JPH04167719A - Data carrier - Google Patents
Data carrierInfo
- Publication number
- JPH04167719A JPH04167719A JP2294659A JP29465990A JPH04167719A JP H04167719 A JPH04167719 A JP H04167719A JP 2294659 A JP2294659 A JP 2294659A JP 29465990 A JP29465990 A JP 29465990A JP H04167719 A JPH04167719 A JP H04167719A
- Authority
- JP
- Japan
- Prior art keywords
- data carrier
- data
- coil
- data transmission
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 230000010354 integration Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000969 carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は工作機の工具や工場における部品、製品の管理
又は物流システム等の物品識別システムに用いられるデ
ータキャリアに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a data carrier used in an article identification system such as a tool for a machine tool, a part in a factory, a product management system, or a distribution system.
従来工作機の工具の管理や工場における組立搬送ライン
での部品、製品の識別等を機械化するためには、工具１
部品、製品等の種々の物品を識別して管理するシステム
が必要となる。そこで特開平１−１５１８３’２号のよ
うに識別対象物にメモリを有するデータキャリアを設け
、外部からデータ伝送によってデータキャリアのメモリ
に必要な情報を書込んでおき、必要に応じてその情報を
読出ずようにした物品識別システムが提案されている。In order to mechanize the tool management of conventional machine tools and the identification of parts and products on assembly lines in factories, tools 1
A system is needed to identify and manage various items such as parts and products. Therefore, as in Japanese Patent Application Laid-Open No. 1-15183'2, a data carrier having a memory is provided in the object to be identified, and necessary information is written in the memory of the data carrier by data transmission from the outside, and the information is transmitted as needed. Article identification systems that do not allow reading have been proposed.
従来の物品識別システムでは、データキャリアと書込／
読出制御ユニットとの間は電磁結合等によって夫々コイ
ルを用いてデータ伝送及び電力伝送を行っている。In conventional article identification systems, data carriers and
Data and power are transmitted between the readout control unit and the readout control unit by means of electromagnetic coupling or the like using respective coils.
しかるにこのような従来の物品識別システムにおいては
、データキャリアはできるだけ小型化することが要求さ
れる。データキャリアを小型化することができれば例え
ばプリント基板の製造工程等においてプリント基板のバ
ージョンやプリント基板上に実装される部品の識別等を
容易に行うことができ、又プリント基板が組込まれる電
子機器の管理も容易となる。データキャリアを小型化す
るためにはデータキャリア内の電子回路をＩＣ化するこ
とが行われるが、データキャリアのコイル部と電子回路
部分とをはんだ付けする必要があり、組立作業性を向上
させることができないという欠点があった。However, in such conventional article identification systems, the data carrier is required to be as small as possible. If the data carrier can be miniaturized, it will be possible to easily identify the version of the printed circuit board and the components mounted on the printed circuit board during the printed circuit board manufacturing process, and it will also be possible to easily identify the version of the printed circuit board and the components mounted on the printed circuit board. Management is also easier. In order to miniaturize the data carrier, the electronic circuit inside the data carrier is integrated into an IC, but it is necessary to solder the coil part of the data carrier and the electronic circuit part, which improves assembly workability. The drawback was that it was not possible.
本発明はこのような従来のデータキャリアの問題点に鑑
みてなされたものであって、データキャリアとデータキ
ャリア内の電子回路とを一体化して小型化できるように
することを技術的課題とする。The present invention has been made in view of these problems with conventional data carriers, and its technical problem is to integrate a data carrier and an electronic circuit within the data carrier so that they can be miniaturized. .
本発明は、コイルと、コイルに接続され書込／読出制御
ユニットとの間でデータ伝送を行うデータ伝送手段と、
データを保持するメモリと、データ伝送手段より得られ
る信号に基づいてメモリにデータを書込み又はメモリか
らデータを読出すメモリ制御部とを有するデータキャリ
アであって、データキャリアのデータ伝送手段を構成す
るＩＣチップ上に絶縁層を形成し、その上面にＩＣチッ
プ内の配線パターンによってコイルを形成したことを特
徴とするものである。The present invention provides data transmission means for transmitting data between a coil and a write/read control unit connected to the coil;
A data carrier comprising a memory that holds data and a memory control unit that writes data to or reads data from the memory based on a signal obtained from the data transmission means, and constitutes the data transmission means of the data carrier. It is characterized in that an insulating layer is formed on the IC chip, and a coil is formed on the upper surface of the insulating layer according to the wiring pattern within the IC chip.
