JPH04146973A - Conductive paste composition - Google Patents
Conductive paste compositionInfo
- Publication number
- JPH04146973A JPH04146973A JP26994290A JP26994290A JPH04146973A JP H04146973 A JPH04146973 A JP H04146973A JP 26994290 A JP26994290 A JP 26994290A JP 26994290 A JP26994290 A JP 26994290A JP H04146973 A JPH04146973 A JP H04146973A
- Authority
- JP
- Japan
- Prior art keywords
- copper powder
- acid
- conductive paste
- copper
- paste composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 4
- 239000000057 synthetic resin Substances 0.000 claims abstract description 4
- 239000000654 additive Substances 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 5
- QBDAFARLDLCWAT-UHFFFAOYSA-N 2,3-dihydropyran-6-one Chemical compound O=C1OCCC=C1 QBDAFARLDLCWAT-UHFFFAOYSA-N 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 2
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 abstract 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 abstract 1
- CJMZLCRLBNZJQR-UHFFFAOYSA-N ethyl 2-amino-4-(4-fluorophenyl)thiophene-3-carboxylate Chemical compound CCOC(=O)C1=C(N)SC=C1C1=CC=C(F)C=C1 CJMZLCRLBNZJQR-UHFFFAOYSA-N 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- -1 aliphatic amines Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RAADJDWNEAXLBL-UHFFFAOYSA-N 1,2-di(nonyl)naphthalene Chemical compound C1=CC=CC2=C(CCCCCCCCC)C(CCCCCCCCC)=CC=C21 RAADJDWNEAXLBL-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は導電性ペースト組成物に関し、特に銅粉末入り
導電性ペースト組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a conductive paste composition, and particularly to a conductive paste composition containing copper powder.
近年電子機器の発展にともない、従来銅箔等のエツチン
グにより導体回路を形成していたものが導電性ペースト
組成物を用いたスクリーン印刷による導体回路の形成へ
、また導体同志の接続のためのハンダ付けが導電性ペー
スト組成物による接着へと移行している。In recent years, with the development of electronic devices, the conventional method of forming conductor circuits by etching copper foil, etc. has changed to the formation of conductor circuits by screen printing using conductive paste compositions, and the use of solder to connect conductors. Attachment has shifted to adhesion using conductive paste compositions.
また、コンピュータ等電子機器に発生する電磁波が電波
障害となり問題になっているが、電磁波シールド材料に
導電性ペースト組成物を塗布することによってその問題
が解決されている。Further, electromagnetic waves generated in electronic devices such as computers cause radio wave interference, which has become a problem, but this problem has been solved by applying a conductive paste composition to an electromagnetic shielding material.
（従来の技術）
導電性ペースト組成物は導電性のフィラー、主に金属粉
末と合成樹脂から成るバインダー、必要に応してｌ８剤
、添加剤から成る複合材料であり、組成物の性能はこれ
らの素材の特性および組み合わせて決まる。(Prior art) A conductive paste composition is a composite material consisting of a conductive filler, a binder mainly composed of metal powder and a synthetic resin, and optionally an l8 agent and additives, and the performance of the composition depends on these. Determined by material properties and combinations.
従来金属粉末としては、銀、銅、ニッケル粉末は用いら
れたが、その導電性においては銀、銅粉末が優れている
が、銀粉末は貴金属であり、価格が最も高い。コスト的
には銅粉末が最も有利であるが，表面酸化膜の生成速度
が早く、本来の導電性を接続することが難しい。ニッケ
ル粉末は本来の導電性は銅粉末よりも落ちる。また、価
格も一般的には銅粉末よりも高いが、銀粉末よりも安く
、表面酸化膜の生成速度は銅粉末より遅く、導電性が持
続しやすい。Conventionally, silver, copper, and nickel powders have been used as metal powders, and although silver and copper powders have excellent conductivity, silver powders are noble metals and are the most expensive. Copper powder is the most advantageous in terms of cost, but it forms a surface oxide film quickly, making it difficult to connect the original conductivity. Nickel powder has lower inherent conductivity than copper powder. In addition, although the price is generally higher than that of copper powder, it is cheaper than silver powder, and the rate of formation of a surface oxide film is slower than that of copper powder, making it easier to maintain conductivity.
上記に示したように、銅粉末は本来の導電性においても
価格的にも、導電性組成物材料として非常に有利である
が、非導電性の酸化膜の生成が非常に速く、空気中での
取扱が難しいばかりでなく、−時的に還元銅粉を用いて
導電性組成物を製造してもそのままでは再び酸化が始ま
り電気伝導性を持ちえない。これを解決するために種々
の提案がなされてきた。As shown above, copper powder is very advantageous as a material for conductive compositions, both in terms of its inherent conductivity and cost, but it forms a non-conductive oxide film very quickly, and Not only is it difficult to handle, but even if a conductive composition is produced using reduced copper powder, oxidation will begin again and it will not have electrical conductivity. Various proposals have been made to solve this problem.
その方法としては、各種の添加剤を使用する方ｉ去があ
る。One way to do this is to use various additives.
添加剤としては、高級飽和脂肪酸および高級不飽和脂肪
酸がある。例えば、特開昭５８−６１１４４号公報、
５８−７４７５９号公報、 ５８−１４５７６９号公報
、６］−２１１３７８号公報、６２−２３０！１６９号
公報、６２−２５２９８８号公報、 ６３−８３１７８
号公報に記載されたパルミチン酸、ステアリン酸、オレ
イン酸、リノール酸等がある。上記公報に記載された還
元剤としては脂肪族アミンおよび脂肪族のリン酸エステ
ル＠」よび金属キレート剤がある。そして、それらとし
ては、トリエタノールアミン、ジメチルアミン、ステア
リルアミン等がある。そしてこれらは併用して使用され
る方法が種々提案されている。Additives include higher saturated fatty acids and higher unsaturated fatty acids. For example, Japanese Patent Application Laid-open No. 58-61144,
58-74759, 58-145769, 6]-211378, 62-230!169, 62-252988, 63-83178
There are palmitic acid, stearic acid, oleic acid, linoleic acid, etc. described in the above publication. The reducing agents described in the above publication include aliphatic amines and aliphatic phosphoric acid esters and metal chelating agents. These include triethanolamine, dimethylamine, and stearylamine. Various methods have been proposed in which these methods are used in combination.
（発明が解決するための課題）
しかしながら、銅粉末の酸化を防止する満足する添加剤
は見られなかった。(Problems to be Solved by the Invention) However, no additive has been found that satisfies the oxidation of copper powder.
本発明は各種の添加剤の中から、銅の酸化を防止する添
加剤を提供することを目的とする。An object of the present invention is to provide an additive that prevents copper oxidation from among various additives.
（課題を解決するための手段）
本発明者らは、これらについて種々検討の結果銅粉末と
合成樹脂から成る導電性ペースト組成物において添加剤
として２−エチルヘキシルアシドフオスフェート、ドデ
シノレベンゼンスルフォンよびジノニルナフタレンジス
ルフオン酸を使用することにより解決した。(Means for Solving the Problems) As a result of various studies on these issues, the present inventors have found that 2-ethylhexyl acid phosphate, dodecynolebenzenesulfone, and The problem was solved by using dinonylnaphthalenedisulfonic acid.
本発明に使用する銅粉末は，通常の電解法で製造された
市販品で十分てあり，その粉末の形状も樹枝状、鱗片状
、球状いずれても使用できる。また、その粒度はり．ｌ
乃至２００ミクロンが望ましいが用途の応じて使い分け
られるものであり、限定されるものではない。The copper powder used in the present invention may be a commercially available product produced by an ordinary electrolytic method, and the shape of the powder may be dendritic, scaly, or spherical. Also, its particle size. l
A range of 200 to 200 microns is desirable, but it can be used depending on the purpose and is not limited.
本発明で使用する樹脂は、フェノール樹脂、メラミン樹
脂、キシレン樹脂である。フェノール樹脂は例えば、重
板されている三菱ガス化学（株）製ＰＣ−１ 、群栄化
学（株）製Ｐｉ． ４３４８Ｂであり、メラミン樹脂は
例えば三相ケミカル（株）製二カラツクＭＸ−７０８、
ＭＳ−０旧であり、キシレン樹脂は例えば三菱ガス化学
（株）製ｐＲ−ｒｓ４ｏである。The resins used in the present invention are phenol resins, melamine resins, and xylene resins. Phenol resins include, for example, PC-1 manufactured by Mitsubishi Gas Chemical Co., Ltd., Pi. 4348B, and the melamine resin is, for example, Nikaratsuku MX-708 manufactured by Sanso Chemical Co., Ltd.
MS-0 old, and the xylene resin is pR-rs4o manufactured by Mitsubishi Gas Chemical Co., Ltd., for example.
本発明で使用する添加剤として２−エチルヘキシルアシ
ドフオスフェートは、略称ｆ２ＥＨＡＰｌ と呼ばれて
いる。ドデシノレベンゼンスルフォン酸は略称＋ＤＢＳ
旧と呼ばれている。ジノニルナフタレンジスルフオン酸
は略称＋ＮＩＡＣＯＲＥ ３５２５１と呼ばれている。2-Ethylhexyl acid phosphate as an additive used in the present invention is abbreviated as f2EHAPl. Dodecinolebenzenesulfonic acid is abbreviated as +DBS
It's called old. Dinonylnaphthalenedisulfonic acid is called by the abbreviation +NIACORE 35251.
これらの銅ペースト組成物の配合比率は銅粉は、７５〜
９５ｗｔ％好ましくは８５〜９０ｗｔ％であり、残りは
バインダーである樹脂と添加剤である。The blending ratio of these copper paste compositions is 75 to 75.
The amount is 95 wt%, preferably 85 to 90 wt%, and the remainder is the binder resin and additives.
この範囲以下，以上でも抵抗値が大きくなる。Below or above this range, the resistance value increases.
添加剤は銅粉１００重量部に対し酸０．５〜１０重量部
好ましくは１〜３重量部である、
添加量が少ないと抵抗値が大きくなる。添加量が多いと
抵抗値を下げる効果が飽和しできで、多く入れる必要が
なくなるし、場合によっては塗膜強度の低下をもたらす
。The additive is used in an amount of 0.5 to 10 parts by weight of acid per 100 parts by weight of copper powder, preferably 1 to 3 parts by weight. If the amount added is small, the resistance value increases. If the amount added is too large, the effect of lowering the resistance value will be saturated, making it unnecessary to add a large amount, and depending on the case, the strength of the coating film will be reduced.
（実施例） 本発明を実施例に基づいて詳細に説明する。(Example) The present invention will be explained in detail based on examples.
その添加剤が有効であるかを簡易テストで試験した。The effectiveness of the additive was tested in a simple test.
配合 銅粉 ８５ｇ
樹脂 ２４ｇ
添加剤 ２ｇ
これらをよく分散同化の後ロール３回通して銅ペースト
を得た。Blend: Copper powder 85g Resin 24g Additive 2g These were well dispersed and assimilated and then passed through a roll three times to obtain a copper paste.
第１図に示すように、プラスチック板（ガラス繊維補強
エポキシ樹脂積層板）に銅箔を張り付けた幅３ｃＩ１１
×長さ６ｃｍの銅張り積層板の中央部４の＠箔をエツチ
ングしで除き、プラスチック板１の両端部に １．５ｃ
ｍ幅の銅箔部２および２を残した基板Ａ（基板Ａの両銅
箔部２および２間の距離３ｃＩｎである）を用意し、第
２図に示すように基板へに、導電性塗料を１ｃｍ幅にセ
ロテープ−枚分の厚さてガラス棒により塗布し、得られ
た塗膜３ （硬化後の膜厚でほぼ５０ｔｉｒａ ）を１
５０℃、１５分間硬化した後、マイクロメータで、電気
抵抗を測定し、それを３で割って面積抵抗値を求めた。As shown in Figure 1, the width 3cI11 is made by pasting copper foil on a plastic plate (glass fiber reinforced epoxy resin laminate).
× Remove the @ foil at the center part 4 of a copper-clad laminate with a length of 6 cm by etching, and attach 1.5 cm to both ends of the plastic plate 1.
Prepare a board A with m-width copper foil parts 2 and 2 left (distance between both copper foil parts 2 and 2 of board A is 3 cIn), and apply conductive paint to the board as shown in Figure 2. was coated with a glass rod to a width of 1 cm to a thickness equivalent to a sheet of Sellotape, and the resulting coating film 3 (approximately 50 tira in film thickness after curing) was applied to 1 cm.
After curing at 50° C. for 15 minutes, the electrical resistance was measured with a micrometer and divided by 3 to obtain the sheet resistance value.
単位はｍΩ／口である。その結果は下記の通りである（
この方法を簡略法と称する）。The unit is mΩ/mouth. The results are as follows (
This method is called the simplified method).
上記配合で次の添加剤の試験を行なった。The following additives were tested in the above formulation.
２−エチノしヘキシルアシドフォスフェートｆ２ＥＨＡ
Ｐ） 、 ドデシノレベンゼンスルフォン酸ｆＤＢｓ
旧およびジノニルナフタレンシスルフオン酸ｆＮＴＡｃ
ＯＲＥ３５２５１ 。2-ethynohexyl acid phosphate f2EHA
P), dodecynolebenzene sulfonic acid fDBs
Old and dinonylnaphthalene cisulfonic acid fNTAc
ORE35251.
なお、添加剤を含まない銅ぺ一又トでは３０ＭΩ／口（
３０Ｘ １０９ｍΩ／口）以上であった。In addition, for copper tape without additives, the resistance is 30MΩ/mouth (
30×109 mΩ/mouth) or more.
このように本発明の添加剤は大変効果がある。As described above, the additive of the present invention is very effective.
（発明の効果）
本発明の添加剤は導電性に優れ、基板に利用されると効
果があり、各種の基板に利用できる。(Effects of the Invention) The additive of the present invention has excellent conductivity and is effective when used in substrates, and can be used in various substrates.
第り図、第２図は、本発明の導電性ペーストの簡略テス
トを試験するプラスチック板の平面図である。
ｌ・・・・−・プラスチック板 ３・・−・・・導電
性塗膜２・・・−・−銅箔
特許出願人 株式会社アサヒ化学研究所図面の浄囲（内
容に変更なし）
第
図
第
？
図
手
続
ネ由
正
；をを
モ成３年２月８日Figures 1 and 2 are top views of plastic plates on which a simplified test of the conductive paste of the present invention is tested. l...Plastic plate 3...Conductive coating 2...Copper foil patent applicant Asahi Chemical Research Institute Co., Ltd. Drawings (no changes to the content) Fig. No.? February 8, 1997
Claims (1)
において添加剤として２−エチルヘキシルアシドフオス
フェート、ドデシノレベンゼンスルフォン酸およびジノ
ニルナフタレンジスルフオン酸を使用することを特徴と
する導電性ペースト組成物。1) A conductive paste characterized by using 2-ethylhexyl acid phosphate, dodecynolebenzenesulfonic acid, and dinonylnaphthalenedisulfonic acid as additives in a conductive paste composition consisting of copper powder and synthetic resin. Composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26994290A JPH04146973A (en) | 1990-10-08 | 1990-10-08 | Conductive paste composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26994290A JPH04146973A (en) | 1990-10-08 | 1990-10-08 | Conductive paste composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04146973A true JPH04146973A (en) | 1992-05-20 |
Family
ID=17479353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26994290A Pending JPH04146973A (en) | 1990-10-08 | 1990-10-08 | Conductive paste composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04146973A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5981069A (en) * | 1996-03-01 | 1999-11-09 | Murata Manufacturing Co., Ltd. | Copper powder coated with copper phosphate and copper paste containing the same |
-
1990
- 1990-10-08 JP JP26994290A patent/JPH04146973A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5981069A (en) * | 1996-03-01 | 1999-11-09 | Murata Manufacturing Co., Ltd. | Copper powder coated with copper phosphate and copper paste containing the same |
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