JPH0412698Y2 - - Google Patents
Info
- Publication number
- JPH0412698Y2 JPH0412698Y2 JP1985139672U JP13967285U JPH0412698Y2 JP H0412698 Y2 JPH0412698 Y2 JP H0412698Y2 JP 1985139672 U JP1985139672 U JP 1985139672U JP 13967285 U JP13967285 U JP 13967285U JP H0412698 Y2 JPH0412698 Y2 JP H0412698Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- light emitting
- light source
- linear light
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Exposure Or Original Feeding In Electrophotography (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
イ 産業上の利用分野
本考案は電子写真装置のイレース光源等に好適
な線状光源に関する。[Detailed Description of the Invention] A. Field of Industrial Application The present invention relates to a linear light source suitable for an erase light source of an electrophotographic device, etc.
ロ 従来の技術
近年電子写真装置に用いるイレース光源として
特開昭60−60666号公報等に示される如く、発光
ダイオード又は発光ダイオードランプを用いた線
状光源を用いる事がなされてきた。このような線
状光源は、他のチヤージヤ、現像器、転写器等と
共に全て感光ドラム又は感光ベルトの周辺に整列
されるので薄くする必要がある。B. Prior Art In recent years, a linear light source using a light emitting diode or a light emitting diode lamp has been used as an erase light source for electrophotographic apparatuses, as shown in Japanese Patent Application Laid-Open No. 60-60666. Such a linear light source, along with other chargers, developing devices, transfer devices, etc., are all arranged around the photosensitive drum or photosensitive belt, so they must be thin.
線状光源を薄くするには、例えば実開昭59−
14360号公報に記載されているが、第３図に示す
ように基板２１の端縁２０に発光ダイオード２
２，２２…を並べて載置すればよい。ところが、
これは発想としては優れているが、端縁２０にプ
リントパターン等の配線を施こす事は極めて困難
であるから、発光ダイオード２２，２２…に配線
を施こす事が事実上できない。 To make a linear light source thinner, for example,
Although it is described in Japanese Patent No. 14360, as shown in FIG.
2, 22, etc. may be placed side by side. However,
Although this is an excellent idea, it is extremely difficult to provide wiring such as a printed pattern on the edge 20, so it is virtually impossible to provide wiring to the light emitting diodes 22, 22, . . .
しかし、巾の細いプリント基板等を用いても、
支持体又は駆動回路等との配線を考慮すると、巾
は100mm以上となりＴ字状に基板を組立てるなど
構成も複雑となつて不都合であつた。 However, even if a narrow printed circuit board is used,
Considering the wiring with the support body or drive circuit, etc., the width is 100 mm or more, which is disadvantageous because the configuration is complicated, such as assembling the board in a T-shape.
ハ 考案が解決しようとする問題点
本考案は上述の点を考慮してなされたもので、
薄くてかつ構造が簡単な線状光源を提供するもの
である。C. Problems that the invention aims to solve This invention was made in consideration of the above points.
To provide a linear light source that is thin and has a simple structure.
ニ 問題点を解決するための手段
本考案は金属基台を略Ｌ字状に折曲げ、その折
曲短片の外側に向く面に発光ダイオードを整列載
置したもので、さらに好ましくは、可撓性基板を
その金属基台に貼付して配線を施こしたものであ
る。D. Means for Solving the Problems The present invention has a metal base bent into a substantially L-shape, and light emitting diodes are arranged and mounted on the outward facing surface of the bent short piece. A flexible board is attached to the metal base and wiring is applied.
ホ作用
これにより全体的な厚さは略折曲短片の巾とな
るから薄くかつ構造も簡単となる。(E) Effect: As a result, the overall thickness is approximately the width of the bent strip, making it thin and the structure simple.
