺2020゛を有する2方向
位置決め盤19を垂直支持片18の下端で台座]−にの
〜端縁に立設してなる。
A reflector plate 16 is provided on the upper surface of the slide table 5 to reflect the laser beam so that the laser beam is not refracted on its two surfaces.
- A two-way positioning plate 19 having a transparent plate 17 of constant thickness set in close contact with each other and having two reference sides 2020° perpendicular to each other that lightly touch the upper edges of two sides of the transparent plate 17 facing each cylinder 7.12. is erected at the lower end of the vertical support piece 18 on the edge of the pedestal.

次に動イ1−に−)いて述へると、先ず前記透明板17
は最W両シリンダー7.12の各ビス1〜ン杆814が
没入IJS態にあって、両シリンダー7.12の方向に
最も接近り、、、 7.:位置にあり、この■4該透明
板17f−に、フラットパックIC,Bを自動部品供給
装置の吸容(ジにJニー)で運び込まれて静置する。
Next, moving to step 1-), first, the transparent plate 17
7. When the screws 1 to 814 of both cylinders 7.12 are in the recessed IJS state, they are closest in the direction of both cylinders 7.12. : position, and the flat pack IC, B is carried onto the transparent plate 17f- by the suction of the automatic parts feeder and left standing.

次に両シリ〉ダー7,12を同時に動作させて各ピスト
ン杆9,14をシリンダー7.12かt、突出せしめる
ことにより、各摺動台はX−Yの各移動線上を摺動する
Next, by operating both cylinders 7 and 12 simultaneously to cause each piston rod 9 and 14 to protrude by a cylinder 7.12, each slide table slides on each of the X-Y movement lines.

即ちシリンダー7を動作することによりビス1〜ン杆9
はX方向右へ移動し、摺動台5をレール4に沿−〕で位
置決め盤19の基準辺20の方向へ移動せしめる。
That is, by operating the cylinder 7, the screws 1 to 9 are
moves to the right in the X direction, and moves the sliding table 5 along the rail 4 in the direction of the reference side 20 of the positioning board 19.

又、他方摺動台3はL2同様シリンダー12の動的、こ
よ−)てピストン杆14がY方向/X押動ぜしめられる
のて摺動台3は前記シリンダー7及び摺動台5をt、Y
−えてレール2の案内に沿って位置決め盛19の基準辺
20゛の方向へ移動することにより第3図のように結果
的にフラットパックIC,Bは斜め方向に移動しノここ
とになり、該フラッI−バックIC,Bの2辺のり−1
へ端子の先端は共に夫々の基準辺20.20’に当接し
て姿勢がイ1=正される。
On the other hand, like L2, the slide table 3 moves the cylinder 12 dynamically, so that the piston rod 14 is pushed in the Y direction/X direction. ,Y
- Then, by moving in the direction of the reference side 20 of the positioning plate 19 along the guide of the rail 2, the flat pack IC, B is moved diagonally as shown in Fig. 3. Glue on 2 sides of the flat I-back IC, B-1
The ends of the terminals abut on the respective reference sides 20 and 20', and their postures are corrected.

このようにして、正規の位置に静置されたフラットパッ
クIC,Bについて、各辺に突設されたリード端″i′
−a、a−b、b−5c、c、d、d、−の先端から一
定の位置をX−)′方向へ拶動可能に設置されたレーザ
ビームスキャナーによって第4図の矢印て示したように
順次に走査する9そして検査の様子は第5図a、1〕に
示すように透明板17の上方にあって、該透明板17上
のフラットパックIC,Bの周辺部即1う各リード端子
a、a・・、b、1〕・・の端部寄りの所定位置を、レ
ーザビームスキャナーAから発射されるレーザビームし
て走査し乍ら、該スキャナーAを一定速度てリード端子
列に沿って移動ぜしめな場合、第5図8のようにレーザ
ビームLがリード端子aから反射した時の反射レーザビ
ームLの検出レベルには第6図でT(’を示し、第5図
1〕のようにリード端子a、a間を通り、透明板17を
経て反射板16の面てレーザビーム\I、が反射した場
合、反射L−ザし=ノ\L”′の検出レベルは第6図で
示す。
In this way, the lead ends "i'
-a, a-b, b-5c, c, d, d, - A fixed position from the tip of As shown in FIG. While scanning predetermined positions near the ends of lead terminals a, a..., b, 1] with a laser beam emitted from laser beam scanner A, the scanner A moves at a constant speed to scan the lead terminal array. When the laser beam L is reflected from the lead terminal a as shown in FIG. 5, the detection level of the reflected laser beam L is shown as T(' in FIG. 6, and 1], when the laser beam \I passes between the lead terminals a and a, passes through the transparent plate 17, and is reflected by the surface of the reflection plate 16, the detection level of the reflected L-zashi=ノ\L"' is This is shown in FIG.

