JPH0414919Y2 - - Google Patents

Info

Publication number
JPH0414919Y2
JPH0414919Y2 JP1986051668U JP5166886U JPH0414919Y2 JP H0414919 Y2 JPH0414919 Y2 JP H0414919Y2 JP 1986051668 U JP1986051668 U JP 1986051668U JP 5166886 U JP5166886 U JP 5166886U JP H0414919 Y2 JPH0414919 Y2 JP H0414919Y2
Authority
JP
Japan
Prior art keywords
solder
lead member
melting point
soldered
component body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986051668U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62163918U (US07860544-20101228-C00003.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986051668U priority Critical patent/JPH0414919Y2/ja
Publication of JPS62163918U publication Critical patent/JPS62163918U/ja
Application granted granted Critical
Publication of JPH0414919Y2 publication Critical patent/JPH0414919Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP1986051668U 1986-04-07 1986-04-07 Expired JPH0414919Y2 (US07860544-20101228-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986051668U JPH0414919Y2 (US07860544-20101228-C00003.png) 1986-04-07 1986-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986051668U JPH0414919Y2 (US07860544-20101228-C00003.png) 1986-04-07 1986-04-07

Publications (2)

Publication Number Publication Date
JPS62163918U JPS62163918U (US07860544-20101228-C00003.png) 1987-10-17
JPH0414919Y2 true JPH0414919Y2 (US07860544-20101228-C00003.png) 1992-04-03

Family

ID=30876146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986051668U Expired JPH0414919Y2 (US07860544-20101228-C00003.png) 1986-04-07 1986-04-07

Country Status (1)

Country Link
JP (1) JPH0414919Y2 (US07860544-20101228-C00003.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5991337B2 (ja) * 2013-08-20 2016-09-14 株式会社村田製作所 端子板付き電子部品の製造方法及び端子板付き電子部品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57124140U (US07860544-20101228-C00003.png) * 1981-01-27 1982-08-03

Also Published As

Publication number Publication date
JPS62163918U (US07860544-20101228-C00003.png) 1987-10-17

Similar Documents

Publication Publication Date Title
JP3758408B2 (ja) セラミック電子部品
JPH0414919Y2 (US07860544-20101228-C00003.png)
JP3767704B2 (ja) チップ型電子部品
JPH0546258Y2 (US07860544-20101228-C00003.png)
JPH0562003U (ja) チップ形電子部品
JPH0236265Y2 (US07860544-20101228-C00003.png)
JP3624740B2 (ja) セラミック電子部品
JPS6120787Y2 (US07860544-20101228-C00003.png)
JPH0312446B2 (US07860544-20101228-C00003.png)
JP3291762B2 (ja) 固体電解コンデンサ
JPH062243Y2 (ja) チツプ抵抗
JPH0410670Y2 (US07860544-20101228-C00003.png)
JPS6134632Y2 (US07860544-20101228-C00003.png)
JPS643333B2 (US07860544-20101228-C00003.png)
JPH03209793A (ja) ガラス基板の半田接続構造
JPH08222478A (ja) チップ型電子部品
JPS6322665Y2 (US07860544-20101228-C00003.png)
JPH0414916Y2 (US07860544-20101228-C00003.png)
JPH0353481Y2 (US07860544-20101228-C00003.png)
JP3085031B2 (ja) チップ型セラミック電子部品
JPH0341475Y2 (US07860544-20101228-C00003.png)
JPH0410709Y2 (US07860544-20101228-C00003.png)
JPH0238462Y2 (US07860544-20101228-C00003.png)
JPH0314292A (ja) 高密度実装モジュールの製造方法
JPS61234519A (ja) 電子部品