ヘ 実施例
第１図は本考案実施例の線状光源の斜視図で、
１は厚さ0.5〜２mmの銅版からなる金属基台で、
１辺が折曲げられてＬ字状をなしている。２，２
…は金属基台１の折曲短片１ａに１列に整列して
直接に載置固着された発光ダイオードで、例えば
GaP等からなり金属基台表面を金属ブラシで荒ら
したあと酸化防止剤入の導電接着剤で固着してあ
る。３は金属基台１の折曲部１ｂを含む発光ダイ
オードを載置した面に貼付された可撓性基板で、
要部を露出させ他はオーバーコートされた導電箔
３１，３１…を有したポリイミド樹脂シート等か
らなるものである。そして発光ダイオード２，２
…はこの可撓性基板３にワイヤボンド細線等で配
線が施されている。また４は可撓性基板３に固着
され配線された発光ダイオード２，２…の駆動素
子で、セラミツクキヤツプで覆われている。Embodiment FIG. 1 is a perspective view of a linear light source according to an embodiment of the present invention.
1 is a metal base made of copper plate with a thickness of 0.5 to 2 mm,
One side is bent to form an L shape. 2,2
... are light emitting diodes that are directly mounted and fixed in a line on the bent short pieces 1a of the metal base 1, for example.
The surface of a metal base made of GaP or the like is roughened with a metal brush and then fixed with a conductive adhesive containing antioxidant. 3 is a flexible substrate affixed to the surface of the metal base 1 on which the light emitting diode is placed, including the bent portion 1b;
It is made of a polyimide resin sheet or the like having conductive foils 31, 31, . . . with the main parts exposed and the other parts overcoated. and light emitting diode 2,2
. . . Wiring is provided on this flexible substrate 3 using wire bond thin wires or the like. Further, reference numeral 4 denotes a driving element for light emitting diodes 2, 2, .
第２図は本考案の他の実施例の線状光源を示す
側面断面図である。金属基台１１はアルミニウム
板で、折曲角は鈍角なのでヘ字状をしている。発
光ダイオード１２，１２…は第１図と同様１列に
整列配置してあるが、発光ダイオード１２，１２
…は第１図と同様１列に整列配置してあるが、可
撓性基板１３は基台端縁まで延在しているので、
発光ダイオード１２，１２…は可撓性基板１３を
介して金属基台１１に載置されている。これは金
属基台１，１１を用いる事で発光ダイオード１
２，１２…の固定（光を指向させるべき方向への
機械的支持）が確実で、かつ発光ダイオード１
２，１２…の発熱に対し放熱特性が良いという長
所をもつ反面、特にアルミニウム等は表面が酸化
しやすく発光ダイオードへの給電路として導通不
良を生じやすいからである。１４は第１図と同様
駆動素子であるが、黒色樹脂をポツテイングして
封止してある。１５は金属基台１１の折曲短片１
１ａを覆い発光ダイオード２，２…の光を所望方
向に指向させる反射枠で、白色樹脂成型品等から
なり、金属基台１１を反射枠１５に挿入する（図
面の紙面に垂直方向）方法か又は、分離可能な反
射枠組立体で金属基台１１を挾持する方法で取付
固定される。 FIG. 2 is a side sectional view showing a linear light source according to another embodiment of the present invention. The metal base 11 is an aluminum plate, and has an obtuse bending angle, so it has an F-shape. The light emitting diodes 12, 12... are arranged in a line as in FIG.
... are arranged in one line as in FIG. 1, but since the flexible substrate 13 extends to the edge of the base,
The light emitting diodes 12, 12, . . . are mounted on a metal base 11 via a flexible substrate 13. This can be achieved by using metal bases 1 and 11.
2, 12... (mechanical support in the direction in which the light should be directed) is secure, and the light emitting diode 1
This is because, although it has the advantage of good heat dissipation characteristics against the heat generated by 2, 12, . Reference numeral 14 designates a driving element as in FIG. 1, but it is sealed by potting black resin. 15 is a bent short piece 1 of the metal base 11
1a is covered with a reflective frame that directs the light of the light emitting diodes 2, 2, etc. in a desired direction, and is made of a white resin molded product or the like, and the metal base 11 is inserted into the reflective frame 15 (in a direction perpendicular to the plane of the drawing). Alternatively, the metal base 11 may be attached and fixed by sandwiching the metal base 11 with a separable reflective frame assembly.