そして、再反射レーザビーム、の検出しヘルH。Then, the re-reflected laser beam is detected.

11’と、その間の時間差とを、レーザ変位検出装置に
予め記憶した設Jf値(基準値)と比較することにより
、リート端一「の状態を捉えようとするものである。
11' and the time difference therebetween with a set Jf value (reference value) stored in advance in the laser displacement detection device, the state of the REIT end 1' is attempted to be determined.

即ちリード端子のaき上がりぐ透明板にリード端子が密
ル°シてない状態)は検出しベノk II’の値が小さ
くなり、又、リードn1了間ビ・リチが設唱値く基1(
(値)に対し狭いものは「1の値が小さ(、ピッy−が
設;f1値(基準値〉に対し広いちJ)はPの値が大き
くなることによりリード端子の状態が正確に把握さノし
る9 尚、上記本発明(・こむいて反射板16−Lに透明板を
介り、てフラ・州〜バックTCを載支するようにしたこ
と(、こり、1/−ザビー1、かり−1一端1′−トて
反射した場合と、レーザビームが反射板トて反射した場
、)どて、該リート、端子の厚みと透明板の厚みを加算
した値だけ反射レーザビームI−“とL ”に相当する
出力レベルHと■1°の差を大きくすることがてきて検
出精度即ち分解能が高められる。
In other words, the state in which the lead terminal is not tightly sealed against the transparent plate above the lead terminal a is detected, and the value of Beno k II' becomes small, and the value of lead n 1(
If the value of 1 is narrow compared to (value), the condition of the lead terminal will be accurately determined. Grasping Notes 9 In addition, the above-mentioned present invention (・In order to support the back TC on the reflector plate 16-L via a transparent plate) 1. When the laser beam is reflected by one end of the wire (1'), and when the laser beam is reflected by the reflector, the laser beam is reflected by the sum of the thickness of the terminal and the thickness of the transparent plate. The difference between the output levels H and 1° corresponding to I-" and L" can be increased, and the detection accuracy, that is, the resolution can be improved.

〈発明の効果〕・ 本発明は、上述のようにレーザビーム反射板の−1−面
に透明板を介してフラッ1ヘパツクTCを載支するよう
にしたので、レー→ノ′ビームの反射分解能を高めるこ
とができて、フラットパッククTCのリード端j1の状
態−)より浮き」二がり、及びり−1・端子間隔等を一
層正確に把握することがてき、フ゛ンツトバックICの
良否判断か−・層正確となる。
<Effects of the Invention>- As described above, the present invention has a flat pack TC mounted on the -1-plane of the laser beam reflector via a transparent plate, so that the reflection resolution of the laser beam is improved. This makes it possible to more accurately grasp the condition of the lead end j1 of the flatpack TC, and to more accurately grasp the condition of the lead end j1 of the flat pack IC, as well as the gap between the leads and the terminal spacing.・The layer becomes accurate.

又、吸名ソスルにフラットパッククICを吸名゛保持し
た状1ぶてフラットパッククICのリード端子の状態を
検査する従来の手段に比べて、フラットパックICの状
態が安定して検査精度か向」二する。
In addition, compared to the conventional means of inspecting the condition of the lead terminals of a flat pack IC with a single handle, the condition of the flat pack IC is stabilized and the inspection accuracy is improved. "Kamukai" 2.

