JPH0128545Y2 - - Google Patents
Info
- Publication number
- JPH0128545Y2 JPH0128545Y2 JP1985102480U JP10248085U JPH0128545Y2 JP H0128545 Y2 JPH0128545 Y2 JP H0128545Y2 JP 1985102480 U JP1985102480 U JP 1985102480U JP 10248085 U JP10248085 U JP 10248085U JP H0128545 Y2 JPH0128545 Y2 JP H0128545Y2
- Authority
- JP
- Japan
- Prior art keywords
- led
- printed circuit
- circuit board
- pin terminal
- dot matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
この考案は、ドツトマトリツクス表示器に関す
るものである。[Detailed Description of the Invention] (Field of Industrial Application) This invention relates to a dot matrix display.
（従来の技術）
従来知られているLEDを光源としたドツトマ
トリツクス表示器は、例えば、第４図に示すよう
に、フレキシブルプリント基板ａにLEDチツプ
ｂが装着され、このプリント基板ａの背面側に
は、補助板ｃが取付けられ、前面側には、反射凹
部ｄを形成したハウジングｅが取付けられて、反
射凹部ｄに前記LEDチツプｂが位置するように
なつており、さらに、ハウジングｅの前面側に
は、フイルムｆが取付けられて、前記反射凹部ｄ
に対応する部分は、光透過部に、他の部分は、遮
光部に形成された構造となつている。(Prior Art) A dot matrix display using a conventionally known LED as a light source, for example, as shown in FIG. 4, has an LED chip b attached to a flexible printed circuit board a, and a An auxiliary plate c is attached to the side, and a housing e having a reflective recess d is attached to the front side, and the LED chip b is positioned in the reflective recess d. A film f is attached to the front side of the reflective recess d.
The structure is such that a portion corresponding to 1 is formed as a light transmitting portion, and the other portions are formed as a light shielding portion.
この場合、プリント基板ａと補助板ｃとは、接
着され、これらとハウジングｅとは、プリント基
板ａに取付けられて補助板ｃを挿通するピン端子
（図示せず）を熱カシメすることにより固定され、
ハウジングｅとフイルムｆとは、接着手段により
取付けられるようになつている。 In this case, the printed circuit board a and the auxiliary board c are glued together, and these and the housing e are fixed by thermally caulking a pin terminal (not shown) that is attached to the printed circuit board a and inserted through the auxiliary board c. is,
The housing e and the film f are attached by adhesive means.
ところが、上記の構成によると、組付工程が面
倒で非能率的であり、またLEDから発する熱が
内部にこもつてピン端子の熱カシメ部及び他の接
着部が不安定となり、熱の影響によつて各LED
の発光輝度にバラツキが生じて表示機能が低下す
る等の欠点があつた。 However, according to the above configuration, the assembly process is troublesome and inefficient, and the heat emitted from the LED gets stuck inside, making the thermally caulked part of the pin terminal and other adhesive parts unstable, and the effects of heat increase. Each LED by
There were drawbacks such as variations in the luminance of the light emitted by the display, resulting in a decline in display function.
（考案が解決しようとする問題点）
この考案は、上記した従来の問題点を解決する
ためになされ、組付作業の能率化を図ると共に、
LEDの放熱を発散できるようにしたドツトマト
リツクス表示器を提供しようとするものである。(Problems to be solved by the invention) This invention was made in order to solve the above-mentioned conventional problems, and aims to streamline the assembly work, as well as
The present invention aims to provide a dot matrix display device that can dissipate heat from LEDs.
（問題点を解決するための手段）
問題点を解決するに当つて、この考案は、
LEDを光源とするドツトマトリツクス表示器に
おいて、前記LEDを実装した薄いプリント基板
の背面側に放熱フイン及びピン端子挿通用の孔を
設けた放熱板を貼着し、これらをランプハウスに
嵌め込むと共に、合成樹脂を流し込み、一体化し
た構成を要旨とするものである。(Means for solving the problem) In solving the problem, this idea:
In a dot matrix display that uses an LED as a light source, a heat dissipation plate with heat dissipation fins and holes for pin terminal insertion is pasted on the back side of the thin printed circuit board on which the LED is mounted, and these are fitted into the lamp house. At the same time, the main feature is an integrated structure in which synthetic resin is poured.
