JPH0534111Y2 - - Google Patents

Info

Publication number
JPH0534111Y2
JPH0534111Y2 JP1987045869U JP4586987U JPH0534111Y2 JP H0534111 Y2 JPH0534111 Y2 JP H0534111Y2 JP 1987045869 U JP1987045869 U JP 1987045869U JP 4586987 U JP4586987 U JP 4586987U JP H0534111 Y2 JPH0534111 Y2 JP H0534111Y2
Authority
JP
Japan
Prior art keywords
thin wire
protective resin
moisture
protective
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987045869U
Other languages
Japanese (ja)
Other versions
JPS63153541U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987045869U priority Critical patent/JPH0534111Y2/ja
Publication of JPS63153541U publication Critical patent/JPS63153541U/ja
Application granted granted Critical
Publication of JPH0534111Y2 publication Critical patent/JPH0534111Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48991—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on the semiconductor or solid-state body to be connected
    • H01L2224/48992—Reinforcing structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/48997—Reinforcing structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、防湿油封入型デイスプレイパネル等
の装置のように電極等の接続部間をワイヤ細線に
より電気的に接続する装置におけるワイヤ細線の
保護構造に関する。[Detailed description of the invention] [Field of industrial application] The present invention is directed to the use of thin wires in devices that electrically connect connecting parts such as electrodes with thin wires, such as devices such as moisture-proof oil-filled display panels. Concerning protective structures.

〔従来の技術〕[Conventional technology]

基板に半導体等の回路部品を固着し、この回路
部品と前記基板に形成された回路導体とをワイヤ
細線により電気的に接続する技術は周知であり、
その際このワイヤ細線を保護樹脂で覆つて断線等
を防止する構造がある。 The technique of fixing a circuit component such as a semiconductor to a substrate and electrically connecting the circuit component and a circuit conductor formed on the substrate with a thin wire is well known.
At that time, there is a structure in which the thin wire is covered with a protective resin to prevent disconnection and the like.

第２図は保護樹脂による従来のワイヤ細線の保
護構造を示す要部断面図であり、１はベース基
板、２はこのベース基板１に形成された回路導体
である。 FIG. 2 is a sectional view of a main part showing a conventional thin wire protection structure using a protective resin, in which 1 is a base substrate and 2 is a circuit conductor formed on this base substrate 1. In FIG.

３はLSIチツプ等の半導体部品で、この半導体
部品３はその底面を前記ベース基板１の回路導体
２間の設定された搭載位置に位置決めされ、接着
剤４により固着されている。 Reference numeral 3 denotes a semiconductor component such as an LSI chip. The bottom surface of the semiconductor component 3 is positioned at a predetermined mounting position between the circuit conductors 2 of the base board 1, and is fixed with an adhesive 4.

５は前記回路導体２と対応するように半導体部
品３の上面外周に沿つて形成された複数の電極
で、この各電極５と前記回路導体２とを複数本の
ワイヤ細線６により電気的に接続している。 Reference numeral 5 denotes a plurality of electrodes formed along the outer periphery of the upper surface of the semiconductor component 3 so as to correspond to the circuit conductor 2, and each electrode 5 and the circuit conductor 2 are electrically connected by a plurality of thin wires 6. are doing.

そして、このワイヤ細線６は極めて細い導体で
あることから外力により切断されたりあるいは剥
離等を起すと接続に支障をきたす恐れがあるた
め、保護樹脂７を半導体部品３及びワイヤ細線６
の全体に上方より被覆して保護している。 Since the wire thin wire 6 is an extremely thin conductor, if it is cut or peeled off by external force, it may cause a problem in connection.
The entire area is covered and protected from above.

第３図は、第２図において説明したワイヤ細線
の保護構造を防湿油封入型ELデイスプレイパネ
ルに応用した場合の従来のワイヤ細線の保護構造
を示す要部断面図である。 FIG. 3 is a sectional view of a main part showing a conventional thin wire protection structure when the thin wire protection structure explained in FIG. 2 is applied to a moisture-proof oil-filled EL display panel.