またいずれの例においても、発光ダイオード
２，２…１２，１２…は１列整列に限られず、千
鳥配置の２列整列でもよいが折曲げた基台の１辺
に平行である必要がある。また可撓性基板３，１
３は配線のために折曲部１ｂ，１１ｂを必ず覆わ
なくてはならないが、可撓性基板３，１３として
の別体ものを貼付するかわりに絶縁被覆と導体を
印刷で設けて可撓性基板としてもよい。 Further, in any of the examples, the light emitting diodes 2, 2...12, 12... are not limited to being arranged in one row, but may be arranged in two rows in a staggered arrangement, but they must be parallel to one side of the bent base. In addition, flexible substrates 3 and 1
3, it is necessary to cover the bent parts 1b and 11b for wiring, but instead of attaching separate flexible substrates 3 and 13, an insulating coating and a conductor are provided by printing to make the flexible It may also be used as a substrate.
ト 考案の効果
以上の如くにより、金属基台を略Ｌ字状（即ち
Ｌ字状又はヘ字状）に折曲げることで、発光ダイ
オードの光は基台面の略延長方向に向けられ、か
つ全体は３〜９mmの厚みとすることができるか
ら、電子写真装置等に取付けるときも狭いスペー
スでよい。さらに金属基台を用いる事で放熱がよ
く色相ずれや寿命が短かくなることがない。G. Effects of the invention As described above, by bending the metal base into a substantially L-shape (that is, L-shape or F-shape), the light from the light emitting diode is directed in the substantially extending direction of the base surface, and the entire Since it can be made to have a thickness of 3 to 9 mm, it can be installed in an electrophotographic device or the like in a narrow space. Furthermore, by using a metal base, heat dissipation is good and there is no hue shift or shortened lifespan.
第１図は本考案実施例の線状光源の斜視図、第
２図は本考案の他の実施例の線状光源の側面断面
図、第３図は従来の線状光源の斜視図である。
１，１１……金属基台、１ａ，１１ａ……折曲
短片、２，２…１２，１２……発光ダイオード、
３，１３……可撓性基板、４，１４……駆動素
子、１５……反射枠。
FIG. 1 is a perspective view of a linear light source according to an embodiment of the present invention, FIG. 2 is a side sectional view of a linear light source according to another embodiment of the present invention, and FIG. 3 is a perspective view of a conventional linear light source. . 1, 11...metal base, 1a, 11a...bent short piece, 2, 2...12, 12...light emitting diode,
3, 13...flexible substrate, 4, 14...drive element, 15...reflection frame.
Claims (1)
折曲短片の外側に向く面上に整列して載置され
た複数の発光ダイオードと、金属基台に載置さ
れた発光ダイオードの駆動素子とを具備した事
を特徴とする線状光源。 (2) 前記金属基板には配線パターンを有する可撓
性基板が貼付してある事を特徴とする前記実用
新案登録請求の範囲第１項記載の線状光源。[Claims for Utility Model Registration] (1) A metal base having a substantially L-shape, and a plurality of light emitting diodes arranged in alignment on the outward facing surface of a bent short piece of the metal base; A linear light source characterized by comprising a light emitting diode driving element mounted on a metal base. (2) The linear light source according to claim 1, wherein a flexible substrate having a wiring pattern is attached to the metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139672U JPH0412698Y2 (en) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139672U JPH0412698Y2 (en) | 1985-09-12 | 1985-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6247155U JPS6247155U (en) | 1987-03-23 |
| JPH0412698Y2 true JPH0412698Y2 (en) | 1992-03-26 |
Family
ID=31045795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985139672U Expired JPH0412698Y2 (en) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412698Y2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5028975B2 (en) * | 2006-11-28 | 2012-09-19 | セイコーエプソン株式会社 | Light source device, projector and monitor device |
| JP5242939B2 (en) * | 2007-04-19 | 2013-07-24 | スタンレー電気株式会社 | Optical device |
| US8013501B2 (en) * | 2008-06-04 | 2011-09-06 | Forever Bulb, Llc | LED-based light bulb device |
| EP2254396A1 (en) * | 2009-05-20 | 2010-11-24 | Koninklijke Philips Electronics N.V. | Printed circuit board for providing ambient light |
| JP5024417B2 (en) * | 2010-04-21 | 2012-09-12 | 三菱電機株式会社 | Image reading device |
-
1985
- 1985-09-12 JP JP1985139672U patent/JPH0412698Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6247155U (en) | 1987-03-23 |
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