JPH0493046A - Wafer transfer apparatus - Google Patents

Wafer transfer apparatus

Info

Publication number
JPH0493046A
JPH0493046A JP20990290A JP20990290A JPH0493046A JP H0493046 A JPH0493046 A JP H0493046A JP 20990290 A JP20990290 A JP 20990290A JP 20990290 A JP20990290 A JP 20990290A JP H0493046 A JPH0493046 A JP H0493046A
Authority
JP
Japan
Prior art keywords
hand
clamp
wafer transfer
wafer
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20990290A
Other languages
Japanese (ja)
Inventor
Kazuki Shimizu
和貴 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20990290A priority Critical patent/JPH0493046A/en
Publication of JPH0493046A publication Critical patent/JPH0493046A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To clean a hand automatically without the help of an operator by providing the following: a wafer transfer machine which grips the hand by using a clamp; and a hand conveyance machine which conveys the clamp to a cleaning tank and to a nozzle for drying use and which cleans and dries the hand. CONSTITUTION:A hand 4 is advanced and is inserted into two rings. At the same time, the locking mechanism of a clamp A9 is detached and the hand is gripped by a clamp B10. After that, the clamp A9 of a wafer transfer machine is returned, and the hand 4 is detached. The hand 4 which is gripped by the clamp B10 of a hand conveyance machine 8 is transported to a cleaning tank 6 along a guide groove and is cleaned. After finishing this cleaning operation, the hand 4 is stopped between two nozzles 7 for drying use and is dried by N2 gas which is spouted from the nozzles 7 for drying use. After this drying operation, the hand 4 is gripped by the clamp A9 of the wafer transfer machine; the clamp A9 is retreated; the hand is detached from the clamp B10. Thereby, the hand 4 which is cleaned is attached to the wafer transfer machine and is on standby for a next transfer operation.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造に用いられるウェハー移載装
置に関し、特にウェハーを支持するハンドの洗浄及び乾
燥機構を有するウェハー移載装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer transfer device used in the manufacture of semiconductor devices, and more particularly to a wafer transfer device having a cleaning and drying mechanism for a hand that supports a wafer.

〔従来の技術〕[Conventional technology]

近年、縦型炉を装備した拡散装置やCVD装置の自動化
が進み、ウェハー移載機は、これらのほとんどの装置に
搭載されるようになった。例えば第6図の斜視図に示す
ように、従来の一般的なウェハー移載機による移載方法
として、キャリア1に収納されたウェハー3をハンド駆
動部5の石英等の舌状のハンド4にて支持し、x、y、
z、θ方向の移動によりボート2に移し替える。熱処理
または成膜後、ボート2Fのウェハー3をキャリア1に
戻し移載終了となる。
In recent years, automation of diffusion devices and CVD devices equipped with vertical furnaces has progressed, and wafer transfer devices have come to be installed in most of these devices. For example, as shown in the perspective view of FIG. 6, as a transfer method using a conventional general wafer transfer machine, a wafer 3 stored in a carrier 1 is transferred to a tongue-shaped hand 4 made of quartz or the like of a hand drive unit 5. support, x, y,
Transfer to boat 2 by moving in the z and θ directions. After the heat treatment or film formation, the wafer 3 on the boat 2F is returned to the carrier 1 to complete the transfer.

