JPH04137743A - Electronic component mounting board provided with fail mark - Google Patents

Abstract

PURPOSE:To improve judgment of fail mark by providing a detection object part having no conductor circuit at a position corresponding with individual product pieces at a frame part thereby making a through-hole, which is detected through a sensor at the time of mounting an electronic component, and forming a bottomed push-back hole at a passed part. CONSTITUTION:Detection object parts 8 having no conductor circuit are provided at positions corresponding with individual product pieces 1, 1a, 1b at the frame parts 2a, 2b of an electronic component mounting board. Push-back holes 6, which become through-holes and detected by a sensor as failed parts at the time of mounting an electronic component 4, are punched at the detection object parts 8. According to the arrangement, fail mark can be judged more easily by the sensor and failure of drilling can be avoided positively.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting board for mounting electronic components such as semiconductor elements.

[Conventional technology]

Conventionally, in the assembly process for mounting electronic components on a board, a defective board is displayed to prevent expensive electronic components from being mounted on a defective board, a sensor is used to read the defective part, the defective part is skipped, and the electronic part is placed on the board. It was implemented in The following methods are known as methods for indicating this defect.

■Method of marking the mounting area of electronic components by applying paint.

■How to drill a hole in the mounting area of electronic components.

[Problem to be solved by the invention]

However, the conventional defect display method described above has the following problems.

In other words, in the method (2) above, the mounting part pattern and the defect display mark must be read separately by a sensor, which makes it difficult to read.Also, when die paste printing is performed as a pre-process for mounting electronic components, the printing results in multiple prints. Since this process is carried out for all products at once, there is a problem in that the defective markings are covered up by the silver paste and cannot be identified.

In addition, with method (2) above, the ink for die paste printing flows under the hole drilled, and the back side of the board and equipment such as the printing table are stained with paste ink. When the boards are piled up, drilling waste may damage the conductor circuits of the boards, stain the board surface, cause poor mounting of electronic components, poor wire bonding connections, and even damage caused by drilling. There is a problem that this requires a separate process, which increases the number of man-hours.

The purpose of the present invention is to improve the ease of identifying defective indications by sensors, avoid defects caused by drilling, and mount electronic components without contaminating the back side of the board or the mounting line, and without requiring a separate process. The objective is to provide a substrate for

[Means to solve the problem]

In order to solve the above problems, in the present invention, a detection target part that does not form a conductive circuit is provided at a position corresponding to each product piece of the frame part of a board for mounting electronic components, and the detection target part is An electronic device with a defect indicator hole, which is characterized by a push-back hole formed by punching so that it can be a through hole that can be detected by a sensor as a defective point, and no hole is formed in a non-defective area. Its gist is a board for mounting components.

[Effect]

By adopting the above configuration, a detection target part that does not form a conductive circuit is provided at a position corresponding to each product piece of the frame part of the electronic component mounting board, and this detection target part is pushed back by punching. A hole is formed, and the pushback hole does not have a hole in a non-defective part, but a through hole in a defective part, which is detected by a sensor as a defective part, and no electronic components are mounted on this board.

〔Example〕

An embodiment embodying the present invention will be described below with reference to FIGS. 1-11.

FIG. 4 is a partially cutaway view showing the substrate provided with the defect indicator hole of this embodiment. As shown in FIG. 4, the electronic component mounting board of this embodiment has a plurality of circular individual product pieces 1a, l.
b and the two frames 2a, 2 located on both sides thereof
These individual product pieces 1a and 1b are attached to frames 2a and 2b at two places, upper and lower, with a certain interval between them.
It is connected with. A square electronic component mounting portion 3 is formed approximately in the center of the individual product pieces 1a, lb, and the electronic component mounting portion 3 is equipped with a product piece that is determined not to be defective as a result of quality inspection. A square electronic component 4 is mounted only on 1a.

Moreover, one frame 2 of the frames 2a and 2b
In a, the individual product piece 1a has circular feed holes 5a and 5b of two sizes, large and small, for conveying the substrate.

It is transparently provided at a position corresponding to lb. Furthermore, circular pushback holes 6 or through holes 7 are formed at positions corresponding to the individual product pieces 1a and lb in the detection target portions of the frame 2a that do not form conductive circuits. This pushback hole 6 does not have a substantial hole, and a mark 8 made of the same material as the surrounding frame 2a is fitted into the through hole 7. and,
This mark 8 can be easily removed by a method described later, and as a result of its removal, the through hole 7 as the defect indicating hole is formed there. This through hole 7 formed by removing the mark 8 is detected as having a defective part by a sensor (not shown), and the electronic component mounting portion 3 of the product piece 1b formed at the position corresponding to this through hole 7 is inserted. The electronic component 4 is not mounted.