従来の画像認識による手段に比べてカメラ装置や、画像
処理装置が全く不要となり、装置全体としては設備費が
少なく経済効果が大であるなと多くの優れた効果を存す
る。
Compared to conventional image recognition means, this method has many excellent effects, such as no need for a camera device or image processing device, and the equipment cost as a whole is low and economical.

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第6図は本発明実施例を示す。 第1図は、同−L要部平面図、 第2図は、同士一部切欠側面図、 第3図は、第1図使用状態の平面図、 第、・1図は、走今要領を示ずフラットパックの平面略
図、 第5図(a)は、リ−1・端子てレーリーヒームが反射
している状態を示す同一1−側面図、第5図(1〕〉は
、反射根土てレーザビーム、か反射している状ffJを
示ず同F側面図、 第()図は、レーザビームスキャナーて擢えた時間材検
出トベル1着生図、 第7図及び第8図は従宋例を示す。 第7図は、画作認識にJ:る検出手段を示す機能図、 第8図は、L−ザビームによる検出手段を示す機能図で
ある。 1 台座、     3,5 摺動台、16・反射板、
   17・透明板、 19・2方向位置決め盤、 】1 A・・レーザビームスキャナー フラッ)へバックIC5 a、b、c、d  リード端子
1 to 6 show embodiments of the present invention. Figure 1 is a plan view of the main parts of the same L, Figure 2 is a partially cutaway side view of the same, Figure 3 is a plan view of the state in which Figure 1 is in use, and Figures 1 and 1 show the current running procedure. Figure 5(a) is a side view of the same 1 showing the state in which the Rayleigh heel is reflected at the terminal and Figure 5(1) is a schematic plan view of the flat pack. The laser beam is a side view of the same F without showing the reflected state ffJ. Figure () is a diagram of the growth of time material detected by a laser beam scanner. Figures 7 and 8 are examples of the Confucian Song Dynasty. Fig. 7 is a functional diagram showing the detection means used for image recognition, and Fig. 8 is a functional diagram showing the detection means using the L-the beam. 1 Pedestal, 3, 5 Sliding base, 16 ·a reflector,
17.Transparent plate, 19.2-direction positioning board, ]1 A...Laser beam scanner flat) Back IC5 a, b, c, d Lead terminals

Claims (1)

【特許請求の範囲】[Claims] 1、台座上にあって直角2方向へ移動するようにしたX
−Y移動架台と、該X−Y移動架台上に支持されたレー
ザビーム反射板を介して載置した透明板と、前記台座上
に定着され且つ該透明板上における隣接2辺に対応する
ようにした2方向位置決め盤と、前記透明板上に載支せ
しめたフラットパックICの4辺よりある間隔をおいて
該ICのリード端子の状態をレーザビームにより走査す
るようにしたレーザビームスキャナーと、前記反射板に
て反射したレーザビームを受信しこれを解析して良否を
判定する装置とからなるフラットパックIC検査装置。
1. An X that is on a pedestal and can move in two directions at right angles.
- a Y movable pedestal, a transparent plate placed via a laser beam reflecting plate supported on the XY movable pedestal; a two-direction positioning board, which is mounted on the transparent plate, and a laser beam scanner configured to scan the state of the lead terminals of the flat pack IC mounted on the transparent plate at certain intervals from the four sides of the IC using a laser beam; A flat pack IC inspection device comprising a device that receives a laser beam reflected by the reflector and analyzes it to determine pass/fail.
JP12232790A 1990-05-11 1990-05-11 Inspecting device for flat pack ic Pending JPH0418743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12232790A JPH0418743A (en) 1990-05-11 1990-05-11 Inspecting device for flat pack ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12232790A JPH0418743A (en) 1990-05-11 1990-05-11 Inspecting device for flat pack ic

Publications (1)

Publication Number Publication Date
JPH0418743A true JPH0418743A (en) 1992-01-22

Family

ID=14833227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12232790A Pending JPH0418743A (en) 1990-05-11 1990-05-11 Inspecting device for flat pack ic

Country Status (1)

Country Link
JP (1) JPH0418743A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543334A (en) * 1993-12-15 1996-08-06 Kabushiki Kaisha Toshiba Method of screening semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543334A (en) * 1993-12-15 1996-08-06 Kabushiki Kaisha Toshiba Method of screening semiconductor device

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