この際、ウェハー移載時のパーティクル対策として、ウ
ェハー移載機上に)−(EPAフィルタを設置し、ウェ
ハー表面へのごみ付着を防止するものがある9しかしな
がらハンド4は、ウェハー3の裏面と接触してウェハー
3を支持するため、ハンド4上にごみがあるとウェハー
3の裏面に付着し汚染につながる。従って、ハンド4を
定期的に洗浄しごみ付着を防止するために、作業者が直
接ハンド4を拭くか、もしくはハンド4を取り外した後
、洗浄機で洗う必要があっt〕。
At this time, as a measure against particles during wafer transfer, an EPA filter is installed on the wafer transfer machine to prevent dust from adhering to the wafer surface. Since the wafer 3 is supported by contact, if there is dust on the hand 4, it will adhere to the back side of the wafer 3 and cause contamination. It is necessary to wipe the hand 4 directly or wash it in a washing machine after removing the hand 4.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のウェハー移載機は、ハントを清掃するた
めに作業者が直接ハンドを拭くか、もしくはハンドを取
り外した後、洗浄機で洗わなければならないという欠点
があった。この場合、必然的にハンド清掃中はウェハー
処理装置を停止しなければならず、装置稼働率の低下に
もつながっていた。本発明の目的は、作業者の手を煩わ
せず自動的にハンドを清掃することができるウェハー移
載装置を提供することである。
The above-described conventional wafer transfer machine has a disadvantage in that in order to clean the hand, the operator must wipe the hand directly or remove the hand and wash it in a washing machine. In this case, the wafer processing apparatus necessarily had to be stopped while the hand was being cleaned, which also led to a decrease in the operating rate of the apparatus. An object of the present invention is to provide a wafer transfer device that can automatically clean a hand without bothering the operator.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のウェハー移載装置は、キャリアに収納したウェ
ハーを縦型炉のボートへ移載するためのハンドをクラン
プで把持したウェハー移載機と、移載後前記クランプか
らハンド搬送機のクランプへハンドを移し替え、移し替
えたハンドを把持したクランプを洗浄槽及び乾燥用ノズ
ルへと搬送してハンドの洗浄及び乾燥を行なうための前
記ハンド搬送機とを有する。
The wafer transfer device of the present invention includes a wafer transfer device in which a hand is gripped by a clamp for transferring wafers stored in a carrier to a boat of a vertical furnace, and a wafer transfer device that transfers wafers stored in a carrier to a boat of a vertical furnace; The hand conveying machine is used to transfer the hand and to transfer the clamp holding the transferred hand to a cleaning tank and a drying nozzle to wash and dry the hand.

〔実施例〕 次に本発明について図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の斜視図であり、第2図、第
3図、第4図はその動作を表わす正面図である。本実施
例は、第1図のように、キャリア1とボート2とウェハ
ー3を支持するハンド4とハンド4を駆動させるハンド
駆動部5とからなるウェハー移載機と、ハンド4を洗浄
及び乾燥するための洗浄槽6とN2ガス等の乾燥用ノズ
ル7を有するハンド搬送機8とにより構成されている。
FIG. 1 is a perspective view of one embodiment of the present invention, and FIGS. 2, 3, and 4 are front views showing its operation. As shown in FIG. 1, this embodiment includes a wafer transfer machine comprising a carrier 1, a boat 2, a hand 4 that supports the wafer 3, and a hand drive section 5 that drives the hand 4, and the hand 4 is cleaned and dried. It is composed of a cleaning tank 6 for drying and a hand conveyor 8 having a drying nozzle 7 for drying N2 gas or the like.

通常、キャリア1とボート2との間で行っているウェハ
ーの移載は、ウェハー3への熱処理及び成膜中は行われ
ないため、その間ウェハー移載機は未使用であるから、
その時ハンド4の洗浄を行う。以下に本実施例の機能に
ついて説明する。ハンド4の端部はクランプ八9に挿入
されており、スプリングと爪などを用いたロック機構に
よりクランプされている。ハンド4はハンド搬送機8の
方向に回転され、更に前進して第2図のようにハンド搬
送tM8のクランプBIOに設けられた2個のリングに
挿入されると同時にクランプA9のロック機構が外れ、
クランプB10に把持される。
Normally, wafer transfer between carrier 1 and boat 2 is not performed during heat treatment and film formation on wafer 3, and the wafer transfer machine is not used during that time.
At that time, the hand 4 is cleaned. The functions of this embodiment will be explained below. The end of the hand 4 is inserted into a clamp 89, and is clamped by a locking mechanism using a spring, a claw, or the like. The hand 4 is rotated in the direction of the hand conveyor 8, moves further forward, and is inserted into the two rings provided in the clamp BIO of the hand conveyor tM8 as shown in FIG. 2, and at the same time the locking mechanism of the clamp A9 is released. ,
It is held by the clamp B10.

このクランプBIOのリングは、ばね作用によりハンド
4を締めつけて把持するようになっている。このように
、クランプA9、クランプB]−〇ともハンド4に対し
て着脱可能となっている。
The ring of this clamp BIO tightens and grips the hand 4 by a spring action. In this way, both the clamp A9 and the clamp B]-0 can be attached to and detached from the hand 4.

