JPH0417570Y2 - - Google Patents
Info
- Publication number
- JPH0417570Y2 JPH0417570Y2 JP1988023033U JP2303388U JPH0417570Y2 JP H0417570 Y2 JPH0417570 Y2 JP H0417570Y2 JP 1988023033 U JP1988023033 U JP 1988023033U JP 2303388 U JP2303388 U JP 2303388U JP H0417570 Y2 JPH0417570 Y2 JP H0417570Y2
- Authority
- JP
- Japan
- Prior art keywords
- rack
- auxiliary cathode
- plated
- frame
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023033U JPH0417570Y2 (cg-RX-API-DMAC7.html) | 1988-02-25 | 1988-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023033U JPH0417570Y2 (cg-RX-API-DMAC7.html) | 1988-02-25 | 1988-02-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129271U JPH01129271U (cg-RX-API-DMAC7.html) | 1989-09-04 |
| JPH0417570Y2 true JPH0417570Y2 (cg-RX-API-DMAC7.html) | 1992-04-20 |
Family
ID=31241682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988023033U Expired JPH0417570Y2 (cg-RX-API-DMAC7.html) | 1988-02-25 | 1988-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0417570Y2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8900689B2 (en) | 2007-01-05 | 2014-12-02 | Toyoda Gosei Co., Ltd. | Method for producing resin plated product and resin molded product to be plated used therefor |
| KR102419332B1 (ko) * | 2022-04-29 | 2022-07-12 | 주식회사 이피코리아 | 전기도금장치 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023015988A (ja) * | 2021-07-20 | 2023-02-01 | 化興株式会社 | メッキ用治具の製造方法、メッキ用治具の管理方法、及びメッキ用治具 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4525236Y1 (cg-RX-API-DMAC7.html) * | 1967-12-01 | 1970-10-02 |
-
1988
- 1988-02-25 JP JP1988023033U patent/JPH0417570Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8900689B2 (en) | 2007-01-05 | 2014-12-02 | Toyoda Gosei Co., Ltd. | Method for producing resin plated product and resin molded product to be plated used therefor |
| KR102419332B1 (ko) * | 2022-04-29 | 2022-07-12 | 주식회사 이피코리아 | 전기도금장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01129271U (cg-RX-API-DMAC7.html) | 1989-09-04 |