（実施例）
以下、図示の実施例により、この考案を具体的
に説明すると、１は、0.3mm程度の薄いプリント
基板であり、ガラスエポキシシートと称する絶縁
性の良好なシートの両面に、配線パターンとなる
銅箔がエツチングにより形成されている。このプ
リント基板１の所定の箇所には、LEDチツプ２，
２′が装着され、ピン端子３がハンダ付けされて
いる。LEDチツプ２，２′は、例えば、赤色発光
のものと、緑色発光のものとを一組とし、隣接状
態にて多数配設されている。４は、プリント基板
１の背面側に貼着した放熱板であり、多数の放熱
フイン４ａが形成され、かつ前記ピン端子３を挿
通するための孔４ｂが形成されている。この放熱
板４は、プリント基板１と同質のガラスエポキシ
シート材４′を接着剤として、熱圧することによ
り容易に貼着することができる。なお、プリント
基板１と放熱板４とを接着した後に、前記LED
チツプ２，２′を装着し、ピン端子３を取付けた
方がよい。図中、５はランプハウスであり、反射
凹部５ａが形成されると共に、ピン端子３用の受
孔５ｂが内面側に設けられ、このランプハウスの
表面側には、耐熱性のポリエステルシート６が予
め貼着され、このシートが下になるようしてラン
プハウス５を置き、前記反射凹部５ａ及び受孔５
ｂにエポキシ樹脂７が注入される。このランプハ
ウス５に対して、前記放熱板４付きのプリント基
板１を嵌め込むと、前記LEDチツプ２，２′は反
射凹部５ａに、ピン端子３の端部は、受孔５ｂに
それぞれ位置するようになつている。そして、エ
ポキシ樹脂７を、さらに放熱板４の背面側に流し
て硬化させ、硬化後に前記ポリエステルシート６
を剥がせば、表示器８を形成することができる。
このとき、エポキシ樹脂７は、前記ピン端子挿通
用の孔４ｂに充填されるので、ピン端子３を堅固
に固定することができる。(Example) Hereinafter, this invention will be specifically explained with reference to the illustrated example. 1 is a thin printed circuit board with a thickness of about 0.3 mm, and wiring is placed on both sides of a sheet with good insulation called a glass epoxy sheet. The copper foil that becomes the pattern is formed by etching. At predetermined locations on this printed circuit board 1, LED chips 2,
2' is attached, and the pin terminal 3 is soldered. A large number of LED chips 2, 2', for example, one set that emits red light and one that emits green light, are arranged adjacent to each other. Reference numeral 4 denotes a heat dissipation plate attached to the back side of the printed circuit board 1, in which a large number of heat dissipation fins 4a are formed, and holes 4b for inserting the pin terminals 3 are formed. This heat sink 4 can be easily attached by hot pressing using a glass epoxy sheet material 4' of the same quality as the printed circuit board 1 as an adhesive. Note that after bonding the printed circuit board 1 and the heat sink 4, the LED
It is better to attach the chips 2, 2' and the pin terminal 3. In the figure, reference numeral 5 denotes a lamp house, in which a reflective recess 5a is formed and a receiving hole 5b for the pin terminal 3 is provided on the inner surface, and a heat-resistant polyester sheet 6 is provided on the surface side of the lamp house. The lamp house 5 is placed with the sheet attached in advance facing down, and the reflective recess 5a and the receiving hole 5 are
Epoxy resin 7 is injected into b. When the printed circuit board 1 with the heat sink 4 is fitted into the lamp house 5, the LED chips 2 and 2' are located in the reflective recess 5a, and the ends of the pin terminals 3 are located in the receiving hole 5b. It's becoming like that. Then, the epoxy resin 7 is further poured onto the back side of the heat sink 4 and cured, and after curing, the polyester sheet 6
By peeling it off, the display device 8 can be formed.
