JPH04139735A - Ic mounting flexible circuit board and manufacture thereof - Google Patents
Ic mounting flexible circuit board and manufacture thereofInfo
- Publication number
- JPH04139735A JPH04139735A JP26113390A JP26113390A JPH04139735A JP H04139735 A JPH04139735 A JP H04139735A JP 26113390 A JP26113390 A JP 26113390A JP 26113390 A JP26113390 A JP 26113390A JP H04139735 A JPH04139735 A JP H04139735A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- base material
- insulating base
- mounting
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000002679 ablation Methods 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 230000001568 sexual effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 8
- 238000009413 insulation Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、プリント配線基板に於けるＩＣ搭載用可撓性
回路基板及びその製造法に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a flexible circuit board for mounting an IC on a printed wiring board and a method for manufacturing the same.
［従来技術とその問題点」
第３図に示すように、絶縁基材ｌの一面に形成した所定
の回路配線パターン２の所要部位に上記絶縁基材ｌを貫
通して電気的に接合された導電性部材３を設け、この導
電性部材３が上記絶縁基材の他面から突出してＩＣボン
ディングのためのバンプ４を形成するＩＣ搭載用可撓性
回路基板に於いては、先ず、絶縁基材１を貫通する孔５
を穿設し、該孔５に銅メツキ等からなる充填・付着処理
を施して導電性部材３及びバンプ４を形成するという手
法がある。この場合、絶縁基材１を薄くできればメツキ
処理時間を短縮できるという効果があるが、絶縁基材ｌ
を薄くすると、回路基板全体の取扱い性、ハンドリング
性が低下する問題がある。[Prior art and its problems] As shown in Fig. 3, a circuit wiring pattern 2 formed on one surface of an insulating base material 1 is electrically connected to a required portion of the circuit through the insulating base material 1. In a flexible circuit board for mounting an IC in which a conductive member 3 is provided and the conductive member 3 protrudes from the other surface of the insulating base material to form a bump 4 for IC bonding, first, the insulating base is Hole 5 penetrating material 1
There is a method in which the conductive member 3 and the bump 4 are formed by drilling the hole 5 and performing a filling and adhesion treatment of copper plating or the like. In this case, if the insulating base material 1 can be made thinner, the plating processing time can be shortened, but the insulating base material 1
If the thickness of the circuit board is made thinner, there is a problem in that the handleability and handleability of the entire circuit board deteriorates.
「発明の目的及び構成」
そこで、本発明は、絶縁基材の一面に形成した所定の回
路配線パターンの所要部位に上記絶縁基材を貫通して電
気的に接合された導電性部材を設け、この導電性部材が
上記絶縁基材の他面から突出してＩＣボンディングのた
めのバンプを形成するＩＣ搭載用可撓性回路基板に於い
て、前記バンプを形成した絶縁基材に、ＩＣ搭載域に対
応してＩＣ搭載用陥部を設けたことを特徴とするＩＣ搭
載用可撓性回路基板を提供するものである。"Objective and Structure of the Invention" Therefore, the present invention provides a conductive member that penetrates the insulating base material and is electrically connected to a predetermined portion of a predetermined circuit wiring pattern formed on one surface of the insulating base material, In a flexible circuit board for mounting an IC in which the conductive member protrudes from the other surface of the insulating base material to form a bump for IC bonding, the conductive member is attached to the insulating base material on which the bump is formed in the IC mounting area. The present invention provides a flexible circuit board for mounting an IC, which is characterized in that a recess for mounting the IC is provided.