その後ウェハー移載機のクランプA9が戻り、ハンド4
を離脱させる。その後第3図のように、ハンド搬送機8
のクランプBIOに把持されたハンド4は、ガイド溝に
沿って洗浄槽6に運ばれ洗浄される。洗浄方法としては
、ノズルによる純水洗浄が効果的である。洗浄終了後、
第4図のように、ハンド4は2本の乾燥用ノズル7の間
に停止し、乾燥用ノズル7より吐出するN2ガスにて乾
燥させる。乾燥後はハンド4をウェハー移載機に戻すた
めに、洗浄に至る動作の逆の動作でウェハー移載機のク
ランプA9に把持させ、クランプ八9を後退させてクラ
ンプB1−0より離脱させる。
After that, clamp A9 of the wafer transfer machine returns, and hand 4
to leave. After that, as shown in Fig. 3, the hand conveyor 8
The hand 4 held by the clamp BIO is carried along the guide groove to the cleaning tank 6 and cleaned. As a cleaning method, pure water cleaning using a nozzle is effective. After cleaning,
As shown in FIG. 4, the hand 4 is stopped between two drying nozzles 7, and is dried with N2 gas discharged from the drying nozzles 7. After drying, in order to return the hand 4 to the wafer transfer machine, it is gripped by the clamp A9 of the wafer transfer machine in the reverse operation of the cleaning operation, and the clamp 89 is moved back and removed from the clamp B1-0.

これて洗浄されたハンド4がウェハー移載機に取り付け
られたことになり、次の移載に備えて待機する。この構
成により作業者の手を煩わせず、自動的にハンド4を洗
浄することのできるウェハー移載装置を提供できる。
The cleaned hand 4 is now attached to the wafer transfer machine and stands by for the next transfer. With this configuration, it is possible to provide a wafer transfer device that can automatically clean the hand 4 without bothering the operator.

第5図は本発明の他の実施例を表わす正面図である。本
実施例はクランプBIOの下方にもリングを取り付け、
」1下両面でハンド4を把持できるようにしたもので、
その他の構造は前記実施例と同様である。本実施例によ
れば、クランプB]−〇に同時に二つのハンド4を把持
できるため、一つのハンド4でウェハー3をボート2に
移載中にもう一方のハンド4を洗浄できる。そのため二
つのハンド4を交互に使え、ハンド4一つ当りの洗浄時
間も長くでき、更に清浄なハンド4にてウェハー移載を
行える利点がある。
FIG. 5 is a front view showing another embodiment of the present invention. In this example, a ring is also attached below the clamp BIO,
” 1 The hand 4 can be held on both sides of the bottom,
The rest of the structure is the same as that of the previous embodiment. According to this embodiment, since two hands 4 can be gripped by the clamp B]-0 at the same time, one hand 4 can clean the other hand 4 while the wafer 3 is being transferred to the boat 2. Therefore, the two hands 4 can be used alternately, the cleaning time per hand 4 can be lengthened, and there is an advantage that wafers can be transferred using a clean hand 4.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、ウェハーを把持す
るハンドとハンドを駆動させるハンド駆動部とからなる
ウェハー移載機と、洗浄槽と乾燥用ノズルとを有するハ
ンド搬送機とを設けることにより、作業者の手を煩わせ
ず、自動的にハンドを清掃することができ、ウェハー裏
面へのごみの付着を防止することができる。
As explained above, according to the present invention, by providing a wafer transfer machine comprising a hand that grips a wafer and a hand drive unit that drives the hand, and a hand transport machine having a cleaning tank and a drying nozzle, The hand can be automatically cleaned without bothering the operator, and it is possible to prevent dust from adhering to the back surface of the wafer.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の斜視図、第2図、第3図、
第4図は本発明の一実施例の動作を示す正面図、第5図
は本発明の他の実施例の正面図、第6図は従来のウェハ
ー移載機を示す斜視図である。 1・・・キャリア、2・・・ボート、3・・−ウェハー
、4・・ハンド、5−・・ハンド駆動部、6・・・洗浄
槽、7−・・乾燥用ノズル、8・・・ハンド搬送機、9
・・・クランプA、1−0・・・クランプB。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2, Fig. 3,
FIG. 4 is a front view showing the operation of one embodiment of the invention, FIG. 5 is a front view of another embodiment of the invention, and FIG. 6 is a perspective view of a conventional wafer transfer machine. DESCRIPTION OF SYMBOLS 1...Carrier, 2...Boat, 3...-Wafer, 4...Hand, 5-...Hand drive unit, 6...Cleaning tank, 7-...Drying nozzle, 8... Hand conveyor, 9
...Clamp A, 1-0...Clamp B.