Next, a method for manufacturing the substrate and a method for forming the pushback holes 6 will be explained. FIG. 2 is a partially cutaway view showing the substrate before the pushback holes 6 are formed, and this substrate is manufactured, for example, as follows. That is,
After forming through holes (not shown) in the already laminated copper-clad laminates using an NC drill or the like, through-hole plating is performed using copper plating, and then conductor circuits are formed by resist and etching using known methods. At this time, it is ensured that copper foil, copper plating, etc., which are conductors, are not present on the front and back surfaces of the frame 2a, particularly in the portion where the pushback hole 6 is to be formed. After that, a solder resist is appropriately printed on the board other than the electronic component mounting part 3 of the conductor circuit and the connection terminal part (not shown), and nickel, gold, solder plating, etc. are applied to the electronic component mounting part 3 and the connection terminal part as appropriate. After application, a plurality of individual product pieces l are placed on the two frames 2a and 2b.
The frame 2a is punched out using a mold so that the N parts are connected at regular intervals.
It has already been drilled with other through-holes by machining with a C-drill or the like.

In this way, a substrate as shown in FIG. 2 is produced.

Next, in the same process as the punching of the feed holes 5a and 5b, pushback holes 6 are formed in the frame 2a of this substrate by die punching according to the procedure shown below.

5 to 7 are cross-sectional views showing the above procedure, in which the substrate without pushback holes shown in FIG. 2 is pushed back to the desired position on the pushback hole forming device 9. FIG. 3 is a cross-sectional view showing a state in which the device is positioned and placed so that a hole 6 is formed.

As shown in FIG. 5, the pushback hole forming device 9
consists of a base 10 and a punch shaft 11. This base IO consists of three layers: the shedder 12 in the lower layer, the pedestal 13b in the middle layer, and the pedestal 13a in the upper layer.
3b is hollowed out to have almost the same shape as the intended pushback hole 6 as a portion where the pushback hole 6 is formed, and a space 22 is formed in the portion where the seat 13b was located. A spring 14 having approximately the same height as the seat 13b is disposed in the space 22, and a spring 14 having approximately the same diameter as the pushback hole 6 on the upper surface of the spring
A large stand 15 having approximately the same thickness as 3a is provided, and the upper surface of the seat 13a and the upper surface of the large stand 15 are substantially flush with each other.

However, the thickness of the seat 13b needs to be larger than the sum of the thickness of the frame 2a and the height of the spring 14 when it is most contracted. Further, the punch shaft 11 has approximately the same diameter as the pushback hole 6, and is attached to the same position as the pedestal 15 so as to be vertically movable.

As shown in FIG. 6, the punch shaft 11 is lowered with respect to the substrate placed in this way, and penetrates the frame 2a. When the penetration is completed, the punch shaft 11 is raised upward. Then, since the compressed spring 14 shown in FIG. 6 has an upward biasing force, the stand 15 places the mark 8, which is the punching shell of the frame 2a formed by the descent of the punch shaft 11. It rises while placed and returns to its original position. As a result, as shown in FIG. 7, the mark 8 is fitted into the through hole 7 formed in the frame 2a, and the pushback hole 6 is formed.

The fitting state of the mark 8 is determined by the operation of punching the hole with the punch shaft 11, so that there are no hangnails or fuzz of the glass cloth, resin, etc. of the base material mutually formed around the mark 8 and the through hole 7 of the frame 2a. It serves as a positioner, and the mark 8 is held in its original position within the through hole 7. Therefore, unless an external force acts, the mark 8 will be on the frame 2a.
Karanuki never falls off.

In this way, as shown in FIG.
A pushback hole 6 is formed at a position corresponding to .

Next, the pushback hole 6 made as described above
The substrate having the above-mentioned characteristics is subjected to quality inspection to check whether there are any defective parts. Then, as a result of the quality inspection for disconnections, short circuits, etc. of the conductor circuit, if any defective parts are found, the mark 8 of the pushback hole 6, which is the part to be detected, is removed in the following manner, for example.

FIG. 8 is a front view showing punching scissors 16, which is one means for removing the mark 8. A protrusion 17 having a diameter slightly smaller than the diameter of the pushback hole 6 and an insertion hole 18 having a diameter slightly larger than the diameter of the pushback hole 6 are integrally formed at the tip of the punching scissors 16. By grasping the pair of handles 19 of the scissors 1 and 6, the convex part 17 penetrates the insertion hole 18, and by releasing the force applied to the handles 19, the convex part 17 is inserted between the handles 19 near the pin 20. It returns to its original state due to the biasing force of the spring 21.

9 to 11 are views showing a series of operations for removing the mark 8 of the pushback hole 6, and are partial sectional views taken along the line A--A in FIG. 3.