また、その為の製造手段として本発明に於いては、可撓
性絶縁基材の一方面に所要の回路配線パターンを形成す
ると共に該基材の他方面に対して上記回路配線パターン
との関連で露出孔を設けマスクメタルパターンを形成し
、該マスクメタルパターン伸１にエキシマレーザによる
フォトアプレーション加工を施して上記露出孔の部位の
上記絶縁基材に中間孔を形成し、上記マスクメタルパタ
ーンの表面に搭載すべきＩＣの設置域に対応する部位を
除いてフォトレジスト膜を形成し、次いで上記ＩＣ設置
域に位置するマスクメタルパターン部分を除去した後、
エキシマレーザによるフォトアプレーション処理を加え
て上記中間孔から上記回路配線パターンに達する穿孔と
上記ＩＣ設置域に位置する部位に陥部を形成し、最後に
上記穿孔に導電性部材を設けて上記回路配線パターンと
接続されて突出形成絶されるバンプを形成する工程を備
える手法が採用される。In addition, as a manufacturing means for that purpose, in the present invention, a required circuit wiring pattern is formed on one side of a flexible insulating base material, and a connection with the circuit wiring pattern is formed on the other side of the base material. A mask metal pattern is formed by providing an exposure hole, and photo ablation processing is performed on the mask metal pattern 1 using an excimer laser to form an intermediate hole in the insulating base material at the portion of the exposure hole. After forming a photoresist film on the surface of the mask except for the area corresponding to the IC installation area to be mounted, and then removing the mask metal pattern portion located in the IC installation area,
A photo ablation process using an excimer laser is applied to form a hole extending from the intermediate hole to the circuit wiring pattern and a recess at a portion located in the IC installation area, and finally, a conductive member is provided in the hole to form the circuit wiring pattern. A method is adopted that includes a process of forming bumps that are connected to wiring patterns and whose protrusions are removed.
「作 用Ｊ
本発明のＩＣ搭載用可撓性回路基板によれば、バンプを
形成した可撓性絶縁基材に、ＩＣ搭載域に対応してＩＣ
搭載用陥部を設けることにより、ＩＣ搭載用の可撓性回
路基板の全体としての厚さを変えないで、ハンドリング
性を損なう虞なく、また、バンプを形成するために絶縁
基材に穿設した孔の深さを浅く形成できるのでメツキ処
理時間を短縮できると共に、搭載するＩＣを陥部によっ
て位置決めすることができる作用がある。"Function J" According to the flexible circuit board for mounting an IC of the present invention, the flexible insulating base material on which bumps are formed has an IC mounted thereon corresponding to the IC mounting area.
By providing a recess for mounting, the overall thickness of the flexible circuit board for mounting an IC does not change, and there is no risk of impairing handling properties, and it is also possible to drill holes into the insulating base material to form bumps. Since the depth of the hole can be made shallow, the plating processing time can be shortened, and the IC to be mounted can be positioned by the recess.
「実 施 例」
以下、図示の実施例により、本発明に係るＩＣ搭載用可
撓性回路基板を詳細に説明すると、第１図に於いて、１
１は、ポリイミド、ポリエステル、ガラスエポキシ等の
絶縁シート材からなる絶縁基材で、その−面に銅箔、ア
ルミ箔等の金属箔膜からなる回路配線パターン１２が設
けである０回路配線パターン１２の所要部位に対応する
絶縁基材１１の他面には、ＩＣ搭載用の陥部ｌＯが設け
てあり、該陥部ｌＯ内の所要位置に絶縁基材１１を貫通
する孔１５を設け、該孔１５に金、銅、錫、鉛、錫合金
等からなる導電性メツキ部材を充填処理して、回路パタ
ーン１２と導通接続する導電性部材１３と、上記絶縁基
材１１の他面から突出してＩＣボンディングの為のバン
プ１４とが形成しである。"Example" Hereinafter, the flexible circuit board for mounting an IC according to the present invention will be explained in detail using the illustrated example.
1 is an insulating base material made of an insulating sheet material such as polyimide, polyester, glass epoxy, etc., and a circuit wiring pattern 12 made of a metal foil film such as copper foil, aluminum foil, etc. is provided on the negative side thereof.0 circuit wiring pattern 12 A recess lO for mounting an IC is provided on the other surface of the insulating base material 11 corresponding to a required portion of the insulating base material 11, and a hole 15 penetrating the insulating base material 11 is provided at a predetermined position within the recess lO. The holes 15 are filled with a conductive plating member made of gold, copper, tin, lead, tin alloy, etc., and a conductive member 13 is electrically connected to the circuit pattern 12 and protrudes from the other surface of the insulating base material 11. Bumps 14 for IC bonding are formed.