〔作用］
このような特徴を有する本発明によれば、データキャリ
アのデータ伝送手段をＩＣ化し、その上面にＩＣの内部
回路の配線用パターンによってコイルを形成しており、
その上面よりリードライトへンドを近接させることによ
ってデータキャリア内のメモリに必要なデータを書込め
又は読出ずようにしている。[Function] According to the present invention having such characteristics, the data transmission means of the data carrier is integrated into an IC, and a coil is formed on the upper surface of the IC using a wiring pattern of the internal circuit of the IC.
By bringing the read/write end closer to the upper surface of the data carrier, it is possible to prevent necessary data from being written to or read from the memory within the data carrier.
〔実施例］
第１図は本発明の一実施例によるデータキャリアのモー
ルドを除いた内部の構造を示す立面図及びそのＡ−Ａ線
断面図である。これらの図に示すようにデータキャリア
は、少なくともデータ伝送手段及び電源回路がサブスト
レート１上にモノリシックＩＣ２として実装されている
。そしてその上部には図示のように絶縁層３を形成する
。絶縁層３は例えばポリイミド等の絶縁材料を用いるも
のとし、その上面に例えばＩＣ内に用いられるアルミニ
ウム等による回路配線用パターンによって渦巻型のコイ
ル４を形成する。このコイルパターン部は第１図の実施
例では単層としているが、絶縁層とコイルパターンとを
多層に形成することもできる。こうして構成されるコイ
ル４とＩＣとをワイヤボンディング又は内部配線によっ
て接続する。こうしてコイル４を一体化したＩＣチップ
５をリードフレーム６上に取付け、モールド樹脂７で被
ってリードフレーム６をフォーミングしてその端部を切
断することによって、第２図に示すようにデータキャリ
アを構成する。この場合にはコイルパターンを有する部
分がリードライトヘッドとの通信面となる。[Embodiment] FIG. 1 is an elevational view showing the internal structure of a data carrier excluding a mold according to an embodiment of the present invention, and a sectional view thereof taken along the line A-A. As shown in these figures, the data carrier has at least a data transmission means and a power supply circuit mounted on a substrate 1 as a monolithic IC 2. Then, an insulating layer 3 is formed on top of the insulating layer 3 as shown in the figure. The insulating layer 3 is made of an insulating material such as polyimide, and a spiral coil 4 is formed on its upper surface by a circuit wiring pattern made of aluminum or the like used in ICs. Although this coil pattern portion is formed as a single layer in the embodiment shown in FIG. 1, it can also be formed as a multilayer structure including an insulating layer and a coil pattern. The coil 4 constructed in this manner and the IC are connected by wire bonding or internal wiring. The IC chip 5 with the coil 4 integrated therein is mounted on the lead frame 6, covered with molding resin 7, the lead frame 6 is formed, and its ends are cut to form a data carrier as shown in FIG. Configure. In this case, the portion having the coil pattern becomes the communication surface with the read/write head.
次に第３図は本実施例によるデータキャリアの全体構成
を示すブロック図である。本図において前述したＩＣチ
ップ５ａ内にコイル４とデータ伝送・電源回路部１１が
形成されている場合には、その外部にメモリ制御部用の
電子回路から成る■ＣＩ２及びメモリＩＣｌ３を実装す
ることが必要となる。そしてメモリ１３にはバックアッ
プ用の電池１４を接続する。Next, FIG. 3 is a block diagram showing the overall configuration of the data carrier according to this embodiment. In this figure, when the coil 4 and the data transmission/power supply circuit section 11 are formed in the IC chip 5a described above, the CI2 and memory ICl3 consisting of an electronic circuit for a memory control section are mounted outside the coil 4. Is required. A backup battery 14 is connected to the memory 13.
又第４図に示すようにメモリに不揮発性メモリ１５、例
えばＥ２ＦＲＯＭを用いればバックアップ用の電池を用
いる必要はない。又第５図及び第６図に示すようにメモ
リ制御部１２とメモリ１３又は不揮発性メモリ１５とを
一体化したＩＣ１６又は１７を用いてデータキャリアを
構成することもできる。この場合には第１図に示したデ
ータキャリアのＩＣチップ５ａと組合せて２つのＩＣで
データキャリアを実現することができる。Further, if a non-volatile memory 15 such as E2FROM is used as the memory as shown in FIG. 4, there is no need to use a backup battery. Further, as shown in FIGS. 5 and 6, the data carrier can also be configured using an IC 16 or 17 in which the memory control section 12 and the memory 13 or nonvolatile memory 15 are integrated. In this case, the data carrier can be realized with two ICs in combination with the data carrier IC chip 5a shown in FIG.