図において、８はガラス基板等の透明基板、９
はこの透明基板８に形成された複数本から成る透
明電極、１０はこの透明電極９の一端部に重畳形
成されたアルミ電極である。 In the figure, 8 is a transparent substrate such as a glass substrate, 9
10 is a transparent electrode consisting of a plurality of electrodes formed on the transparent substrate 8, and 10 is an aluminum electrode formed on one end of the transparent electrode 9.

１１は底面の所定個所を接着剤１２により前記
透明基板８に固着された回路基板で、この回路基
板１１には複数本の回路導体１３が前記アルミ電
極１０と対応するように形成されている。１４は
この回路導体１３の一端の電極部にその一端を結
合している複数本のワイヤ細線で、この各ワイヤ
細線１４の他端を前記アルミ電極１０に接続する
ことにより回路基板１１の回路導体１３と透明基
板８上の透明電極９は電気的に接続されている。 Reference numeral 11 denotes a circuit board whose bottom surface is fixed to the transparent substrate 8 at predetermined locations with an adhesive 12, and a plurality of circuit conductors 13 are formed on this circuit board 11 so as to correspond to the aluminum electrodes 10. Reference numeral 14 denotes a plurality of thin wires, one end of which is connected to the electrode portion at one end of the circuit conductor 13. By connecting the other end of each thin wire 14 to the aluminum electrode 10, the circuit conductor of the circuit board 11 is connected. 13 and the transparent electrode 9 on the transparent substrate 8 are electrically connected.

１５は保護樹脂で、樹脂硬化応力によつて透明
基板８を破損させない材質のものを用いている。 A protective resin 15 is made of a material that will not damage the transparent substrate 8 due to resin curing stress.

このように接続部分は、第２図において説明し
たのと同様に極めて細い導体のワイヤ細線１４と
なるためこのワイヤ細線１４が切断したり剥離す
ることのないように保護樹脂１５によりワイヤ細
線１４全体を被覆して保護している。 In this way, the connecting portion is made of a thin wire 14 of an extremely thin conductor, as explained in FIG. is covered and protected.

１６は片面を開口した箱形の封止板で、この封
止板１６は前記回路基板１１全体を上方から封じ
込めるように接着剤１７により透明基板８に気密
状態に固着されている。 Reference numeral 16 denotes a box-shaped sealing plate with one side open, and the sealing plate 16 is hermetically fixed to the transparent substrate 8 with an adhesive 17 so as to seal the entire circuit board 11 from above.

１８は前記気密状態の封止板１６の内部に充填
されている防湿油で、EL発光素子の放電破壊現
象等を防ぐものである。 Reference numeral 18 denotes a moisture-proofing oil filled inside the sealing plate 16 in an airtight state, which prevents discharge breakdown of the EL light emitting element.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

しかしながら上述した従来の技術においては以
下に述べる問題がある。 However, the above-mentioned conventional technology has the following problems.

すなわち、第４図は防湿油による保護樹脂の膨
潤応力の発生状態を示す図で、この図に示すごと
く封止板内に充填された防湿油がワイヤ細線を被
覆している保護樹脂に浸潤し、これにより保護樹
脂が破線で示した大きさから実線で示した大きさ
に膨張して矢印方向に膨潤応力が発生する。 In other words, Figure 4 shows the state in which swelling stress is generated in the protective resin due to the moisture-proof oil.As shown in this figure, the moisture-proof oil filled in the sealing plate infiltrates the protective resin covering the thin wire. As a result, the protective resin expands from the size shown by the broken line to the size shown by the solid line, and swelling stress is generated in the direction of the arrow.

このため、この膨潤応力がワイヤ細線に働いて
悪影響を及ぼし、ワイヤ細線が切断したり、アル
ミ電極あるいは回路導体に対して剥離する等接続
状態に支障をきたし信頼性が低くなつてしまうと
いう問題があつた。 For this reason, this swelling stress acts on the thin wire and has an adverse effect, causing problems such as the thin wire breaking or peeling off from the aluminum electrode or circuit conductor, resulting in problems with the connection and lowering reliability. It was hot.