上記の構成からなる本発明実施例のＩＣｉ載用期用可撓
性回路基板造工程を、第２図の（１）〜（５）に順次に
示しである。同図（１）に於いて、可撓性絶縁基材１１
の一面には回路配線パターン１２が、他面には所定の穿
孔部位に露出孔１７を有するマスクメタルパターン１６
が常法のパターンニング処理手段により同時的番ピ構成
される０次いで、同図（２）に於いて、絶縁基材１１の
マスクメタルパターン１６側にエキシマレーザＡによる
フォトアプレーション加工が施され、前記露出孔１７部
位に中間孔１８が穿設される。ここで、図の（３）にお
いて、前記マスクメタルパターン１６の表面に、搭載す
べきＩＣの設置域に対応するＩＣ設置孔２０を有するフ
ォトレジスト膜１９を被膜処理し、更に、同図（４）に
て、先ず、化学的処理によりＩＣ設置孔２ｏ内のマスク
メタルパターン１６を除去し、次にエキシマレーザＢに
よるフォトアプレーションにより前記中間孔１８の部位
に穿孔１５と、その周囲に中間孔１８の深さに相当する
ＩＣ搭載用陥部１０とを穿設する。The process of manufacturing a flexible circuit board for ICi use according to the embodiment of the present invention having the above-mentioned configuration is sequentially shown in (1) to (5) of FIG. In the same figure (1), a flexible insulating base material 11
A circuit wiring pattern 12 is formed on one side, and a mask metal pattern 16 having an exposed hole 17 at a predetermined perforation site is formed on the other side.
are simultaneously patterned by conventional patterning processing means.Next, in FIG. , an intermediate hole 18 is bored at the exposed hole 17 portion. Here, in (3) of the figure, the surface of the mask metal pattern 16 is coated with a photoresist film 19 having an IC installation hole 20 corresponding to the installation area of the IC to be mounted, and further, ), first, the mask metal pattern 16 in the IC installation hole 2o is removed by chemical treatment, and then a hole 15 is formed at the intermediate hole 18 site and an intermediate hole is formed around it by photo ablation using an excimer laser B. An IC mounting recess 10 corresponding to a depth of 18 mm is bored.
そして、同図（５）に於いて、化学的処理によりフォト
レジスト１１１１９を除去した後、穿孔１５へのメツキ
充填と付着処理加工により、導電性部材１３とバンプ１
４を設けることにより、本発明に係るＩＣ搭載用可撓性
回路基板が完成する。In FIG. 5, after removing the photoresist 11119 by chemical treatment, the conductive member 13 and the bumps 1 are filled with plating into the perforations 15 and bonded.
4, the flexible circuit board for mounting an IC according to the present invention is completed.
なお、第２図（１）の回路基板は、例えば、ポリイミド
両面無接着銅張板等からなる両面無接着剤可撓性導電積
層板を素材として構成しであるから、結果として、中央
の絶縁基材１１と回路配線パターン１２との間に接着剤
層が存在しないが、回路配線パターン１２と絶縁基材１
１の間に接着剤層が存在するものを採用しても本発明の
構成及び効果に変わりはなく、この場合も本発明の手法
を同様に適用することが可能である。The circuit board shown in FIG. 2 (1) is made of a double-sided non-adhesive flexible conductive laminate made of, for example, polyimide double-sided non-adhesive copper clad board, and as a result, the central insulation Although there is no adhesive layer between the base material 11 and the circuit wiring pattern 12, the circuit wiring pattern 12 and the insulating base material 1
Even if an adhesive layer is present between the two layers, the structure and effects of the present invention remain the same, and the method of the present invention can be similarly applied in this case as well.