更に第７図に示すようにＩＣチップ５ｂ内にデータ伝送
・電源回路部１１．メモリ制御部１２゜メモリ１３を含
む場合には、外部にバックアンプ用の電池１４を接続す
るだけでデータキャリアを構成することができる。更に
このときに第８図に示すように、メモリに不揮発性メモ
リ１５を用いたＩＣチップ５Ｃとすれば外部に何らの素
子を接続することがなく、データキャリアを構成するこ
とができる。この場合には第９図に示すようにＩＣチッ
プ５ｃを全てモールド樹脂７で覆うことによって、完全
に密封型で外部端子を有しないデータキャリアとするこ
とができる。Furthermore, as shown in FIG. 7, a data transmission/power supply circuit section 11. is provided within the IC chip 5b. When the memory control section 12 includes the memory 13, a data carrier can be configured simply by connecting a battery 14 for a back amplifier to the outside. Furthermore, as shown in FIG. 8, if an IC chip 5C using a non-volatile memory 15 is used as the memory, a data carrier can be constructed without connecting any external elements. In this case, as shown in FIG. 9, by covering the entire IC chip 5c with molding resin 7, a completely sealed data carrier having no external terminals can be obtained.
以上詳細に説明したように本発明によれば、データキャ
リアのコイル部がデータ伝送・電源回路部と一体に形成
されるため、極めて小型のデータキャリアを実現するこ
とができる。更にコイル部の組立てや電子回路との接続
が不要となり、低価格化が可能となる。更に１つのＩＣ
内にデータ伝送用の回路とメモリ制御部、不揮発性メモ
リとを一体化することによって、外部端子がなく１つの
パッケージでデータキャリアの組立てを完了させること
ができる。この場合にはデータキャリアを超小型化する
ことができ、低価格化も可能となる。As described above in detail, according to the present invention, since the coil section of the data carrier is formed integrally with the data transmission/power supply circuit section, it is possible to realize an extremely small data carrier. Furthermore, there is no need to assemble the coil section or connect it to an electronic circuit, making it possible to reduce costs. One more IC
By integrating a data transmission circuit, a memory control unit, and a nonvolatile memory within the package, the data carrier can be assembled in one package without external terminals. In this case, the data carrier can be made ultra-small and the cost can also be reduced.
第１図は本発明の実施例によるデータキャリアのＩＣチ
ップ部の構成を示す立面図及び側面図、第２図はこのＩ
Ｃチップを樹脂でパッケージした例を示す断面図、第３
図〜第８図は本実施例のデータキャリアの電気的構成を
示すブロック図、第９図は本発明の第２実施例によるデ
ータキャリアの構造を示す断面図である。
１−一一−−−サブストレート ２−−−−−モノリ
シックＩＣ３−−−−−−・絶縁層 ４−・・−コイ
ル ５，５ａ 〜、５ ｃ −−−−−Ｉ Ｃチップ
６−−−−リードフレーム ７−−−−−−−モ
ールド樹脂 １１−−−−−データ伝送・電源回路部
１２−−一−−−メモリ制御部 １３−−一一−
−−メモリ １４−−−−一重部 １５−−−−−
−一不揮発性メモリ
特許出願人 オムロン株式会社
代理人 弁理士 岡本宜喜（他１名）
ｉく
４くFIG. 1 is an elevation view and a side view showing the configuration of an IC chip portion of a data carrier according to an embodiment of the present invention, and FIG.