First, FIG. 9 shows the state before the punching operation, in which the mark 8 is stably fitted into the frame 2a. Next, as shown in FIG. 10, by grasping and pressing the handle 19 of the punching scissors 16, the convex portion 17 of the punching scissors 16 presses the mark 8 downward. Then, by pulling out the mark 8 downward from the insertion hole 18, it is removed from the frame 2a. After the detachment is completed, by releasing the force applied to the handle 19 of the punching scissors 16, the protrusion 17 comes out of the insertion hole 18 and returns to its original position, and as shown in FIG.
A through hole 7 is formed in. Through these series of operations,
The mark 8 fitted to the frame 2a can be easily removed.

As a result of the inspection, a defective part was found, and the mark 8 was removed from the pushback hole 6 by the above operation.As shown in FIG. 4, the removed part became a through hole 7, and the through hole 7 is a sign of a defective part during the next step, electronic component 4.

During the next process of mounting electronic components, if a sensor (not shown) (including a control means) detects the pushback hole 6 (mark 8), it determines that there is no defective part.
An instruction is given to mount the electronic component 4 on the electronic component mounting portion 3 of the individual product piece 1a corresponding to the pushback hole 6. On the other hand, if the mark 8 is not detected, that is, if the through hole 7 is detected, it is determined that there is a defective part, and nothing is mounted on the electronic component mounting portion 3 of the product piece ib corresponding to the through hole 7. .

In this way, as shown in FIG. A board is obtained in which nothing is mounted on the component mounting section 3 because there is a defective portion.

In the electronic component mounting board configured according to the above embodiment, the defective location can be indicated by simply removing the mark 8 of the pushback hole 6 and forming a through hole 7, and the work of removing the mark 8 is very simple. It is something. Furthermore, the defect display mark is no longer filled out as in the conventional case, and the ease with which the sensor can identify the defective location is further improved. Furthermore, after the individual product pieces 1 are formed, ink may flow down from the holes drilled in the conventional electronic component mounting area and may damage the back side of the electronic component mounting area or the mounting line. You can definitely avoid the situation of contamination. Further, since the pushback hole 6 is formed in the part of the frame 2a where the conductor circuit is not provided, there is no occurrence of cracks due to the conductor circuit, and there is no occurrence of scratches when the boards are stacked. Furthermore, there is no need to provide a separate process for drilling holes, resulting in cost and time savings.

Note that the present invention is not limited to the above embodiments,
For example, the following configuration may be adopted without departing from the spirit of the invention.

(1) In this embodiment, the pushback hole 6 was formed after the feed holes 5a and 5b were provided, but the pushback hole 6 was not punched exclusively for the pushback hole 6,
Simultaneously with the punching outer die processing using the above-mentioned die, a die may be created and formed as a part of the outer die. in this case,
Furthermore, it is possible to reduce the number of molds and eliminate one step.

(2) In this embodiment, the entire frame 2a is illustrated in FIGS. 1 to 4 as having no copper foil, copper plating, etc., so that there is no copper foil, copper plating, etc. on the frame 2a, but at least It is necessary that there be no copper foil, copper plating, etc. on the front and back sides of the back hole 6.

(3) In this embodiment, a spring 14 is used as a biasing member inside the base 10 of the pushback hole forming device 9, but instead of the spring 14, an elastic member such as polyurethane or rubber may be used. May be used.

(4) In this embodiment, the pushback hole 6 and the feed hole both have circular shapes, but polygonal shapes such as ellipses or squares may be used.

[Effects of the Invention] The electronic component mounting board of the present invention further improves the ease of identifying defective indications by sensors, and also reliably avoids defects caused by drilling, which may contaminate the back side of the board or the mounting line. This has the excellent effect of eliminating the need for a separate process.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway view showing a board on which a defect indicator hole of the present invention is provided and electronic components are mounted, and Fig. 2 is a partially cutaway view showing the board before the pushback hole is formed. side view,
Figure 3 is a partially cutaway view showing the board with the bushback hole formed, and Figure 4 is a partially cutaway view showing the board with the defect indicator hole and before electronic components are mounted. , 5th to 7th
The figure is a cross-sectional view showing the procedure for forming bushback holes.
Fig. 8 is a front view showing punching scissors for removing pushback hole marks, and Figs. 9 to 11 are sectional views showing a series of operations for removing pushback hole marks. 1. la, lb... individual product pieces, 4... electronic parts, 6
...Pushback hole, 7...Through hole, 8...Mark as detection target part.

Claims (1)

[Claims] 1. Frame part of electronic component mounting board (2a, 2b)
A detection target part (8) that does not form a conductive circuit is provided at a position corresponding to each product piece (1, 1a, 1b), and the detection target part (8) is detected as a defective part by a sensor when an electronic component (4) is mounted. A defect indicator hole is formed by punching a pushback hole (6) which is made into a through hole (7) which can be detected by the process, and which has no hole in the non-defective part. A board for mounting electronic components.