JPS63278345A - Inspecting device for semiconductor device - Google Patents
Inspecting device for semiconductor deviceInfo
- Publication number
- JPS63278345A JPS63278345A JP11417887A JP11417887A JPS63278345A JP S63278345 A JPS63278345 A JP S63278345A JP 11417887 A JP11417887 A JP 11417887A JP 11417887 A JP11417887 A JP 11417887A JP S63278345 A JPS63278345 A JP S63278345A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- displacement sensor
- bin
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000006073 displacement reaction Methods 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は半導体装置の検査装置に関する。[Detailed description of the invention] Industrial applications The present invention relates to an inspection apparatus for semiconductor devices.
従来の技術
従来、たとえば、半導体装置のリードビンを認識する場
合、第４図に略側面図で示すような外観検査装置が用い
られていた。2. Description of the Related Art Conventionally, for example, when recognizing a lead bin of a semiconductor device, an appearance inspection apparatus as shown in a schematic side view in FIG. 4 has been used.
以下この従来の外観検査装置について説明する。第４図
において、７はカメラ、８は高周波帯光灯等の光源、９
は光源８近傍に付設された光源カバー、１０は低歪率の
画像反射板、１１は回転可能な保持台、１３は支持板、
１２は係留ビンで、保持体１１を支持板１３に回動可能
に取り付けるためのものである。光源８によってリード
ビンは照射され、その反射光を揺動可能な画像反射板１
０を調整して、カメラ７へ導く。そして、このカメラ７
はリードビンの上面および側面の像を検出する。この検
出された像に基づいてリードビンピッチ、本数を検査す
る。This conventional visual inspection device will be explained below. In Fig. 4, 7 is a camera, 8 is a light source such as a high frequency band light, and 9 is a light source such as a high frequency band light.
10 is a low distortion image reflection plate; 11 is a rotatable holding base; 13 is a support plate;
12 is a mooring bottle for rotatably attaching the holder 11 to the support plate 13. The lead bin is illuminated by a light source 8, and the reflected light is reflected by an image reflecting plate 1 which can be swung.
0 and guide it to camera 7. And this camera 7
detects images of the top and side surfaces of the lead bin. Based on this detected image, the pitch and number of lead bins are inspected.
発明が解決しようとする問題点
従来の技術では光源からの光をリードビン表面に照射し
て反射した光をカメラで撮像していたため、リードビン
の光沢の違いやリードビンのエツジで乱反射しやすく、
正確な認識ができず誤認識の可能性が高かった。Problems to be Solved by the Invention In the conventional technology, light from a light source was irradiated onto the surface of the lead bin and the reflected light was imaged with a camera, which caused diffuse reflection due to differences in the gloss of the lead bin and the edges of the lead bin.
Accurate recognition was not possible and there was a high possibility of misrecognition.
問題点を解決するための手段
本発明は、半導体装置を吸着して半導体装置の所定面に
垂直な軸のまわりに回動させる吸着ヘッドと、半導体装
置の所定位置をスキャンしながら移動する変位センサと
、得られた検出信号を比較・判定する信号処理手段を有
する半導体装置の検査装置である。Means for Solving the Problems The present invention provides a suction head that suctions a semiconductor device and rotates it around an axis perpendicular to a predetermined surface of the semiconductor device, and a displacement sensor that moves while scanning a predetermined position of the semiconductor device. This is a semiconductor device inspection apparatus having a signal processing means for comparing and determining the detection signals obtained.
作用
本発明によると、リードビン先端部を変位センサで上方
からスキャンすることにより、リード曲がりを検査でき
る。According to the present invention, lead bending can be inspected by scanning the tip of the lead bin from above with a displacement sensor.
実施例
第１図は本発明の一実施例による半導体装置のリード曲
がり検査装置の斜視図で、第２図はその要部を簡単に示
した側断面図である。以下にこの装置の構成を説明する
。第１図において、１は被検査物、２は変位センサ、３
は位置決めテーブル、４はパルスモータ−１５は被検査
物を吸着して回転して移動する吸着ヘッド、６は吸着ヘ
ッドを上下に移動させるシリンダー、Ｓはセンサの光路
である。Embodiment FIG. 1 is a perspective view of a lead bending inspection apparatus for a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a side sectional view simply showing the main parts thereof. The configuration of this device will be explained below. In FIG. 1, 1 is an object to be inspected, 2 is a displacement sensor, and 3 is a displacement sensor.
4 is a positioning table; 4 is a pulse motor; 15 is a suction head that rotates and moves the object to be inspected; 6 is a cylinder that moves the suction head up and down; and S is an optical path of a sensor.