Cross-sectional view showing an example of C chip packaged with resin, No. 3
8 are block diagrams showing the electrical configuration of the data carrier of this embodiment, and FIG. 9 is a sectional view showing the structure of the data carrier according to the second embodiment of the present invention. 1-11---Substrate 2-------Monolithic IC3-----Insulating layer 4--Coil 5, 5a ~, 5c----IC chip 6-- --Lead frame 7-----Mold resin 11--Data transmission/power supply circuit section 12--1--Memory control section 13--11-
---Memory 14-----Single part 15-----
-Non-volatile memory patent applicant Omron Co., Ltd. agent Patent attorney Yoshiki Okamoto (and 1 other person) iku4ku
Claims (1)
ユニットとの間でデータ伝送を行うデータ伝送手段と、
データを保持するメモリと、前記データ伝送手段より得
られる信号に基づいて前記メモリにデータを書込み又は
メモリからデータを読出すメモリ制御部とを有するデー
タキャリアにおいて、 前記データキャリアのデータ伝送手段を構成するＩＣチ
ップ上に絶縁層を形成し、その上面にＩＣチップ内の配
線パターンによって前記コイルを形成したことを特徴と
するデータキャリア。(1) data transmission means for transmitting data between a coil and a write/read control unit connected to the coil;
A data carrier comprising a memory that holds data and a memory control unit that writes data to or reads data from the memory based on a signal obtained from the data transmission means, the data transmission means of the data carrier comprising: A data carrier characterized in that an insulating layer is formed on an IC chip, and the coil is formed on the upper surface of the insulating layer according to a wiring pattern in the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2294659A JP2982286B2 (en) | 1990-10-30 | 1990-10-30 | Data carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2294659A JP2982286B2 (en) | 1990-10-30 | 1990-10-30 | Data carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04167719A true JPH04167719A (en) | 1992-06-15 |
| JP2982286B2 JP2982286B2 (en) | 1999-11-22 |
Family
ID=17810636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2294659A Expired - Lifetime JP2982286B2 (en) | 1990-10-30 | 1990-10-30 | Data carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2982286B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001351082A (en) * | 2000-06-08 | 2001-12-21 | Dainippon Printing Co Ltd | Noncontact ic chip, noncontact ic module, and noncontact ic information processing medium |
| JP2007241997A (en) * | 2006-02-10 | 2007-09-20 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| JP2007280084A (en) * | 2006-04-07 | 2007-10-25 | Oki Electric Ind Co Ltd | Semiconductor device and manufacturing method therefor |
| JP2009207129A (en) * | 2008-01-31 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| JP2011128719A (en) * | 2009-12-15 | 2011-06-30 | Renesas Electronics Corp | External storage device and method of manufacturing the same |
| US8772917B2 (en) | 2006-02-10 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an antenna |
| JP2014170587A (en) * | 2014-05-26 | 2014-09-18 | Renesas Electronics Corp | External storage device |
| WO2020209261A1 (en) | 2019-04-10 | 2020-10-15 | 株式会社エスケーエレクトロニクス | Contactless information carrier |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4767653B2 (en) * | 2004-10-22 | 2011-09-07 | 株式会社半導体エネルギー研究所 | Semiconductor device and wireless chip |
| KR101258672B1 (en) | 2004-10-22 | 2013-04-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Semiconductor device |
-
1990
- 1990-10-30 JP JP2294659A patent/JP2982286B2/en not_active Expired - Lifetime
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4620836B2 (en) * | 2000-06-08 | 2011-01-26 | 大日本印刷株式会社 | Wafer manufacturing method |
| JP2001351082A (en) * | 2000-06-08 | 2001-12-21 | Dainippon Printing Co Ltd | Noncontact ic chip, noncontact ic module, and noncontact ic information processing medium |
| US8772917B2 (en) | 2006-02-10 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an antenna |
| US9437777B2 (en) | 2006-02-10 | 2016-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with antenna and light-emitting element |
| US9768210B2 (en) | 2006-02-10 | 2017-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having antenna and sensor elements |
| JP2007241997A (en) * | 2006-02-10 | 2007-09-20 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| JP2007280084A (en) * | 2006-04-07 | 2007-10-25 | Oki Electric Ind Co Ltd | Semiconductor device and manufacturing method therefor |
| JP2009207129A (en) * | 2008-01-31 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
| US9460377B2 (en) | 2008-01-31 | 2016-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN102130103A (en) * | 2009-12-15 | 2011-07-20 | 瑞萨电子株式会社 | External storage device and method of manufacturing external storage device |
| CN104253101A (en) * | 2009-12-15 | 2014-12-31 | 瑞萨电子株式会社 | External storage device and method of manufacturing external storage device |
| US8705238B2 (en) | 2009-12-15 | 2014-04-22 | Renesas Electronics Corporation | External storage device and method of manufacturing external storage device |
| US9666659B2 (en) | 2009-12-15 | 2017-05-30 | Renesas Electronics Corporation | External storage device and method of manufacturing external storage device |
| JP2011128719A (en) * | 2009-12-15 | 2011-06-30 | Renesas Electronics Corp | External storage device and method of manufacturing the same |
| JP2014170587A (en) * | 2014-05-26 | 2014-09-18 | Renesas Electronics Corp | External storage device |
| WO2020209261A1 (en) | 2019-04-10 | 2020-10-15 | 株式会社エスケーエレクトロニクス | Contactless information carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2982286B2 (en) | 1999-11-22 |
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