JPH04122508A - Method for drilling printed board - Google Patents
Method for drilling printed boardInfo
- Publication number
- JPH04122508A JPH04122508A JP24206490A JP24206490A JPH04122508A JP H04122508 A JPH04122508 A JP H04122508A JP 24206490 A JP24206490 A JP 24206490A JP 24206490 A JP24206490 A JP 24206490A JP H04122508 A JPH04122508 A JP H04122508A
- Authority
- JP
- Japan
- Prior art keywords
- drilling
- drill
- holes
- area
- product area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims description 11
- 238000007689 inspection Methods 0.000 claims abstract description 51
- 238000003754 machining Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Drilling And Boring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要］
プリント基板の穴開は加工方法に関し、プリント基板を
穴開けするドＩＪルが、所定の穴開は回数に到達してド
リル寿命に成った時点で、プリント基板の検査領域に穴
開けしてからドリルを交換して製品領域に穴開は加工が
出来るようにしたプリント基板の穴開は加工方法を目的
とし、プリント基板の製品領域の製品領域穴開は加工デ
ータを記憶し、該製品領域穴開は力ロエデータにより数
値制御装置を作動させて前記プリント基板の製品領域に
穴開けする製品領域データ処理装置と、
該プリント基板の検査領域の検査領域穴開は加工データ
を記憶し、該検査領域穴開は加工データにより数値制御
装置を作動させて前記プリント基板の検査領域に穴開け
する検査領域データ処理装置とを備え、
前記製品領域データ処理装置の命令で数値制御装置を作
動させて前記製品領域に所定の回数穴開は加工を行い、
前記数値制御装置で設定され、ドリル寿命に該当する所
定の穴開は回数にドリルの穴開は回数が到達した時点で
、前記検査領域データ処理装置の命令に切り換えて、数
値制御装置を作動させてプリント基板の検査領域に所定
の回数の穴開は加工を行った後、
前記寿命の到達したドリルを、新しいドリルと交換する
ようにしたことで構成する。[Detailed Description of the Invention] [Summary] Drilling a hole in a printed circuit board is a processing method, and when a drill that drills a hole in a printed circuit board reaches a predetermined number of holes and reaches the end of the drill life, Drill holes in the inspection area of the printed circuit board and then change the drill so that the holes can be processed in the product area. a product area data processing device that stores machining data, and operates a numerical control device to drill holes in the product area of the printed circuit board by operating a numerical control device based on force loe data; the opening stores machining data, and the inspection area data processing device operates a numerical control device according to the machining data to make a hole in the inspection area of the printed circuit board, and the product area data processing device The numerical control device is operated according to the command to drill a predetermined number of holes in the product area, and the number of holes to be drilled by the drill is set by the numerical control device and corresponds to the drill life. When the drill reaches the end of its service life, it switches to the instruction of the inspection area data processing device and operates the numerical control device to drill a predetermined number of holes in the inspection area of the printed circuit board, and then uses the drill that has reached the end of its service life. , consists of replacing it with a new drill.
本発明はプリント基板の穴開は加工方法に関する。 The present invention relates to a method for drilling holes in a printed circuit board.
電子部品を実装するプリント基板は、益々高密度に電子
部品を実装することが要求され、そのため、内層導体を
有する多層プリント基板の厚さも厚くなり、また該基板
に穴開けするスルーホールの寸法も小さく、また高密度
に穴開は加工することが要求されている。Printed circuit boards on which electronic components are mounted are required to have electronic components mounted at an increasingly high density, and as a result, the thickness of multilayer printed circuit boards with inner layer conductors has become thicker, and the dimensions of through holes drilled in the boards have also increased. It is required to drill holes small and with high density.
このようなスルーホールを穴開けする際、スルーホール
の直径が小さく、所定回数以上穴開けすると、ドリルが
穴開けする際に熱を有し、その熱に依って基材の樹脂が
溶融軟化してスミアと称する熔融軟化物がスルーホール
内に形成される恐れがある。When drilling such a through hole, if the diameter of the through hole is small and the hole is drilled more than a certain number of times, the drill generates heat when drilling the hole, and the resin in the base material melts and softens due to the heat. There is a risk that melt-softened material called smear may be formed in the through-hole.
