JPH04180667A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPH04180667A
JPH04180667A JP30970190A JP30970190A JPH04180667A JP H04180667 A JPH04180667 A JP H04180667A JP 30970190 A JP30970190 A JP 30970190A JP 30970190 A JP30970190 A JP 30970190A JP H04180667 A JPH04180667 A JP H04180667A
Authority
JP
Japan
Prior art keywords
hollow
outer lead
wiring board
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30970190A
Other languages
Japanese (ja)
Inventor
Naoyuki Murai
村井　直幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP30970190A priority Critical patent/JPH04180667A/en
Publication of JPH04180667A publication Critical patent/JPH04180667A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To mount an outer lead on a printed wiring board inseparably even when a warp exists at a package main body or the printed wiring board by a method wherein a hollow is formed in the sheet-thickness direction of an outer lead and a reinforcement member provided with rubber elasticity is installed so as to fill the hollow. CONSTITUTION:A hollow 3A is formed in the sheet-thickness direction of an outer lead 2A extracted form a package main body 1A as a sealing resin; a reinforcement member 4A which is provided with rubber elasticity and which is made of a high polymer, such as a silicone rubber or the like, is installed so as to fill the hollow 3A. Thereby, it is possible to obtain elasticity in the part of the hollow 3A, and each outer lead 2A at the lead tip side from the hollow 3A can slightly be moved in the up-and-down direction independently of each other by making use of the hollow part as a shaft. Consequently, the outer lead can inseparably be mounted on a wiring board.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関し、特にその外部リ
ードに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device, and particularly to an external lead thereof.

〔従来の技術〕[Conventional technology]

従来の樹脂封止型半導体装置は、第３図に示すように、
その外部リード１の板厚はほぼ均一であった。The conventional resin-sealed semiconductor device, as shown in FIG.
The thickness of the external lead 1 was approximately uniform.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の樹脂封止型半導体装置は、外部リードが
ほぼ均一な板厚を有しているので、その形状は固定され
たものとなっている。このため、パッケージ本体１に反
りがある場合には、複数の外部リード２先端の平坦性が
悪くなり外部リードが配線基板から離れうまく実装でき
ないという欠点がある。また、外部リード先端の平坦性
が良い場合でも、プリント配線基板に反りがある場合に
は同様に外部リードがプリント配線基板から離れうまく
実装されないという欠点がある。In the conventional resin-sealed semiconductor device described above, the external lead has a substantially uniform thickness, so its shape is fixed. Therefore, if the package body 1 is warped, the flatness of the tips of the plurality of external leads 2 deteriorates, resulting in a disadvantage that the external leads separate from the wiring board and cannot be mounted properly. Furthermore, even if the tips of the external leads have good flatness, if the printed wiring board is warped, the external leads may separate from the printed wiring board and cannot be mounted properly.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の樹脂封止型半導体装置は、少なくとも一部の外
部リードの板厚方向に窪みを有し、かつ前記窪みを埋め
る様にゴム弾性をもった補強部材が設けられているとい
うものである。In the resin-sealed semiconductor device of the present invention, at least some of the external leads have depressions in the thickness direction, and a reinforcing member with rubber elasticity is provided to fill the depressions. .

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の第１の実施例を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention.

封止樹脂であるパッケージ本体ＩＡより引き出された外
部リード２Ａの板厚方向に窪み３Ａを有し、かつこの窪
み３Ａを埋める様にシリコーンゴムなどのゴム弾性を有
する高分子製の補強部材４Ａが設けられている。これに
より、窪み３Ａの箇所に弾性が得られ、窪み部を軸とし
て窪みよりリード先端側の外部リード２Ａの１本１本が
独立して上下方向に微動可能な構造となる。The external lead 2A pulled out from the package body IA, which is a sealing resin, has a depression 3A in the thickness direction, and a reinforcing member 4A made of a polymer made of rubber elasticity such as silicone rubber is filled in the depression 3A. It is provided. As a result, elasticity is obtained at the location of the depression 3A, and a structure is created in which each of the external leads 2A on the lead tip end side of the depression can independently move slightly in the vertical direction with the depression as an axis.

第２図は本発明の第２の実施例を示す斜視図である。FIG. 2 is a perspective view showing a second embodiment of the invention.

この実施例ではシリコーンゴムからなる補強部材４Ｂが
一体化しパッケージ本体ＩＢと合体しているため窪み３
Ｂの部分の十分な補強ができるという利点がある。In this embodiment, the reinforcing member 4B made of silicone rubber is integrated with the package body IB, so the recess 3
This has the advantage that part B can be sufficiently reinforced.

なお、以上の説明において、全ての外部リードに窪み及
び補強部材を設けた例をあげたが、１本おきにするなど
、必ずしも全ての外部リードがこのようなものでなくて
もよい。In the above description, an example has been given in which all the external leads are provided with depressions and reinforcing members, but not all external leads need to be provided with such a structure, for example, every other external lead is provided with a recess and a reinforcing member.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、少なくとも一部の外部リ
ードの板厚方向に窪みを有し、がっ、その窪みを埋める
様にゴム弾性をもった補助部材を設けることにより、外
部リードを上下方向に微動できる構造とすることができ
る。これにより、パッケージ本体に反りがある場合ある
いは、プリント配線基板に反りがある場合でも樹脂封止
型半導体装置をプリント配線基板に搭載する際に、外部
リードの１本１本が独立して自動的に調整され、外部リ
ードと配線基板とが離れることなく実装できる効果があ
る。As explained above, in the present invention, at least some of the external leads have depressions in the thickness direction, and by providing an auxiliary member with rubber elasticity to fill the depressions, the external leads can be moved up and down. It is possible to have a structure that allows slight movement in the direction. As a result, even if the package body is warped or the printed wiring board is warped, each external lead can be automatically and independently mounted when a resin-sealed semiconductor device is mounted on the printed wiring board. This has the effect of allowing mounting without separating the external leads and the wiring board.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の第１の実施例を示す斜視図、第２図は
本発明の第２の実施例を示す斜視図、第３図は従来例を
示す斜視図である。 １．１Ａ、ＩＢ・・・パッケージ本体、２，２Ａ。 ２Ｂ・・・外部リード、３Ａ、３Ｂ・・・窪み、４Ａ。 ４Ｂ・・・補強部材。FIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a perspective view showing a second embodiment of the invention, and FIG. 3 is a perspective view showing a conventional example. 1.1A, IB...Package body, 2,2A. 2B...external lead, 3A, 3B...dent, 4A. 4B...Reinforcement member.

Claims (1)

【特許請求の範囲】[Claims] 　少なくとも一部の外部リードの板厚方向に窪みを有し
、かつ前記窪みを埋める様にゴム弾性をもった補強部材
が設けられていることを特徴とする樹脂封止型半導体装
置。1. A resin-sealed semiconductor device, characterized in that at least some of the external leads have depressions in the thickness direction, and a reinforcing member having rubber elasticity is provided to fill the depressions.
JP30970190A 1990-11-15 1990-11-15 Resin-sealed semiconductor device Pending JPH04180667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30970190A JPH04180667A (en) 1990-11-15 1990-11-15 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30970190A JPH04180667A (en) 1990-11-15 1990-11-15 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPH04180667A true JPH04180667A (en) 1992-06-26

Family

ID=17996244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30970190A Pending JPH04180667A (en) 1990-11-15 1990-11-15 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH04180667A (en)

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