At this time, since the epoxy resin 7 is filled in the pin terminal insertion hole 4b, the pin terminal 3 can be firmly fixed.
（考案の効果）
以上説明したように、この考案は、エポキシ樹
脂を注入硬化させることにより、表示器の組立て
を容易にできるようにしたので、作業能率を著し
く向上させることができ、かつプリント基板の背
面側に放熱板を取付けたので、LEDチツプから
の熱を放散させることができ、高熱による故障を
未然に防止すると伴に、LEDの発光輝度を均一
に保持し、明るさのムラを防止できる等のすぐれ
た効果を奏する。(Effects of the invention) As explained above, this invention makes it possible to easily assemble the display by injecting and curing the epoxy resin, which significantly improves work efficiency, and also allows printed circuit boards to be easily assembled. A heat dissipation plate is installed on the back side of the LED chip to dissipate heat from the LED chip, preventing failures due to high heat, and maintaining uniform LED luminance to prevent uneven brightness. It has excellent effects such as:
第１図は、この考案の一実施例を示す要部の破
断斜視図、第２図は、その一部の断面図、第３図
は、ドツトマトリツクス表示器の正面図、第４図
は、従来例を示す要部の破断斜視図である。
１……プリント基板、２，２′……LEDチツ
プ、３……ピン端子、４……放熱板、４ａ……放
熱フイン、４ｂ……ピン端子挿通用の孔、５……
ランプハウス、５ａ……反射凹部、５ｂ……受
孔、６……ポリエステルシート、７……エポキシ
樹脂。
Fig. 1 is a cutaway perspective view of the main part showing an embodiment of this invention, Fig. 2 is a sectional view of a part thereof, Fig. 3 is a front view of the dot matrix display, and Fig. 4 is a FIG. 2 is a cutaway perspective view of a main part of a conventional example. 1... Printed circuit board, 2, 2'... LED chip, 3... Pin terminal, 4... Heat sink, 4a... Heat sink fin, 4b... Hole for pin terminal insertion, 5...
Lamp house, 5a... reflective recess, 5b... hole, 6... polyester sheet, 7... epoxy resin.
Claims (1)
において、前記LEDを実装した薄いプリント基
板の背面側に放熱フイン及びピン端子挿通用の孔
を設けた放熱板を貼着し、これらをランプハウス
に嵌め込むと共に、合成樹脂を流し込み、一体化
したことを特徴とするドツトマトリツクス表示
器。 In a dot matrix display that uses an LED as a light source, a heat dissipation plate with heat dissipation fins and holes for pin terminal insertion is pasted on the back side of the thin printed circuit board on which the LED is mounted, and these are fitted into the lamp house. The dot matrix display is characterized by being integrated with synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985102480U JPH0128545Y2 (en) | 1985-07-05 | 1985-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985102480U JPH0128545Y2 (en) | 1985-07-05 | 1985-07-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6212183U JPS6212183U (en) | 1987-01-24 |
| JPH0128545Y2 true JPH0128545Y2 (en) | 1989-08-30 |
Family
ID=30974161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985102480U Expired JPH0128545Y2 (en) | 1985-07-05 | 1985-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0128545Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717161Y2 (en) * | 1987-07-03 | 1995-04-19 | 星和電機株式会社 | Surface emitting element |
| CA2417172C (en) * | 2000-07-07 | 2010-10-12 | Cosmo Plant Co., Ltd. | Plant cultivating method, cultivating device, and its lighting device |
| JP4085376B2 (en) * | 2003-02-25 | 2008-05-14 | ノーリツ鋼機株式会社 | LED light source device |
-
1985
- 1985-07-05 JP JP1985102480U patent/JPH0128545Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6212183U (en) | 1987-01-24 |
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