このスミアが内層銅箔部に形成されると、電解メツキ法
等でスルーホール導体を形成した場合、スミアが形成さ
れた内層導体が接続不良となり、プリント基板が製品不
良となる問題がある。If this smear is formed on the inner layer copper foil portion, when a through-hole conductor is formed by electrolytic plating or the like, there is a problem that the inner layer conductor on which the smear is formed will have a connection failure, and the printed circuit board will be defective.
そこでプリント基板を製造する場合、第５図に示すよう
に、プリント基板のスルーホール１や回路パターン２を
形成して製品となる製品領域３の周囲の捨て板の部分に
クーポンと称する検査領域４を設け、この検査領域にも
製品領域と同様にスルーホールを穴開けし、スルーホー
ル内の導体層メツキの加工をした後、この検査領域を切
り出し、該検査領域に形成されたスルーホールの断面が
露出するように研磨して、このスルーホールを顕微鏡、
或いは肉眼にて検査し、スルーホール内の非メツキ部分
を検出してスミアの検出を行っていた。Therefore, when manufacturing a printed circuit board, as shown in FIG. 5, an inspection area 4 called a coupon is placed on a part of the waste board around a product area 3 that becomes a product by forming through holes 1 and circuit patterns 2 of the printed circuit board. After drilling a through hole in this inspection area in the same way as in the product area and processing the conductor layer plating inside the through hole, cut out this inspection area and measure the cross section of the through hole formed in the inspection area. Polish this through hole to expose the
Alternatively, smears have been detected by visually inspecting the unplated portions within the through holes.
そしてこの検査で検査領域４内にスミアが発生していな
い場合には、製品領域３内の穴開けされたスルーホール
内にもスミアは発生していないとの製品領域の保証検査
を行っている。If no smear has occurred in the inspection area 4 in this inspection, a guarantee inspection of the product area is performed to ensure that no smear has occurred in the through holes drilled in the product area 3. .
従来、このようなプリント基板に穴開は加工する場合、
第３図および第４図に示すように、製品領域の穴開は回
数データ、穴開は位置データを設定した製品領域穴開は
加工データ５と検査領域の穴開は回数、穴開は位置を設
定した検査領域穴開は加工データ６を記憶した製品デー
タ領域処理装置７によって数値制御装置８を作動してプ
リント基板の製品領域にスルーホールを穴開けした後、
次いで検査領域に数値制御装置８によってスルーホール
を穴開けする。Conventionally, when drilling holes in such printed circuit boards,
As shown in Figures 3 and 4, the number of times data is set for drilling in the product area, and the position data is set for drilling in the product area. After drilling a through hole in the product area of the printed circuit board by operating the numerical control device 8 by the product data area processing device 7 storing the machining data 6,
Next, a through hole is drilled in the inspection area by the numerical control device 8.
そして所定の回数ドリルで穴開けした後、数値制御装置
８で、ドリルの寿命として設定されたカウンタの数字で
所定の穴開は回数に到達した時点で、ドリルを新しい製
品と交換するようにしている。After drilling a predetermined number of holes with the drill, the numerical control device 8 controls the drill to replace the drill with a new product when the predetermined number of holes has been drilled according to the number on the counter set as the lifespan of the drill. There is.
然し、このような従来の方法であると、交換した新しい
ドリルで検査領域のスルーホールを穴開けし、古い寿命
が到達したドリルで製品領域の六開けをする場合があり
、検査領域に穴開けされたスルーホールで製品領域の穴
開は状態を保証することは出来ない問題がある。However, with this conventional method, a new drill is used to drill a through hole in the inspection area, and an old drill that has reached the end of its service life may be used to drill through holes in the product area. There is a problem in that the condition cannot be guaranteed when drilling holes in the product area with through-holes.
本発明は上記した問題点を解決し、検査領域は必ずドリ
ルの寿命に到達したドリルで穴開けするようにし、検査
領域のスルーホールの穴開は状態を検査することで製品
領域のスルーホールの穴開は状態が保証できるようにし
たプリントｌ板の穴開は加工方法の捉供を目的とする。The present invention solves the above-mentioned problems.The inspection area is always drilled with a drill that has reached the end of its lifespan, and the through-holes in the product area are drilled by inspecting the condition of the through-holes in the inspection area. The purpose of drilling holes in printed L boards is to ensure the condition of the holes, and to help determine the processing method.