そこで本考案は前記問題点を解決するためにな
されたものであり、ワイヤ細線が保護樹脂の膨潤
応力に悪影響を受けることなく、信頼性のあるワ
イヤ細線の保護構造を提供することを目的とす
る。 Therefore, the present invention has been devised to solve the above-mentioned problems, and its purpose is to provide a reliable protective structure for thin wires without the thin wires being adversely affected by the swelling stress of the protective resin. .

〔問題点を解決するための手段〕[Means for solving problems]

上述した目的を達成するため本考案は、たとえ
ば防湿油封入型ELデイスプレイパネルのように
電極等の接続部間をワイヤ細線で接続すると共
に、該接続部を保護樹脂により被覆し、かつ該保
護樹脂に防湿油を直接接触させる構造をもつ装置
におけるワイヤ細線の保護構造において、ワイヤ
細線の一端と一方の接続部との結合部と、ワイヤ
細線の他端と他方の接続部との結合部を別々に前
記保護樹脂で被覆したものである。 In order to achieve the above-mentioned object, the present invention connects connecting parts such as electrodes with thin wires, as in a moisture-proof oil-filled EL display panel, and also covers the connecting parts with a protective resin. In a protective structure for a thin wire in a device that has a structure in which moisture-proofing oil is brought into direct contact with is coated with the above-mentioned protective resin.

〔作用〕[Effect]

上述したようにワイヤ細線の一端と一方の接続
部との結合部と、ワイヤ細線の他端と他方の接続
部との接合部を別々に前記保護樹脂で被覆したの
で、防湿油が浸潤することにより保護樹脂が膨張
する割合が従来に較べて小さくなつて膨潤応力を
減少させることができる。 As described above, since the joint between one end of the thin wire and one connection part and the joint between the other end of the thin wire and the other connection part were separately coated with the protective resin, moisture-proof oil would not infiltrate. As a result, the rate at which the protective resin expands becomes smaller than in the past, and swelling stress can be reduced.

このためワイヤ細線に加わる膨潤応力は小さく
なるので従来のように切断や剥離等を生じること
がなくなり、接続状態に支障をきたすことがない
ので、信頼性のある保護構造を提供することがで
きる。 For this reason, the swelling stress applied to the thin wire is reduced, so there is no possibility of cutting or peeling as in the conventional case, and there is no problem with the connection state, so a reliable protective structure can be provided.

〔実施例〕〔Example〕

以下本考案の実施例を図面に基づいて説明す
る。 Embodiments of the present invention will be described below based on the drawings.

第１図は防湿油封入型ELデイスプレイパネル
におけるワイヤ細線の保護構造の一実施例を示す
要部断面図である。 FIG. 1 is a sectional view of a main part showing an embodiment of a protective structure for thin wires in a moisture-proof oil-filled EL display panel.

図において８は透明基板、９は透明電極、１０
はアルミ電極、１１は回路基板、１２は接着剤、
１３は回路導体、１４はワイヤ細線、１５は保護
樹脂、１６は封止板、１７は接着剤、１８は防湿
油であり、これらは第３図の従来のワイヤ細線の
保護構造を示す要部断面図において説明したもの
とほぼ同様のものであり、また、構成においても
保護樹脂１５のみを除いては同様に構成されてい
るため同一の符号を付しその説明は省略する。 In the figure, 8 is a transparent substrate, 9 is a transparent electrode, and 10
is an aluminum electrode, 11 is a circuit board, 12 is an adhesive,
13 is a circuit conductor, 14 is a wire thin wire, 15 is a protective resin, 16 is a sealing plate, 17 is an adhesive, and 18 is a moisture-proof oil, these are the main parts showing the conventional protective structure for a wire thin wire in FIG. Since it is almost the same as that explained in the cross-sectional view, and has the same structure except for the protective resin 15, the same reference numerals are given and the explanation thereof will be omitted.

