JPH0417360A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH0417360A
JPH0417360A JP12156290A JP12156290A JPH0417360A JP H0417360 A JPH0417360 A JP H0417360A JP 12156290 A JP12156290 A JP 12156290A JP 12156290 A JP12156290 A JP 12156290A JP H0417360 A JPH0417360 A JP H0417360A
Authority
JP
Japan
Prior art keywords
semiconductor element
external introduction
sealing member
placing
crack prevention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12156290A
Other languages
Japanese (ja)
Inventor
Jiro Murakami
二郎 村上
Masashi Shimoda
下田　正志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12156290A priority Critical patent/JPH0417360A/en
Publication of JPH0417360A publication Critical patent/JPH0417360A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To obtain a semiconductor device for stopping cracks which are generated within a sealing member from a semiconductor device placing member at a tip of an external introduction conductor by allowing a crack prevention member to be coupled to an edge part at a side to be sealed of the external introduction conductor and by providing the crack prevention member so that its main surface opposes to an end face square part of the semiconductor element placing member. CONSTITUTION:The title item has a semiconductor element 1, a semiconductor element placing member 2 for placing the semiconductor element 1, external introduction conductors 4-6 which are connected by the semiconductor element 1 and a metal thin wire 3, a sealing member 7 which seals one part of the semiconductor element 1, the semiconductor element placing part member 2, and the external introduction conductors 4-6, and a crack prevention member 6 which is coupled to an edge part at a side to be sealed of the sealing member 7 of the external introduction conductors 4-6 and which is provided so that the main surface opposes to an end face square part of the semiconductor element placing member 2. For example, the tip part 6 of the external introduction conductors 4-6 is in Y type, thus preventing a crack 8 from reaching a surface of a sealing member using the crack prevention member 6 and preventing intrusion of water content, smeared ion, etc.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体素子載置部材から封止部材内にクラ
ックが生じても外部導出導体先端部でクランクをくい止
められるようにした半導体装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor device in which a crank can be stopped at the tip of an external lead-out conductor even if a crack occurs in a sealing member from a semiconductor element mounting member. It is something.

〔従来の技術〕[Conventional technology]

第３図は従来の樹脂封止型半導体装置の断面図である。 FIG. 3 is a sectional view of a conventional resin-sealed semiconductor device.

図のように半導体素子（１）は、半導体素子載置部材（
２）へはんだ等で固定され、外部との電気的導通を取る
ために、金線等のワイヤ（３）によって外部導出導体（
４）〜（６）に接続されている。（７）はこれらを保護
するための封止部材である。As shown in the figure, the semiconductor element (1) is mounted on the semiconductor element mounting member (
2), and in order to establish electrical continuity with the outside, an external lead-out conductor (3) is connected to the wire (3), such as a gold wire.
4) to (6). (7) is a sealing member for protecting these.

第３図に示した従来の半導体装置は、はんだ実装時の熱
ストレスにより、半導体素子載置部材（２）の端面角部
からクラックが生じることがあり、そのクラックは（８
）に示すように封止部材表面まで達してしまう。In the conventional semiconductor device shown in FIG. 3, cracks may occur from the corner of the end face of the semiconductor element mounting member (2) due to thermal stress during solder mounting, and the crack is (8
), it reaches the surface of the sealing member.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の半導体装置では、外部導出導体先端部が直線状た
め、クラックは外部導出導体の上か下を通って封止部材
表面まで達し、外部から水や汚染イオン等が侵入し易く
なるという問題点があった。In conventional semiconductor devices, the tip of the external conductor is straight, so cracks can pass above or below the external conductor and reach the surface of the sealing member, making it easy for water, contaminant ions, etc. to enter from the outside. was there.

また、クラックが外部導出導体の上を通った場合には、
ワイヤが断線したりするという問題点があった。Also, if a crack passes over the external conductor,
There was a problem that the wire could break.

この発明は、前記のような問題点を解決するためになさ
れたもので、クラックが生じてもそれを外部導出導体先
端部でくい止められる半導体装置を得ることを目的とす
る。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor device that can prevent cracks from occurring at the tips of external conductors.

