JPH0414250A - Wire bonding lead - Google Patents

Abstract

PURPOSE:To reduce the gap between leads and realize a compact package, by making the side surfaces of end portions to which wires of a plurality of leads are bonded protrude toward the side direction, and forming each protruding part of adjacent leads in the manner in which positions of the maximum protruding ends are mutually shifted in the longitudinal direction of the lead. CONSTITUTION:A semiconductor chip 1 is bonded on a chip mounting part 4. Protruding parts 22 are formed on both side surfaces of each tip part 21 of a plurality of leads 2A, 2B, 2C reaching in parallel the vicinity of a side edge, thereby constituting the whole part in a trapezoidal form. Each trapezoid is alternately symmetric, and the maximum protruding end is positioned so as to be separated in the longitudinal direction of the lead by the amount of the trapezoid height. Thereby, when an insulation gap having a width of l2 is obliquely ensured between facing ends, the gap l1 between the leads 2A-2C becomes smaller than conventional gaps. The semiconductor chip 1 and the tip part 21 of each of the leads 2A-2C are connected by wedge-bonding wires 3A-3C. As to the second bonding of the tip part 21, stable bonding having sufficient strength is enabled by making the pressing leg part 51 of a clamping jig 5 abut on the protruding part 22 on both sides.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire bonding lead, and relates to improving the shape of the end of the lead that is wire-bonded using ultrasonic waves, for example.

[Prior Art] In FIG. 5, a rather small square semiconductor chip 1 is bonded onto a square chip mount portion 4 of a lead frame. The semiconductor chip 1 is an IC 1 in which transistors, resistors, etc. are highly integrated, or an intelligent power transistor or the like having a plurality of input/output terminals. The chip mount section 4 is made of a plate material such as a Cu alloy.

The above chip mount section 4 is viewed from the outer periphery of the lead frame (not shown).
A plurality of glues 2A, 2B, and 2C extend in parallel near the chip 1, and a bond between the tip 21 and the bonding pad (not shown) of the chip 1 is connected by wedge bonding, for example.
They are connected by metal wires 3A, 3B, and 3C made of ρ, Cu, Au, etc.

[Problem to be solved by the invention] By the way, the lead end 21 to be wedge bonded
As shown in the figure, the side surface of the clamp 22 is projected in a square shape, and the holding leg 51 of the clamp jig 5 is applied to this projection 22-, as shown in FIG. 6, in order to improve and stabilize the bonding strength. Such an example is also disclosed in Japanese Utility Model Application No. 63-164245.

However, by providing the protrusion 22-,
Insulation gap or minimum punching gap between this, 112
If an insulating gap g2 (hereinafter referred to as an insulating gap g2) is ensured, the gap g3 between adjacent leads 2A, 2B, and 2C increases, resulting in a problem that the entire package becomes larger.

The present invention solves this problem, and aims to provide a wire bonding lead that can reduce the distance between the leads provided with protrusions for clamping, thereby making it possible to make the package more compact. .

[Means for Solving the Problems] To explain the present invention in detail, a semiconductor chip 1 (FIG. 1)
and multiple leads 2 connected by wire bonding.
A, 2B, and 2C are provided, and the side surfaces of the ends 21 of these leads 2A to 2C, to which the wires 3A, 3B, and 3C are bonded, protrude laterally, and the adjacent leads 2
The protrusions 22 in A to 2C are formed such that the positions of their maximum protruding ends are shifted from each other in the longitudinal direction of the lead.

[Function] In the wire bonding lead having the above configuration, the positions of the maximum protruding ends of the respective lead protrusions 22 are shifted from each other in the lead longitudinal direction. Even if a predetermined length of the insulating gap 92 is secured between the leads 2A to 2C, the distance p1 between the leads 2A to 20 is smaller than that in the conventional case, and the package can be made more compact.

[First Embodiment] In FIG. 1, a square semiconductor chip 1 is bonded on a square chip mount part 4.
A plurality of glued lines 2A, 2B, 2 that are parallel to each other near the side edges of
In C, protrusions 22 that protrude laterally in a triangular shape are formed on both sides of each tip 21, so that the entire tip has a trapezoidal shape.

Each trapezoid at the tip is alternately symmetrical, and each protrusion 2
The maximum protruding ends of No. 1 are located apart from each other by the height of the trapezoid in the longitudinal direction of the lead.

Therefore, even when an insulating gap of width g2 is secured diagonally between the opposing ends of the protrusion 22, the gap g1 between the leads 2A to 20 is smaller than the conventional gap g3.

The semiconductor chip 1 and the ends 21 of the leads 2A to 2C are connected by wedge bonding wires 3A to 3C, and the second bonding ink of these ends 21 is connected to a clamp jig 5 as shown in FIG. By applying the restraining legs 51 to the protrusions 22 on both sides, stable honding with sufficient strength is possible.

[Second Example] In FIG. 3, leads 2A, 2B, 2C12D, 2E
The ends of the left and right wires 2D and 2E have a parallelogram shape as a whole, and the left and right opposite sides thereof are inclined in substantially the same direction as the bonding-connected wires 3D and 3E.

According to this structure, good clamping during bonding can be achieved at the left and right lead ends 21 where the wires 3D and 3E are swung at a large angle.

[Third Example] In FIG. 4, the ends 21 of each lead 2A, 2B, 2C
There are formed protrusions 22 projecting in a rectangular shape on both sides, and the protrusions 22 that are adjacent and facing each other are shifted in position from each other in the longitudinal direction of the leads 2A to 2C.

Such a structure also provides the same effects as those of the above embodiments.

[Effects of the Invention] As described above, according to the wire bonding lead of the present invention, strong and stable wire bonding is possible, and the spacing between the leads can be made smaller than before, which improves the package. It is possible to downsize the entire device.

[Brief explanation of drawings]

1 and 2 show a first embodiment of the present invention;
FIG. 2 is an enlarged perspective view of the end of the wire bonding lead, and FIGS. 3 and 4 are wire bonding leads showing second and third embodiments of the present invention, respectively. 5 and 6 show conventional examples, FIG. 5 is an enlarged plan view of the wire bonding lead connection portion, and FIG. 6 is an enlarged perspective view of the end of the wire bonding lead. 1...Semiconductor chips 2A, 2B, 2C12D, 2E...Leads 21...
End portion 22... Protruding portions 3A, 3B, 3C... Wire Figure 1 Figure 2 Figure 5 Figure 6

Claims (1)

[Claims] A plurality of leads are provided to be connected to the semiconductor chip by wire bonding, and the side surfaces of the ends of these leads to which the wires are bonded are made to protrude laterally, and the protrusions of the adjacent leads are extended to their maximum protrusion. A wire bonding lead characterized in that the positions of the ends are shifted from each other in the longitudinal direction of the lead.