JPH0418705B2 - - Google Patents

Info

Publication number
JPH0418705B2
JPH0418705B2 JP60280960A JP28096085A JPH0418705B2 JP H0418705 B2 JPH0418705 B2 JP H0418705B2 JP 60280960 A JP60280960 A JP 60280960A JP 28096085 A JP28096085 A JP 28096085A JP H0418705 B2 JPH0418705 B2 JP H0418705B2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
power supply
heat dissipation
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60280960A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62140448A (ja
Inventor
Takao Funamoto
Ryoichi Kajiwara
Mitsuo Kato
Kyo Matsuzaka
Tomohiko Shida
Hiroshi Wachi
Kazuya Takahashi
Masatoshi Watabe
Minoru Yamada
Keiichiro Nakanishi
Toshio Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60280960A priority Critical patent/JPS62140448A/ja
Priority to DE8686309619T priority patent/DE3680774D1/de
Priority to EP86309619A priority patent/EP0228212B1/en
Priority to US06/941,812 priority patent/US4809058A/en
Publication of JPS62140448A publication Critical patent/JPS62140448A/ja
Publication of JPH0418705B2 publication Critical patent/JPH0418705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60280960A 1985-12-16 1985-12-16 集積回路装置 Granted JPS62140448A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60280960A JPS62140448A (ja) 1985-12-16 1985-12-16 集積回路装置
DE8686309619T DE3680774D1 (de) 1985-12-16 1986-12-10 Integriertes halbleiterbauelement.
EP86309619A EP0228212B1 (en) 1985-12-16 1986-12-10 Integrated circuit device
US06/941,812 US4809058A (en) 1985-12-16 1986-12-15 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60280960A JPS62140448A (ja) 1985-12-16 1985-12-16 集積回路装置

Publications (2)

Publication Number Publication Date
JPS62140448A JPS62140448A (ja) 1987-06-24
JPH0418705B2 true JPH0418705B2 (ref) 1992-03-27

Family

ID=17632287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60280960A Granted JPS62140448A (ja) 1985-12-16 1985-12-16 集積回路装置

Country Status (1)

Country Link
JP (1) JPS62140448A (ref)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2625042B1 (fr) * 1987-12-22 1990-04-20 Thomson Csf Structure microelectronique hybride modulaire a haute densite d'integration
JP2010230304A (ja) * 2009-03-04 2010-10-14 Sumitomo Light Metal Ind Ltd 空気調和機用フィン・アンド・チューブ式熱交換器

Also Published As

Publication number Publication date
JPS62140448A (ja) 1987-06-24

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term