以下にこの実施例の動作を説明する。まず位置決めテー
ブル３上に乗せられた半導体装置１の上方から、位置決
めテーブル３の面に平行に移動しながら半導体装置１の
リードビンの先端部分の上面の基準面（テーブルの上面
）からの高さをこの測定は第２図のように、テーブル３
の基準面とカメラ２とを平行に配置して行う。第３図ａ
−ｄはそのときのセンサーの出力信号をアナログ／デジ
タル（Ａ／Ｄ ’）変換し、パルス化したもので、縦方
向はリードビンの上面の基準面からの高さ、横方向は入
力パルス数より得られたセンサの移動量を出力に対応さ
せて得られた距離である。第３図ａの出力波形は正常な
リードのもので、基準面からの高さもリードピッチも一
定の場合である。ｂの信号は右から６本めのリードビン
を上向きに曲ったものから得られた出力であり、その出
力のレベルから明らかに不良であることを判定する。The operation of this embodiment will be explained below. First, from above the semiconductor device 1 placed on the positioning table 3, while moving parallel to the surface of the positioning table 3, measure the height of the top surface of the tip of the lead bin of the semiconductor device 1 from the reference plane (top surface of the table). This measurement is shown in Table 3 as shown in Figure 2.
This is done by arranging the reference plane and camera 2 parallel to each other. Figure 3a
-d is the output signal of the sensor at that time converted into a pulse by analog/digital (A/D') conversion, and the vertical direction is the height from the reference surface of the top surface of the lead bin, and the horizontal direction is the number of input pulses. This is the distance obtained by making the obtained movement amount of the sensor correspond to the output. The output waveform in FIG. 3a is for a normal lead, and the height from the reference plane and the lead pitch are constant. The signal b is the output obtained from the sixth lead bin from the right that is bent upward, and it is determined from the level of the output that it is clearly defective.
Ｃはｂの面のリードの右から３本めを下向きに曲げたも
のであり、１本だけ低く、他は右上がりに持ち上げられ
ているのがわかる。ｄは右から６本めのリードビンを左
向きに曲げたものでピッチの違いが現われている。C is the third lead from the right on side b bent downward, and you can see that only one lead is low and the others are raised upward to the right. d is the sixth lead bin from the right bent to the left, showing the difference in pitch.
以上より、リードビンの曲がりは全て認識できる。From the above, all bends in the lead bin can be recognized.
発明の効果
このように本発明によれば、変位センサで半導体装置の
上方よりリードビンの先端をスキャンさせることにより
、リードビンの上下的がり及びピッチを同時にしかも高
精度に検査できるという効果を有するものである。Effects of the Invention As described above, according to the present invention, by scanning the tip of the lead bin from above the semiconductor device with a displacement sensor, it is possible to simultaneously inspect the vertical target and pitch of the lead bin with high precision. be.
第１図は本発明の一実施例による半導体装置の検査装置
の斜視図、第２図はその要部を簡単に示した側断面図、
第３図はその検査装置で得られるパルス出力波形図、第
４図は従来の外観検査装置の略側面図である。
１・・・・・・半導体装置、２・・・・・・変位センサ
、３・・・・・・位置決めテーブル、４・・・・・・パ
ルスモータ−１５・・・・・・吸着ヘッド、６・・・・
・・シリンダー。
代理人の氏名 弁理士 中尾敏男 ほか１名／−−−キ
導袢服】
２−−一麦イ立ヤンプ
３−弛ＪＬ犬のテープル
第２図
第３図
（ａ−ン
第３図 ＣＣ）
ｃｄ−）FIG. 1 is a perspective view of a semiconductor device inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a side sectional view briefly showing the main parts thereof.
FIG. 3 is a pulse output waveform diagram obtained by the inspection device, and FIG. 4 is a schematic side view of the conventional appearance inspection device. 1... Semiconductor device, 2... Displacement sensor, 3... Positioning table, 4... Pulse motor 15... Suction head, 6...
··cylinder. Name of agent: Patent attorney Toshio Nakao and 1 other person/--Ki-Doubanfuku] 2--Ichimugii Tachiyampu 3-Yuru JL dog's table Fig. 2 Fig. 3 (a-n Fig. 3 CC) cd-)
Claims (1)
構を有したテーブルと、前記半導体装置を吸着して前記
載置面に垂直な軸のまわりに回動させる吸着ヘッドと、
前記半導体装置の所定領域をスキャンしながら移動する
変位センサと、前記センサで得られた検出信号を比較・
判定する信号処理手段とを有することを特徴とした半導
体装置の検査装置。a table having a positioning mechanism that moves in a direction parallel to a mounting surface of the semiconductor device; a suction head that attracts the semiconductor device and rotates it around an axis perpendicular to the mounting surface;
A displacement sensor that moves while scanning a predetermined area of the semiconductor device and a detection signal obtained by the sensor are compared.
1. An inspection apparatus for a semiconductor device, comprising a signal processing means for making a determination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11417887A JPS63278345A (en) | 1987-05-11 | 1987-05-11 | Inspecting device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11417887A JPS63278345A (en) | 1987-05-11 | 1987-05-11 | Inspecting device for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63278345A true JPS63278345A (en) | 1988-11-16 |
Family
ID=14631135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11417887A Pending JPS63278345A (en) | 1987-05-11 | 1987-05-11 | Inspecting device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63278345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5162866A (en) * | 1989-12-25 | 1992-11-10 | Sony Corporation | Apparatus and method for inspecting IC leads |
-
1987
- 1987-05-11 JP JP11417887A patent/JPS63278345A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5162866A (en) * | 1989-12-25 | 1992-11-10 | Sony Corporation | Apparatus and method for inspecting IC leads |
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