JPH04148555A - Lead frame and semiconductor device using it - Google Patents

Lead frame and semiconductor device using it

Info

Publication number
JPH04148555A
JPH04148555A JP27402790A JP27402790A JPH04148555A JP H04148555 A JPH04148555 A JP H04148555A JP 27402790 A JP27402790 A JP 27402790A JP 27402790 A JP27402790 A JP 27402790A JP H04148555 A JPH04148555 A JP H04148555A
Authority
JP
Japan
Prior art keywords
plating film
junction
bismuth
lead
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27402790A
Other languages
Japanese (ja)
Other versions
JP2966079B2 (en
Inventor
Toshihiko Shimada
Original Assignee
Shinko Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co Ltd filed Critical Shinko Electric Ind Co Ltd
Priority to JP2274027A priority Critical patent/JP2966079B2/en
Publication of JPH04148555A publication Critical patent/JPH04148555A/en
Application granted granted Critical
Publication of JP2966079B2 publication Critical patent/JP2966079B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE: To enable endurance to high temperature in the assembly process by forming bismuth-plating film at the junction face of an outer lead with a board.
CONSTITUTION: A bismuth-plating film 24 is formed at least on the outer lead 12 of a lead frame. The bismuth-plating film 24 can be formed over the whole face of the lead frame 10 or over the whole face of the outer lead 12 or only one face serving as the junction face with the board. The thickness of the bismuth-plating film 24 should not particularly be limited: a thickness enough to attain a necessary strength for junction with the board is satisfactory. A gold-plating film or a silver-plating film for semiconductor chip junction and wire bonding can be formed on a die pad 16 and an inner lead 14. Since the melting point of bismuth is 271°C, the device can endure high temperature applied in the junction step of the semiconductor chip and in the resin sealing step during the assembly process.
COPYRIGHT: (C)1992,JPO&Japio
JP2274027A 1990-10-11 1990-10-11 Lead frame, semiconductor device using the same, and method of mounting semiconductor device Expired - Fee Related JP2966079B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2274027A JP2966079B2 (en) 1990-10-11 1990-10-11 Lead frame, semiconductor device using the same, and method of mounting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2274027A JP2966079B2 (en) 1990-10-11 1990-10-11 Lead frame, semiconductor device using the same, and method of mounting semiconductor device

Publications (2)

Publication Number Publication Date
JPH04148555A true JPH04148555A (en) 1992-05-21
JP2966079B2 JP2966079B2 (en) 1999-10-25

Family

ID=17535942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2274027A Expired - Fee Related JP2966079B2 (en) 1990-10-11 1990-10-11 Lead frame, semiconductor device using the same, and method of mounting semiconductor device

Country Status (1)

Country Link
JP (1) JP2966079B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297059A (en) * 1991-03-26 1992-10-21 Aiwa Co Ltd Electronic parts for surface mounting
WO1997000753A1 (en) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Solder, and soldered electronic component and electronic circuit board
JP2006219736A (en) * 2005-02-14 2006-08-24 Toyo Kohan Co Ltd Surface-treated al sheet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04297059A (en) * 1991-03-26 1992-10-21 Aiwa Co Ltd Electronic parts for surface mounting
WO1997000753A1 (en) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Solder, and soldered electronic component and electronic circuit board
US5962133A (en) * 1995-06-20 1999-10-05 Matsushita Electric Industrial Co., Ltd. Solder, electronic component mounted by soldering, and electronic circuit board
CN1080616C (en) * 1995-06-20 2002-03-13 松下电器产业株式会社 Solder and soldered electronic component and electronic circuit board
JP2006219736A (en) * 2005-02-14 2006-08-24 Toyo Kohan Co Ltd Surface-treated al sheet

Also Published As

Publication number Publication date
JP2966079B2 (en) 1999-10-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees