JPH04142726A - Manufacture of thin film circuit substrate - Google Patents

Abstract

PURPOSE:To avoid the positional slip of an identification mark and a conductor pattern by a method wherein an opening part is formed inside the conductor pattern in low light-absorption factor in the case of the conductor pattern formation so that the opening part may be made the identification mark of a resistor film in high absorption factor. CONSTITUTION:An insulating substrate 1 is coated with a metallic resistor film in high light-absorption factor while a resistor pattern 2 and a marking pattern 3 are formed in the specific positions by photoresist processing and etching steps. Next, the whole surface is coated with a conductor film capable of selective plating so that the conductive patterns 6A, 6B forming an opening part 5 in the smaller size than that of the marking pattern may be formed inside the conductor to be patterned by photo-resist processing step. The material of the conductor pattern comprising a metal in low light-absorption factor is patterned by plating step and then the photoresist is removed. Finally, the selective plating conductor film as the photoresist lower layer is etched away so that the film circuit on the conductor patterns 6A, 6B of the resistor pattern 2 may be made while forming the pattern identification mark 7 inside the conductor.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a thin film circuit board, and in particular to a method for manufacturing a thin film circuit board in which a conductor pattern and a resistance pattern of a resistive film can be accurately aligned. Regarding the method.

[Conventional technology]

Conventionally, a method for manufacturing this type of thin film circuit board is shown in FIG. 4(a).
), (b), a resistance pattern 2 made of a resistance film and a recognition mark 7A are formed on the surface of an insulating substrate 1 made of alumina ceramic or the like as a first step. As a second step, a reference was determined by aligning from the recognition mark 7A, and a conductor film 4 for selective plating and conductor patterns 8C and 8D were formed.

[Problem to be solved by the invention]

The conventional thin film circuit board manufacturing method described above involves forming a recognition mark of any size using a resistive film, and then aligning the conductor mask used for positioning the conductor pattern with the recognition mark by eye alignment. Therefore, there is a drawback that a relative positional shift occurs between the conductor pattern and the resistor pattern formed using the conductor mask as a reference.

[Means to solve the problem]

The method for manufacturing a thin film circuit board of the present invention includes a first manufacturing step in which a metal serving as a resistive film with a high light absorption rate is deposited on an insulating substrate, and a resistive pattern and a recognition mark button are formed by photoresist processing. , a conductor film that enables selective plating is applied, a conductor pattern is formed by photoresist processing, a conductor pattern is formed by plating a metal with a low light absorption rate, and the recognition mark pattern is formed within the conductor. A second manufacturing process in which an opening is formed in a portion, and a third manufacturing process in which a pattern recognition mark is formed at the same time as film circuit formation by removing the photoresist other than the conductor pattern and removing the conductive film for selective plating under the photoresist. Has a process.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a side sectional view and a plan view of an embodiment of the present invention, and are a completed view of a thin film circuit board manufactured according to this embodiment. Figure 2(a).

3(b) and FIGS. 3(a) and 3(b) are a side sectional view and a plan view, respectively, illustrating the manufacturing steps of the first step and the second step in this example.

Next, the manufacturing process of this example will be explained.

In the first step, as shown in FIG. 2, a resistive film having a high light absorption rate is deposited on an insulating substrate 1, and a resistive pattern 2 and a mark pattern 3 are formed at predetermined positions by photoresist processing and etching.

In the second step, as shown in FIG. 3, a conductor pattern 6A is coated with a conductor film 4 that enables selective plating, and has an opening 5 inside the conductor that is smaller than the mark pattern 3;
The formation of 6B is patterned by photoresist processing. The conductor pattern material is made by patterning a metal with low light absorption rate by plating, and then removing the photoresist.

Third step, as shown in FIG.
In order to expose the resistor pattern 2 other than B and the resistor pattern of the recognition mark 7, the conductor film 4 for selective plating under the photoresist is removed by etching, thereby forming the film circuit of the conductor patterns 6A and 6B of the resistor pattern 2. A pattern recognition mark 7 inside the conductor is formed.

〔Effect of the invention〕

As explained above, the present invention provides an opening inside a conductor pattern with a low absorption rate when forming a conductor pattern, and by using the opening as a recognition mark of a resistive film with a high absorption rate, the recognition mark and the conductor pattern can be separated. This has the effect of preventing misalignment. Therefore, the precision of the wire bonding position during assembly is improved, and a high precision device can be provided.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a side sectional view and a plan view of an embodiment of the present invention, FIGS. 2(a) and 3(b), and FIG.
a) and (b) are a side sectional view and a plan view illustrating the manufacturing process of this embodiment, and FIG. 4 is a side sectional view and a plan view illustrating a conventional method for manufacturing a thin film circuit board. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Resistance pattern, 3... Mark pattern, 4... Conductor film for selective plating, 5...
- Opening, 8A, 8B... Conductor pattern, 7... Recognition mark.

Claims (1)

[Claims] 1. The first manufacturing process of depositing a metal that will become a resistive film with high light absorption on an insulating substrate and forming a resistive pattern and recognition mark pattern by photoresist treatment, and a conductive film that enables selective plating. a conductor pattern formed by photoresist processing, conductor patterning performed by plating a metal with low light absorption rate, and an opening provided in the conductor at the portion of the recognition mark pattern.
and a third manufacturing step of removing the photoresist other than the conductor pattern and removing the conductive film for selective plating under the photoresist to form a pattern recognition mark at the same time as film circuit formation. Method of manufacturing circuit boards. 2. The thin film circuit board according to claim 1, wherein the opening is formed to be slightly smaller than the size of the recognition mark pattern, and serves as a recognition mark for setting a relative position between the conductor pattern and the resistor pattern. manufacturing method.