JPH0413440B2 - - Google Patents
Info
- Publication number
- JPH0413440B2 JPH0413440B2 JP18725388A JP18725388A JPH0413440B2 JP H0413440 B2 JPH0413440 B2 JP H0413440B2 JP 18725388 A JP18725388 A JP 18725388A JP 18725388 A JP18725388 A JP 18725388A JP H0413440 B2 JPH0413440 B2 JP H0413440B2
- Authority
- JP
- Japan
- Prior art keywords
- value
- plating
- voltage
- current
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 65
- 238000001514 detection method Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 2
- 229910000679 solder Chemical group 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18725388A JPH02175899A (ja) | 1988-07-26 | 1988-07-26 | 電気メッキにおける電流・電圧の制御方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18725388A JPH02175899A (ja) | 1988-07-26 | 1988-07-26 | 電気メッキにおける電流・電圧の制御方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02175899A JPH02175899A (ja) | 1990-07-09 |
| JPH0413440B2 true JPH0413440B2 (enrdf_load_stackoverflow) | 1992-03-09 |
Family
ID=16202732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18725388A Granted JPH02175899A (ja) | 1988-07-26 | 1988-07-26 | 電気メッキにおける電流・電圧の制御方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02175899A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9783908B2 (en) * | 2012-10-23 | 2017-10-10 | Moses Lake Industries, Inc. | Plating bath metrology |
-
1988
- 1988-07-26 JP JP18725388A patent/JPH02175899A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02175899A (ja) | 1990-07-09 |
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