JPH04167719A - Data carrier - Google Patents

Data carrier

Info

Publication number
JPH04167719A
JPH04167719A JP2294659A JP29465990A JPH04167719A JP H04167719 A JPH04167719 A JP H04167719A JP 2294659 A JP2294659 A JP 2294659A JP 29465990 A JP29465990 A JP 29465990A JP H04167719 A JPH04167719 A JP H04167719A
Authority
JP
Japan
Prior art keywords
data carrier
coil
circuit
data transmission
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2294659A
Other languages
Japanese (ja)
Other versions
JP2982286B2 (en
Inventor
Kazunori Morikawa
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2294659A priority Critical patent/JP2982286B2/en
Publication of JPH04167719A publication Critical patent/JPH04167719A/en
Application granted granted Critical
Publication of JP2982286B2 publication Critical patent/JP2982286B2/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17810636&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH04167719(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To make a data carrier small by adopting circuit integration for a data transmission means and forming a coil onto the upper face of the means by means of a wiring pattern being an internal circuit of the IC.
CONSTITUTION: A data transmission means and a power supply circuit are mounted on a substrate 1 as a monolithic IC 2, an insulation layer 3 is formed on the IC 2 and a spiral coil 4 is formed on the upper face of the insulation layer 3 with a circuit wiring pattern made of an aluminum used for the IC. The coil 4 and the IC 2 formed in this way are connected by wire bonding or internal wiring. Since the coil 4 being a data carrier is formed integrally with the data transmission means and the power supply circuit section, the very small sized data carrier is realized.
COPYRIGHT: (C)1992,JPO&Japio
JP2294659A 1990-10-30 1990-10-30 Data carrier Expired - Lifetime JP2982286B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2294659A JP2982286B2 (en) 1990-10-30 1990-10-30 Data carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2294659A JP2982286B2 (en) 1990-10-30 1990-10-30 Data carrier

Publications (2)

Publication Number Publication Date
JPH04167719A true JPH04167719A (en) 1992-06-15
JP2982286B2 JP2982286B2 (en) 1999-11-22

Family

ID=17810636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2294659A Expired - Lifetime JP2982286B2 (en) 1990-10-30 1990-10-30 Data carrier

Country Status (1)

Country Link
JP (1) JP2982286B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351082A (en) * 2000-06-08 2001-12-21 Dainippon Printing Co Ltd Noncontact ic chip, noncontact ic module, and noncontact ic information processing medium
JP2007241997A (en) * 2006-02-10 2007-09-20 Semiconductor Energy Lab Co Ltd Semiconductor device
JP2007280084A (en) * 2006-04-07 2007-10-25 Oki Electric Ind Co Ltd Semiconductor device and manufacturing method therefor
JP2009207129A (en) * 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd Semiconductor device
JP2011128719A (en) * 2009-12-15 2011-06-30 Renesas Electronics Corp External storage device and method of manufacturing the same
US8772917B2 (en) 2006-02-10 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an antenna
JP2014170587A (en) * 2014-05-26 2014-09-18 Renesas Electronics Corp External storage device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101044624A (en) 2004-10-22 2007-09-26 株式会社半导体能源研究所 Semiconductor device
JP4767653B2 (en) * 2004-10-22 2011-09-07 株式会社半導体エネルギー研究所 Semiconductor device and wireless chip

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351082A (en) * 2000-06-08 2001-12-21 Dainippon Printing Co Ltd Noncontact ic chip, noncontact ic module, and noncontact ic information processing medium
JP4620836B2 (en) * 2000-06-08 2011-01-26 大日本印刷株式会社 Wafer manufacturing method
JP2007241997A (en) * 2006-02-10 2007-09-20 Semiconductor Energy Lab Co Ltd Semiconductor device
US9437777B2 (en) 2006-02-10 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with antenna and light-emitting element
US8772917B2 (en) 2006-02-10 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an antenna
US9768210B2 (en) 2006-02-10 2017-09-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having antenna and sensor elements
JP2007280084A (en) * 2006-04-07 2007-10-25 Oki Electric Ind Co Ltd Semiconductor device and manufacturing method therefor
US9460377B2 (en) 2008-01-31 2016-10-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2009207129A (en) * 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd Semiconductor device
JP2011128719A (en) * 2009-12-15 2011-06-30 Renesas Electronics Corp External storage device and method of manufacturing the same
CN104253101A (en) * 2009-12-15 2014-12-31 瑞萨电子株式会社 External storage device and method of manufacturing external storage device
CN102130103A (en) * 2009-12-15 2011-07-20 瑞萨电子株式会社 External storage device and method of manufacturing external storage device
US9666659B2 (en) 2009-12-15 2017-05-30 Renesas Electronics Corporation External storage device and method of manufacturing external storage device
US8705238B2 (en) 2009-12-15 2014-04-22 Renesas Electronics Corporation External storage device and method of manufacturing external storage device
JP2014170587A (en) * 2014-05-26 2014-09-18 Renesas Electronics Corp External storage device

Also Published As

Publication number Publication date
JP2982286B2 (en) 1999-11-22

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