JPH0412623B2 - - Google Patents

Info

Publication number
JPH0412623B2
JPH0412623B2 JP60102232A JP10223285A JPH0412623B2 JP H0412623 B2 JPH0412623 B2 JP H0412623B2 JP 60102232 A JP60102232 A JP 60102232A JP 10223285 A JP10223285 A JP 10223285A JP H0412623 B2 JPH0412623 B2 JP H0412623B2
Authority
JP
Japan
Prior art keywords
alloy
bonding
ppm
wire
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60102232A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61259558A (ja
Inventor
Naoyuki Hosoda
Naoki Uchama
Toshiaki Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP60102232A priority Critical patent/JPS61259558A/ja
Publication of JPS61259558A publication Critical patent/JPS61259558A/ja
Publication of JPH0412623B2 publication Critical patent/JPH0412623B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)
JP60102232A 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンディングワイヤ Granted JPS61259558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60102232A JPS61259558A (ja) 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンディングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60102232A JPS61259558A (ja) 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンディングワイヤ

Publications (2)

Publication Number Publication Date
JPS61259558A JPS61259558A (ja) 1986-11-17
JPH0412623B2 true JPH0412623B2 (enExample) 1992-03-05

Family

ID=14321898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60102232A Granted JPS61259558A (ja) 1985-05-14 1985-05-14 半導体装置用Ｃｕ合金製ボンディングワイヤ

Country Status (1)

Country Link
JP (1) JPS61259558A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2656238B2 (ja) * 1985-10-30 1997-09-24 株式会社東芝 半導体装置
JP2656236B2 (ja) * 1985-10-30 1997-09-24 株式会社東芝 半導体装置
JP2656237B2 (ja) * 1985-10-30 1997-09-24 株式会社東芝 半導体装置
JPS62127437A (ja) * 1985-11-26 1987-06-09 Tatsuta Electric Wire & Cable Co Ltd 半導体素子用ボンデイング線
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金
JPH083132B2 (ja) * 1989-06-30 1996-01-17 株式会社神戸製鋼所 薄肉銅または薄肉銅合金材およびその製造方法
CN102017175B (zh) * 2008-04-25 2014-06-25 三菱综合材料株式会社 太阳能电池用连接器用材料及太阳能电池用连接器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6199646A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61234063A (ja) * 1985-04-10 1986-10-18 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線

Also Published As

Publication number Publication date
JPS61259558A (ja) 1986-11-17

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