「効 果」
以上のとおり、本発明に係るＩＣ搭載用可撓性回路基板
によれば、絶縁基材の一面に形成した所定の回路配線パ
ターンの所要部位に上記絶縁基材を貫通して電気的に接
合された導電性部材を設けこの導電性部材が上記絶縁基
材の他面から突出してＩＣボンディングのためのバンプ
を形成するＩＣ搭載用可撓性回路基板に於いて、前記バ
ンプを形成した絶縁基材に、ＩＣ搭載域に対応してＩＣ
搭載用陥部な設けた構成を有するから、ＩＣ搭載用陥部
を設けることによって、バンプを形成するために絶縁基
材に穿設した孔の深さを浅く形成でき、従ってバンプ形
成のためのメツキ処理時間を短縮できる。"Effects" As described above, according to the flexible circuit board for mounting an IC according to the present invention, electricity is transmitted through the insulating base material to the required portions of the predetermined circuit wiring pattern formed on one surface of the insulating base material. In a flexible circuit board for mounting an IC, the conductive member is provided with a conductive member bonded to the insulating base material, and the conductive member protrudes from the other surface of the insulating base material to form a bump for IC bonding. IC is mounted on the insulating base material corresponding to the IC mounting area.
Since the IC mounting recess is provided, the depth of the hole drilled in the insulating base material for forming the bump can be made shallow. The plating processing time can be shortened.
また、搭載するＩＣを陥部によって位置決めすることが
できる効果があると共に、ＩＣ搭載用の陥部は１回路基
板の一部に形成するにすぎないから全体の絶縁基材の厚
さと強度には影響はなく。In addition, there is an effect that the IC to be mounted can be positioned by the recess, and since the recess for mounting the IC is only formed in a part of one circuit board, the thickness and strength of the entire insulating base material are affected. There is no effect.
回路基板全体としてのハンドリング性を損なう恐れもな
い。There is no fear that the handling of the circuit board as a whole will be impaired.
第１図は本発明に係るＩＣ搭載用可撓性回路基板の一実
施例の要部を概念的に示す断面構成図、第２図（１）〜
（５）はその実施例の一製造工程図であり、そして、
第３図は本発明が解決しようとする問題点を含む技術例
を示す断面構成図である。
１０：Ｉ Ｃ搭載用凹溝
ｌ ｌ ：絶 縁 基 材１２：回路配線
パターン
１３ ：導 電 性 部 材
１４：バ ン ブ
１５：穿 孔
１６：メタルマスクパターン
１７：露 出 孔
１８：中 間 孔
１９：フォトレジスト膜
第１
図
第３図FIG. 1 is a cross-sectional configuration diagram conceptually showing the main parts of an embodiment of a flexible circuit board for mounting an IC according to the present invention, and FIG.
(5) is a manufacturing process diagram of the embodiment, and FIG. 3 is a cross-sectional configuration diagram showing a technical example including the problem to be solved by the present invention. 10: Concave groove for mounting IC l: Insulating base material 12: Circuit wiring pattern 13: Conductive member 14: Bump 15: Perforation 16: Metal mask pattern 17: Exposure hole 18: Intermediate Hole 19: Photoresist film 1 Figure 3
Claims (2)
ンの所要部位に上記絶縁基材を貫通して電気的に接合さ
れた導電性部材を設け、この導電性部材が上記絶縁性基
材の他面から突出してＩＣボンディングのためのバンプ
を形成するＩＣ搭載用可撓性回路基板に於いて、前記バ
ンプを形成した絶縁基材に、ＩＣ搭載域に対応してＩＣ
搭載用陥部を設けたことを特徴とするＩＣ搭載用可撓性
回路基板。(1) A conductive member that penetrates the insulating base material and is electrically connected is provided at a required portion of a predetermined circuit wiring pattern formed on one surface of the insulating base material, and the conductive member is connected to the insulating base material. In a flexible circuit board for mounting an IC on which a bump for IC bonding is formed protruding from the other surface, an IC is mounted on the insulating base material on which the bump is formed, corresponding to the IC mounting area.
