JPH04263446A - Tape carrier for tab - Google Patents

Abstract

PURPOSE:To provide the title tape carrier for TAB in large effective shared area of conductor patterns and capable of making alignment with high precision. CONSTITUTION:The title tape carrier 20 for TAB is provided with an alignment hole 22 formed on a part of an insulating film 2 to be optically aligned with a photomask as well as alignment marks 24, 26 to be formed on the insulating film 12 as a part of a conductor pattern 14 and as the reference to the alignment in the bonding step, etc., after the etching step.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to TAB (Tape Out), which is one of the methods for mounting semiconductor elements such as ICs and LSIs.
T used for omated bonding) method
This invention relates to an AB tape carrier.

0002

[Prior Art] In recent years, in order to automate and speed up the mounting technology of semiconductor devices, TAB (Tape Automated
Bonding) method is adopted. FIG. 2 shows the configuration of a conventional TAB tape carrier. The TAB tape carrier 10 is made by bonding a metal foil such as copper foil onto an insulating film tape 12 made of polyimide or the like, and forming a conductor pattern 14 by photo-etching. In the center of the film tape 12, IC, L
A device hole 16 is formed to accommodate a semiconductor element (not shown) such as an SI, and rectangular perforations 18 are continuously formed at a constant pitch at both ends in the width direction. The perforations 18 are used for transporting the elongated tape carrier 10 and for positioning during a photomask (not shown) in a photoetching process and a subsequent semiconductor element bonding process. Alignment is performed mechanically by inserting alignment pins (not shown) into the perforations 18.

0003

However, in the TAB tape carrier 10 as described above, since the perforations 18 are formed at both ends, the effective area occupied by the conductor pattern 14 is reduced accordingly. For example, when using a tape carrier with a width of 35 mm, the width occupied by the perforations 18 is 10 mm on both sides.
mm, and the effective occupied area of the conductor pattern is reduced by about 29%. In other words, when trying to obtain a conductor pattern with the same area, the TAB tape carrier itself becomes larger and the cost increases. Furthermore, since the alignment accuracy depends on the processing accuracy of the perforations 18 and the inserted pins, it has been difficult to improve the alignment accuracy.

0004

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a tape carrier for TAB, which has a large effective area occupied by a conductor pattern and can perform highly accurate positioning.

[0005]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a first mark formed on a part of an insulating film and optically aligned with a photomask, and a first mark formed as a part of a conductor pattern. A second mark is formed on the insulating film and serves as a reference for alignment in a bonding process after etching.

[0006]

[Operation] In the manufacturing process of the TAB tape carrier of the present invention configured as described above, when performing pattern exposure, by optically aligning the first mark formed on the insulating film, The insulating film and photomask are aligned, and the IC, LIS
When bonding semiconductor elements such as the above, the configuration is such that positioning with the tape carrier is performed using the second mark as a reference, so perforations that were conventionally formed at both ends of the tape carrier can be omitted. Furthermore, the alignment accuracy is determined by the positional accuracy of the first and second marks serving as references, and does not depend on the accuracy of mechanical processing such as perforations, as in the past.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows the configuration of a TAB tape carrier according to an embodiment. The basic structure of the TAB tape carrier 20 is the same as the conventional one, and a metal foil such as copper foil is bonded onto an insulating film tape 12 made of organic polyimide, glass epoxy, etc., and a conductor pattern 14 is formed by photo-etching. formed and formed. A device hole 16 for accommodating a semiconductor element (not shown) such as an IC or LSI is formed in the center of the film tape 12, and an alignment hole 22 that serves as a reference for a photomask (not shown) is formed above the device hole 16. is formed. Furthermore, alignment marks 24 and 26 are formed at two diagonal positions of the conductor pattern 14 to serve as references when bonding semiconductor elements.

When manufacturing the TAB tape carrier 20 constructed as described above, a device hole 16 is punched in the center of the film tape 12 having a thickness of 75 μm and a width of 35 mm, and an alignment hole 22 is formed above the device hole 22 in advance. Form each. Thereafter, a rolled copper foil having a thickness of 35 μm is attached to the surface of the film tape 12 using an adhesive. Next, a photomask with portions corresponding to the alignment marks 24 and 26 cut out in advance is set on a rolled copper foil whose surface is coated with a resist (not shown). At this time, the relative positioning of the photomask and the film tape 12 is performed by optically aligning the alignment hole 22 from the back side of the film tape 12. As a result, ±0.01mm
High-precision alignment can be performed within the range of . After that, the conductor pattern 1 is formed by a well-known photo-etching process.
4, the TAB tape carrier 2
0 manufacturing is completed.

After that, the semiconductor element is inserted into the device hole 18.
The semiconductor elements are bonded using the alignment marks 24 and 26 formed as part of the conductor pattern 14 as a reference. Thereby, bonding with high positional accuracy between the semiconductor element and the conductor pattern 14 is achieved,
Therefore, the pattern pitch is 0.08 mm (conductor width 40 μm)
It is also possible to manufacture a tape carrier for fine pattern TAB with conductor spacing of 40 μm).

0010

[Effects of the Invention] As explained above, the TA according to the present invention
In the tape carrier for B, a first mark is formed on a part of the insulating film and is optically aligned with the photomask, and a first mark is formed on the insulating film as a part of the conductor pattern and is used for bonding after etching. Since the second mark is provided as a reference for alignment of processes, etc., the effective occupied area of the conductor pattern is expanded, and the alignment accuracy of photomasks and the like is dramatically improved.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the configuration of an embodiment of the present invention.

FIG. 2 is a plan view showing the configuration of the prior art.

[Explanation of symbols]

12 Film tape
20 TAB tape carrier 14 Conductor pattern
22 Alignment hole 16 Device hole
24, 26 Alignment mark

Claims (1)

[Claims] 1. A TAB tape carrier in which a conductive pattern of a predetermined shape is formed on an insulating film by photoetching using a photomask, the conductor pattern being formed on a part of the insulating film and having a conductive pattern with the photomask. a first mark that is aligned on the insulating film as part of the conductive pattern;
A TAB tape carrier comprising: a second mark used as a reference for alignment in a bonding process, etc. after the etching process.