JPH04123532U - Semiconductor substrate cleaning equipment - Google Patents

Abstract

(57) [Summary] [Purpose] Cleans dirt adhering to the surface of semiconductor substrates, etc.
To provide a cleaning device capable of obtaining a product free from re-oxidation, uneven drying, etc. by reducing the transfer time between cleaning treatment and drying treatment. [Structure] As shown in FIG. 2, a drying nozzle 2 is newly installed in parallel with the cleaning nozzle 1 near the surface of the semiconductor substrate 3, etc., and the support mechanism 4 containing the semiconductor substrate 3 is moved. , washing and drying at the same time. [Effect] The present invention can prevent surface deterioration such as re-oxidation of the surface after cleaning and improve work efficiency.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to a cleaning device for semiconductor substrates, and in particular, the present invention relates to a cleaning device for semiconductor substrates, and in particular, a device for cleaning and drying semiconductor substrates at the same time. The present invention relates to a cleaning device that can be used for cleaning.

0002

[Conventional technology]

In conventional semiconductor substrate cleaning equipment, the object to be cleaned is first fixed in a holding mechanism and then cleaned. After cleaning the dirt on the surface of the object by supplying cleaning liquid from the nozzle, the object is transferred to the drying room. The next step was to dry it using a drying device.

0003 Therefore, when moving from the cleaning stage to the drying stage, the surface of the object to be cleaned becomes contaminated again. There was a risk that Also, depending on the cleaning solution used, the surface may become oxidized due to cleaning. There was a risk that this could happen. Furthermore, if the surface is not dried immediately after cleaning, the cleaning solution may remain on the surface. Occasionally, uneven dryness occurred.

0004

[Problem that the idea aims to solve]

As mentioned above, in conventional equipment, between the end of the cleaning process and the transition to the drying process, Moving equipment was required to prevent the contamination that occurs.

[0005] The purpose of this invention is to simultaneously perform cleaning and drying processes in order to eliminate the drawbacks of conventional technology. Another object of the present invention is to provide a cleaning device that can be easily implemented.

[0006]

[Means to solve the problem]

The structure of the semiconductor substrate cleaning apparatus according to the present invention to solve the above problems is as follows: A cleaning nozzle that supplies cleaning liquid to the surface of the object to be cleaned, a holding mechanism for the object to be cleaned, and a drive mechanism for the cleaning nozzle. In a semiconductor substrate cleaning apparatus comprising a drive device for moving the cleaning nozzle, The drying nozzles are arranged in parallel on the rear side of the nozzle.

[0007]

[Effect]

The gist of this invention is to use a cleaning nozzle in an apparatus for cleaning dirt on the surface of a semiconductor substrate. At the same time, the cleaning liquid is supplied from the nozzle to the surface, and at the same time, the drying nozzle installed in parallel applies pressure. The cleaning solution containing dirt is blown away to prevent dirt from re-adhering to the surface. washing and drying at the same time.

[0008]

【Example】

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

[0009] FIG. 1 is a schematic plan view of a semiconductor substrate cleaning apparatus according to the present invention, and FIG. 2 is a schematic plan view of a semiconductor substrate cleaning apparatus according to the present invention. FIG. 2 is a schematic cross-sectional view of a plate cleaning device.

0010 In Figure 1, 1 is a cleaning nozzle, 2 is a drying nozzle, and 3 is a semiconductor substrate (to be cleaned). 4 is a holding mechanism, and 5 is a drive device for the holding mechanism. In Figure 2, 6 is a 7 is a cover, and the other symbols are the same as in FIG.

[0011] The operation of this device will be explained using FIGS. 1 and 2.

0012 A semiconductor substrate 3 to be cleaned is housed in a holding mechanism 4, and a cleaning device with a cover 7 is installed. contained within. A cleaning nozzle 1 prepared in advance and a drying nozzle installed in parallel with the cleaning nozzle 1 The nozzle 2 is installed at an optimal position for cleaning and drying the surface of the semiconductor substrate 3. The holding mechanism 4 is loaded on the drive device 5 and is normally moved in the direction of the arrow (one direction). It has become.

[0013] While moving the semiconductor substrate 3 in the direction of the arrow at a constant speed, the cleaning nozzle Clean the surface by supplying cleaning liquid under pressure from 1, and then install a new one on the rear side. Pressurized gas is sprayed from drying nozzle 2 to blow away dirt and prevent re-adhesion. Dry while drying.

[0014] In the apparatus according to the embodiment of the present invention, cleaning and drying can be performed simultaneously. Therefore, oxidation of the surface after cleaning can be prevented and processing time can be shortened.

[0015] Regarding the method of fixing the semiconductor substrate, moving conditions, cleaning liquid, type of drying gas, etc. It is sufficient to select through preliminary tests and adopt the most suitable one.

[0016] The cleaning process is performed only when moving in the direction of the arrow, and when returning to the original position, use cleaning solution. There is no supply line. However, drying gas may be supplied in both directions. stomach. In addition, when performing continuous cleaning, prepare the required number of holding mechanisms in advance, and It can also be done sequentially using the location.

[0017]

[Effect of the idea]

With this invention, (1) surface deterioration such as oxidation is prevented in order to perform cleaning and drying at the same time. Can be prevented (2) Can prevent stains and damage caused by movement from washing to drying (3) No need for moving equipment from washing to drying (4) Able to work at the same time and Work efficiency is improved as work time can be shortened due to no travel time. This improves product accuracy and contributes to improved economic efficiency.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view of a semiconductor substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of a semiconductor substrate cleaning apparatus according to an embodiment of the present invention.

[Explanation of symbols]

1 Cleaning nozzle 2 Drying nozzle 3 Semiconductor substrate 4 Holding mechanism 5 Drive device for holding mechanism 6 Shatter 7 Cover

Claims (1)

[Scope of utility model registration request] 1. A semiconductor substrate cleaning device comprising a cleaning nozzle for supplying a cleaning liquid onto the surface of an object to be cleaned, a holding mechanism for the object to be cleaned, and a drive device for driving the same, wherein a rear portion of the cleaning nozzle is provided. A semiconductor substrate cleaning device characterized by having drying nozzles arranged in parallel on the side.