A flexible circuit board for mounting an IC, characterized by having a recess for mounting.
ンを形成すると共に該基材の他方面に対して上記回路配
線パターンとの関連で露出孔を設けマスクメタルパター
ンを形成し、該マスクメタルパターン側にエキシマレー
ザによるフォトアプレーション加工を施して上記露出孔
の部位の上記絶縁基材に中間孔を形成し、上記マスクメ
タルパターンの表面に搭載すべきＩＣの設置域に対応す
る部位を除いてフォトレジスト膜を形成し、次いで上記
ＩＣ設置域に位置するマスクメタルパターン部分を除去
した後、エキシマレーザによるフォトアプレーション処
理を加えて上記中間孔から上記回路配線パターンに達す
る穿孔と上記ＩＣ設置域に位置する部位に陥部を形成し
、最後に上記穿孔に導電性部材を設けて上記回路配線パ
ターンと接続されて突出形成されるバンプを形成する工
程を備えるＩＣ搭載用可撓性回路基板の製造法。(2) forming a required circuit wiring pattern on one side of a flexible insulating base material, and forming an exposure hole in relation to the circuit wiring pattern on the other side of the base material to form a mask metal pattern; A photo ablation process is performed using an excimer laser on the side of the mask metal pattern to form an intermediate hole in the insulating base material at the portion of the exposed hole, which corresponds to an installation area of an IC to be mounted on the surface of the mask metal pattern. A photoresist film is formed except for the area, and then the mask metal pattern portion located in the IC installation area is removed, and then a photo ablation process is applied using an excimer laser to form a hole from the intermediate hole to the circuit wiring pattern. A flexible IC mounting device comprising the steps of forming a recess in a portion located in the IC installation area, and finally providing a conductive member in the perforation to form a protruding bump that is connected to the circuit wiring pattern. Manufacturing method for sexual circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2261133A JPH0734445B2 (en) | 1990-09-29 | 1990-09-29 | Method of manufacturing flexible circuit board for mounting IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2261133A JPH0734445B2 (en) | 1990-09-29 | 1990-09-29 | Method of manufacturing flexible circuit board for mounting IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04139735A true JPH04139735A (en) | 1992-05-13 |
| JPH0734445B2 JPH0734445B2 (en) | 1995-04-12 |
Family
ID=17357553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2261133A Expired - Fee Related JPH0734445B2 (en) | 1990-09-29 | 1990-09-29 | Method of manufacturing flexible circuit board for mounting IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0734445B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8946891B1 (en) | 2012-09-04 | 2015-02-03 | Amkor Technology, Inc. | Mushroom shaped bump on repassivation |
| CN105097574A (en) * | 2014-05-12 | 2015-11-25 | 丰田自动车株式会社 | Semiconductor device and method for producing semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010476A (en) * | 1973-05-31 | 1975-02-03 | ||
| JPS5471568A (en) * | 1977-11-18 | 1979-06-08 | Hitachi Ltd | Semiconductor chip package |
| JPS62216297A (en) * | 1986-03-17 | 1987-09-22 | 富士通株式会社 | Hole drilling of multilayer printed board |
-
1990
- 1990-09-29 JP JP2261133A patent/JPH0734445B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010476A (en) * | 1973-05-31 | 1975-02-03 | ||
| JPS5471568A (en) * | 1977-11-18 | 1979-06-08 | Hitachi Ltd | Semiconductor chip package |
| JPS62216297A (en) * | 1986-03-17 | 1987-09-22 | 富士通株式会社 | Hole drilling of multilayer printed board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8946891B1 (en) | 2012-09-04 | 2015-02-03 | Amkor Technology, Inc. | Mushroom shaped bump on repassivation |
| CN105097574A (en) * | 2014-05-12 | 2015-11-25 | 丰田自动车株式会社 | Semiconductor device and method for producing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0734445B2 (en) | 1995-04-12 |
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