さて、保護樹脂１５は従来の材質と同様に透明
基板８を破損させない材質のもので形成されたも
のであり、この保護樹脂１５をワイヤ細線１４の
一端と回路基板１１の回路導体１３との結合部の
周囲、及びワイヤ細線１４の他端と透明基板８の
アルミ電極９との結合部の周囲の２ケ所、つまり
ワイヤ細線１４の中間部分を露出するようにその
両端部分をワイヤ細線１４の全長1/3〜1/2程度の
厚さで被覆した構造としている。 Now, the protective resin 15 is made of a material that does not damage the transparent substrate 8 like the conventional material, and this protective resin 15 is bonded to one end of the thin wire 14 and the circuit conductor 13 of the circuit board 11. The entire length of the thin wire 14 is exposed at two places around the periphery of the thin wire 14 and around the joint between the other end of the thin wire 14 and the aluminum electrode 9 of the transparent substrate 8, that is, the middle portion of the thin wire 14. The structure is coated with a thickness of about 1/3 to 1/2.

このためワイヤ細線に加わる膨潤応力は小さく
なるのでワイヤ細線の切断や剥離等を防止する。 Therefore, the swelling stress applied to the thin wire becomes small, thereby preventing the thin wire from being cut or peeled off.

なお本実施例においては、防湿油封入型ELデ
イスプレイパネルで説明したがこれに限るもので
はなく電極等の接続部間をワイヤ細線で接続する
と共に該接続部を保護樹脂により被覆し、かつこ
の保護樹脂に防湿油を直接接触させる構造をもつ
装置であれば他の装置においても適用可能であ
る。 In this example, a moisture-proof oil-filled EL display panel was explained, but the present invention is not limited to this. The connection parts such as electrodes are connected with thin wires, and the connection parts are covered with a protective resin, and this protection is not limited to this. The invention can also be applied to other devices as long as they have a structure that allows moisture-proofing oil to come into direct contact with resin.

〔考案の効果〕[Effect of idea]

以上説明したように本考案によれば、たとえば
防湿油封入型ELデイスプレイパネルのように電
極等の接続部間をワイヤ細線で接続すると共に、
該接続部を保護樹脂により被覆し、かつ該保護樹
脂に防湿油を直接接触させる構造をもつ装置にお
けるワイヤ細線の保護構造において、ワイヤ細線
の一端と一方の接続部との結合部と、ワイヤ細線
の他端と他方の接続部との結合部を別々に前記保
護樹脂で被覆することとした。 As explained above, according to the present invention, for example, in a moisture-proof oil-filled EL display panel, connecting parts such as electrodes are connected with thin wires, and
In a protective structure for a thin wire in a device having a structure in which the connecting portion is coated with a protective resin and a moisture-proofing oil is brought into direct contact with the protective resin, a connecting portion between one end of the thin wire and one connecting portion, and a thin wire The joint portion between the other end and the other connection portion was separately coated with the protective resin.

このため防湿油による保護樹脂の膨潤応力は小
さくなるのでワイヤ細線の両端の結合部に加わる
応力も小さくなり、しかもワイヤ細線の中間部分
は保護樹脂に被覆されず露出しているため膨潤応
力の影響を受けることがなく、従来のようにワイ
ヤ細線の切断や剥離等が発生するのを防止するこ
とができ、従つて接続状態に支障をきたす恐れの
ない信頼性のある接続構造を提供することができ
る。 For this reason, the swelling stress of the protective resin due to the moisture-proofing oil is reduced, so the stress applied to the joints at both ends of the thin wire is also reduced.Moreover, the middle part of the thin wire is not covered with the protective resin and is exposed, so it is not affected by the swelling stress. Therefore, it is possible to provide a reliable connection structure that does not cause any damage to the connection state, and can prevent the occurrence of cutting or peeling of thin wires as in the past. can.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は防湿油封入型ELデイスプレイパネル
におけるワイヤ細線の保護構造の一実施例を示す
要部断面図、第２図は従来のワイヤ細線の保護構
造を示す要部断面図、第３図は防湿油封入型EL
デイスプレイパネルにおける従来のワイヤ細線保
護構造を示す要部断面図、第４図は防湿油による
保護樹脂の膨潤応力の発生状態を示す図である。 ８……透明基板、１０……アルミ電極、１１…
…回路基板、１３……回路導体、１４……ワイヤ
細線、１５……保護樹脂、１６……封止板、１８
……防湿油。 Figure 1 is a cross-sectional view of a main part showing an example of a protective structure for thin wires in a moisture-proof oil-filled EL display panel, Figure 2 is a cross-sectional view of a main part showing a conventional protective structure for thin wires, and Figure 3 is Moisture-proof oil-filled EL
FIG. 4 is a cross-sectional view of a main part showing a conventional thin wire protection structure for a display panel, and is a diagram showing a state in which swelling stress is generated in a protective resin due to moisture-proofing oil. 8...Transparent substrate, 10...Aluminum electrode, 11...
... Circuit board, 13 ... Circuit conductor, 14 ... Fine wire, 15 ... Protective resin, 16 ... Sealing plate, 18
...Moisture-proof oil.