〔胛題を解決するための手段〕[Means for solving problems]

この発明は、外部導出導体の封止される側の端部に結合
されると井に、その主面が半導体素子載置部材端面角部
に対向するように１クラック阻止部材を設けたものであ
る。In this invention, a crack prevention member is provided at the end of the external lead-out conductor when it is connected to the sealed end so that its main surface faces the corner of the end face of the semiconductor element mounting member. be.

〔作用〕[Effect]

この発明によれば、クラック阻止部材により、封正部材
内で半導体素子載置部材端面角部から発生するクラック
をくい止めることができる。According to this invention, the crack prevention member can prevent cracks occurring from the corner portions of the end faces of the semiconductor element mounting member within the sealing member.

〔発明の夾施例〕[Examples of invention]

第１図は、この発明の一冥施例に使用される外部導出導
体の斜視図であり、（４）　＋　（５）の部分は従来例
におけるものと同等のものである。図において（６）は
先端部をτ型にした外部導出導体である。このような先
端部をＹ型とした外部導出導体を用いた場合、第２図に
示すようにクラックが生じてもＹ型の先端部でクラック
はくい止められ、封止部材表面まで達しなくなる。FIG. 1 is a perspective view of an external lead-out conductor used in one embodiment of the present invention, and portions (4) + (5) are equivalent to those in the conventional example. In the figure, (6) is an external conductor with a τ-shaped tip. When such an external conductor with a Y-shaped tip is used, even if a crack occurs, the Y-shaped tip prevents the crack from reaching the surface of the sealing member.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、外部導出導体の封止さ
れる側の端部にクラック阻止部材を設けたので、半導体
素子載置部材からクラックが生じても、クラックは封止
部材表面まで達さす、クラック阻止部材でくい止められ
、水分、汚染イオン等の侵入を防ぐことができるという
効果がある。As described above, according to the present invention, since the crack prevention member is provided at the end of the external lead-out conductor on the sealed side, even if a crack occurs from the semiconductor element mounting member, the crack will not reach the surface of the sealing member. This has the effect of preventing the penetration of moisture, contaminant ions, etc., by being blocked by the crack prevention member.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の一実施例に使用される外部導出導体
を示す斜視図、第２図はこの発明の一実施例の半導体装
置の断面図、第３図は従来の半導体装置の断面図である
。 なお、各図中、同一符号は同一　または相当部分を示す
。FIG. 1 is a perspective view showing an external conductor used in an embodiment of the present invention, FIG. 2 is a cross-sectional view of a semiconductor device according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional semiconductor device. It is. In each figure, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] 　半導体素子と、この半導体素子を載置する半導体素子
載置部材と、前記半導体素子と金属細線により接続され
る外部導出導体と、前記半導体素子、半導体素子載置部
材および外部導出導体の一部を封止する封止部材と、前
記外部導出導体の前記封止部材で封止される側の端部に
結合されると共にその主面が前記半導体素子載置部材端
面角部に対向するように設けられたクラック阻止部材を
備えたことを特徴とする半導体装置。A semiconductor element, a semiconductor element mounting member on which the semiconductor element is mounted, an external lead-out conductor connected to the semiconductor element by a thin metal wire, and a part of the semiconductor element, the semiconductor element mounting member, and the external lead-out conductor. A sealing member to be sealed and a sealing member connected to the end of the external conductor on the side to be sealed with the sealing member, and provided so that its main surface faces the corner of the end face of the semiconductor element mounting member. What is claimed is: 1. A semiconductor device comprising a crack prevention member having a crack prevention member.
JP12156290A 1990-05-10 1990-05-10 Semiconductor device Pending JPH0417360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12156290A JPH0417360A (en) 1990-05-10 1990-05-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12156290A JPH0417360A (en) 1990-05-10 1990-05-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH0417360A true JPH0417360A (en) 1992-01-22

Family

ID=14814308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12156290A Pending JPH0417360A (en) 1990-05-10 1990-05-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0417360A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495125A (en) * 1993-11-19 1996-02-27 Nec Corporation Molded semiconductor device
US5530281A (en) * 1994-12-21 1996-06-25 Vlsi Technology, Inc. Wirebond lead system with improved wire separation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495125A (en) * 1993-11-19 1996-02-27 Nec Corporation Molded semiconductor device
US5530281A (en) * 1994-12-21 1996-06-25 Vlsi Technology, Inc. Wirebond lead system with improved wire separation

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