JPH0412698Y2 - - Google Patents
Info
- Publication number
- JPH0412698Y2 JPH0412698Y2 JP1985139672U JP13967285U JPH0412698Y2 JP H0412698 Y2 JPH0412698 Y2 JP H0412698Y2 JP 1985139672 U JP1985139672 U JP 1985139672U JP 13967285 U JP13967285 U JP 13967285U JP H0412698 Y2 JPH0412698 Y2 JP H0412698Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- light emitting
- light source
- linear light
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985139672U JPH0412698Y2 (fr) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985139672U JPH0412698Y2 (fr) | 1985-09-12 | 1985-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6247155U JPS6247155U (fr) | 1987-03-23 |
JPH0412698Y2 true JPH0412698Y2 (fr) | 1992-03-26 |
Family
ID=31045795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985139672U Expired JPH0412698Y2 (fr) | 1985-09-12 | 1985-09-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0412698Y2 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5028975B2 (ja) * | 2006-11-28 | 2012-09-19 | セイコーエプソン株式会社 | 光源装置、プロジェクタ及びモニタ装置 |
JP5242939B2 (ja) * | 2007-04-19 | 2013-07-24 | スタンレー電気株式会社 | 光デバイス |
US8013501B2 (en) * | 2008-06-04 | 2011-09-06 | Forever Bulb, Llc | LED-based light bulb device |
EP2254396A1 (fr) * | 2009-05-20 | 2010-11-24 | Koninklijke Philips Electronics N.V. | Carte à circuit imprimé pour fournir une lumière ambiante |
JP5024417B2 (ja) * | 2010-04-21 | 2012-09-12 | 三菱電機株式会社 | 画像読取装置 |
-
1985
- 1985-09-12 JP JP1985139672U patent/JPH0412698Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6247155U (fr) | 1987-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7270464B2 (en) | Backlight device and liquid crystal display | |
US4173035A (en) | Tape strip for effecting moving light display | |
US7387406B2 (en) | Modular mounting arrangement and method for light emitting diodes | |
JPH0412698Y2 (fr) | ||
US6390639B2 (en) | Spread illuminating apparatus | |
US6799870B2 (en) | Sideway-projecting light emitting diode structure | |
JP7360343B2 (ja) | 光源ユニットおよび車両用灯具 | |
JPH05299702A (ja) | Ledアレイ | |
JPH0129930Y2 (fr) | ||
JPH086614Y2 (ja) | 車輌用標識灯 | |
JPH034049Y2 (fr) | ||
JP2007095555A (ja) | 発光装置 | |
JPS61229374A (ja) | 半導体発光表示装置 | |
JPH0652833B2 (ja) | 複写機用イレーサー | |
EP3211967B1 (fr) | Module électroluminescent | |
JPH0436129Y2 (fr) | ||
JPH0128545Y2 (fr) | ||
JPS6245716B2 (fr) | ||
CN212204389U (zh) | 光源单元及车辆用灯具 | |
JP2515831Y2 (ja) | 車輌用標識灯 | |
JPH0345264Y2 (fr) | ||
JPH0432769Y2 (fr) | ||
JPH0513577Y2 (fr) | ||
JPH0617170Y2 (ja) | 表面実装型led表示装置 | |
JP2544245Y2 (ja) | 液晶表示装置 |