Claims (1)

【特許請求の範囲】[Claims]  キャリアに収納したウェハーを縦型炉のボートへ移載
するためのハンドをクランプで把持したウェハー移載機
と、移載後前記クランプからハンド搬送機のクランプへ
ハンドを移し替え、移し替えたハンドを把持したクラン
プを洗浄槽及び乾燥用ノズルへと搬送し、ハンドの洗浄
及び乾燥を行なうための前記ハンド搬送機とを有するこ
とを特徴とするウェハー移載装置。
A wafer transfer machine that holds a hand with a clamp to transfer wafers stored in a carrier to a boat of a vertical furnace, and a hand that transfers the hand from the clamp to the clamp of the hand transfer machine after transfer. 1. A wafer transfer device comprising: the hand conveying machine for conveying a clamp holding a wafer to a cleaning tank and a drying nozzle, and cleaning and drying the hand.
JP20990290A 1990-08-08 1990-08-08 Wafer transfer apparatus Pending JPH0493046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20990290A JPH0493046A (en) 1990-08-08 1990-08-08 Wafer transfer apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20990290A JPH0493046A (en) 1990-08-08 1990-08-08 Wafer transfer apparatus

Publications (1)

Publication Number Publication Date
JPH0493046A true JPH0493046A (en) 1992-03-25

Family

ID=16580541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20990290A Pending JPH0493046A (en) 1990-08-08 1990-08-08 Wafer transfer apparatus

Country Status (1)

Country Link
JP (1) JPH0493046A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112842194A (en) * 2020-12-28 2021-05-28 永康市茶邦工贸有限公司 Control method of full-automatic cup washing machine
US20220293401A1 (en) * 2021-03-15 2022-09-15 Kioxia Corporation Semiconductor manufacturing apparatus and semiconductor manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112842194A (en) * 2020-12-28 2021-05-28 永康市茶邦工贸有限公司 Control method of full-automatic cup washing machine
US20220293401A1 (en) * 2021-03-15 2022-09-15 Kioxia Corporation Semiconductor manufacturing apparatus and semiconductor manufacturing method

Similar Documents

Publication Publication Date Title
TWI669160B (en) Substrate processing apparatus
US6547638B2 (en) Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
JP3841491B2 (en) Polishing device
GB2334145A (en) Methods and apparatus for cleaning,rinsing and drying wafers
JPS63108742A (en) Belt conveying mechanism
CN111009482B (en) Wafer cleaning device and wafer cleaning equipment
JPH1131674A (en) Wafer-cleaning apparatus
JPH0493046A (en) Wafer transfer apparatus
JPS6028385B2 (en) washing drying equipment
JP2543007B2 (en) Wafer single wafer cleaning device
CN215354976U (en) Wafer scrubbing machine
CN108273774A (en) Cleaning device and clean method, wafer processing apparatus and processing method
JPH1126419A (en) Wafer-cleaning apparatus and wafer polishing system
JPS63137448A (en) Semiconductor wafer treatment apparatus
JPH09306974A (en) Work holder
JPH01184831A (en) Cleaning process
JP3493676B2 (en) Method and apparatus for cleaning semiconductor substrate
JPS5947457B2 (en) How to clean semiconductor wafers
JP2000150441A (en) Roller brush washing device
US10651057B2 (en) Apparatus and method for cleaning a back surface of a substrate
EP3396707A1 (en) Apparatus and method for cleaning a back surface of a substrate
JPH01233734A (en) Method and apparatus for transferring semiconductor wafer, and wafer treatment apparatus using same
JP3537875B2 (en) Substrate cleaning device
JP3818333B2 (en) Substrate cleaning device
JP2003273058A (en) Brush-cleaning method of scrubbing apparatus, and treating system