Claims (1)

【実用新案登録請求の範囲】 電極等の接続部間をワイヤ細線で接続すると共
に、該接続部を保護樹脂により被覆し、かつ該保
護樹脂に防湿油を直接接触させる構造をもつ装置
におけるワイヤ細線の保護構造において、 ワイヤ細線の一端と一方の接続部との結合部
と、ワイヤ細線の他端と他方の接続部との結合部
を別々に前記保護樹脂で被覆したことを特徴とす
るワイヤ細線の保護構造。[Claims for Utility Model Registration] A thin wire in a device having a structure in which a thin wire connects connecting parts such as electrodes, the connecting part is covered with a protective resin, and the protective resin is brought into direct contact with a moisture-proof oil. In the protective structure of the thin wire, a joint portion between one end of the thin wire wire and one connection portion and a joint portion between the other end of the thin wire wire and the other connection portion are separately coated with the protective resin. protective structure.
JP1987045869U 1987-03-30 1987-03-30 Expired - Lifetime JPH0534111Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987045869U JPH0534111Y2 (en) 1987-03-30 1987-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987045869U JPH0534111Y2 (en) 1987-03-30 1987-03-30

Publications (2)

Publication Number Publication Date
JPS63153541U JPS63153541U (en) 1988-10-07
JPH0534111Y2 true JPH0534111Y2 (en) 1993-08-30

Family

ID=30865005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987045869U Expired - Lifetime JPH0534111Y2 (en) 1987-03-30 1987-03-30

Country Status (1)

Country Link
JP (1) JPH0534111Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6750835B2 (en) * 1999-12-27 2004-06-15 Semiconductor Energy Laboratory Co., Ltd. Image display device and driving method thereof

Also Published As

Publication number Publication date
JPS63153541U (en) 1988-10-07

Similar Documents

Publication Publication Date Title
KR930014905A (en) Hermetic Packaged High Density Interconnect (HDI) Electronic Systems
KR950004467A (en) Semiconductor device and manufacturing method
JP2000223645A (en) Semiconductor device
KR910019184A (en) Semiconductor device and manufacturing method thereof, lead frame and memory card and manufacturing method thereof
KR930024140A (en) Semiconductor device and manufacturing method
US5744860A (en) Power semiconductor module
JPH0534111Y2 (en)
JPH0793195B2 (en) EL display panel
KR950014118B1 (en) Semiconductor device
JPS6239036A (en) Hybrid ic
JP2003086925A (en) Printed board with moisture-proofing structure and its manufacturing method
KR102068162B1 (en) Terminal structure of chip package
JP2001203302A (en) Junction structure of semiconductor device
JPH01287934A (en) Structure for mounting ic chip on flexible printed board
JPS6056297B2 (en) Airtight mounting structure for integrated circuit elements
JPH01123428A (en) Resin sealed semiconductor device
JPS61260657A (en) Semiconductor device
JPS63300541A (en) Semiconductor device package
JP2554059Y2 (en) Semiconductor device mounting structure
JPH0236280Y2 (en)
RU1683447C (en) Microassembly
JPS59201483A (en) Method of producing hybrid integrated circuit
JPH0714934A (en) Cap sealing type electronic component and its manufacture
JPS61108142A (en) Semiconductor integrated circuit
JPS6224588A (en) Surge protector