（課題を解決するための手段］
上記した目的を達成する本発明のプリント基板の穴開は
加工方法は、プリント基板の製品領域の製品領域穴開は
加工データを記憶し、該製品領域穴開は加工データによ
り数値制御装置を作動させて前記プリント基板の製品領
域に穴開けする製品領域データ処理装置と、
該プリント基板の検査領域の検査領域穴開は加工データ
を記憶し、該検査領域穴開は加工データにより数値制御
装置を作動させて前記プリント基板の検査領域に穴開け
する検査領域データ処理装置とを備え、
前記製品領域データ処理装置の命令で数値制御装置を作
動させて前記製品領域に所定の回数穴開は加工を行い、
前記数値制御装置で設定され、ドリル寿命に該当する所
定の穴開は回数にドリルの穴開は回数が到達した時点で
、前記検査領域データ処理装置の命令に切り換えて、数
値制御装置を作動させてプリント基板の検査領域に所定
の回数の穴開は加工を行った後、
前記寿命の到達したドリルを、新しいドリルと交換する
ようにする。(Means for Solving the Problems) A method for drilling holes in a printed circuit board according to the present invention that achieves the above-mentioned object stores processing data for drilling holes in a product region of a printed circuit board, and a product area data processing device that operates a numerical control device according to machining data to make a hole in the product area of the printed circuit board; The opening includes an inspection area data processing device that operates a numerical control device according to machining data to make a hole in the inspection area of the printed circuit board, and operates the numerical control device in response to a command from the product area data processing device to drill a hole in the inspection area of the printed circuit board. Drilling is performed a predetermined number of times, and when the predetermined number of drillings set by the numerical control device and corresponding to the drill life has been reached, the inspection area data processing device After switching to the command and operating the numerical control device to drill a predetermined number of holes in the inspection area of the printed circuit board, the drill that has reached the end of its service life is replaced with a new drill.
本発明の方法は第１図、第２図および前記した第５図に
示すように、プリント基板の製品領域３の穴開は位置、
穴開は回数より成る製品領域穴開は加工データ５を記憶
した製品領域データ処理装置７に対し、別個に検査領域
４の穴開は位置、穴開は回数よりなる検査領域穴開は加
工データ６を記録した検査領域データ処理装置１１を設
ける。As shown in FIG. 1, FIG. 2, and FIG.
For the product area data processing device 7 that stores the drilling data 5, the drilling data of the inspection area 4 is separately determined by the inspection area 4, where the drilling is determined by the position and the drilling is determined by the number of times. An inspection area data processing device 11 is provided which records data No. 6.
そして製品領域データ処理装置７によって数値制御装置
８を作動させて製品領域に所定回数穴開けを行った後、
数値制御装置８に記憶されているドリル寿命に該当する
穴開は回数に到達した時点で、検査領域データ処理装置
ＩＮこよって数値制御装置を作動させて検査領域４に所
定の回数穴開けを行った後、ドリルを新しい製品と交換
する。After the product area data processing device 7 operates the numerical control device 8 to punch holes in the product area a predetermined number of times,
When the number of holes corresponding to the drill life stored in the numerical control device 8 reaches the number of holes, the inspection area data processing device IN operates the numerical control device to drill holes in the inspection area 4 a predetermined number of times. After that, replace the drill with a new one.
このようにすると、検査領域４はドリルの寿命の到達し
たドリルに依って穴開は加工されるため、検査領域の穴
開は状態を検査して、その穴開は加工状態がスミアの発
生しない良好な状態であると製品領域のスルーホールも
スミアの発生しない良好な穴開は加工された状態である
ことが保証される。In this way, since holes are drilled in the inspection area 4 by the drill that has reached the end of its lifespan, the condition of the holes drilled in the inspection area is inspected, and the drilling conditions are such that smear does not occur. If the condition is good, it is guaranteed that the through-holes in the product area are well-drilled without smearing.
以下、図面を用いて本発明の一実施例につき詳細に説明
する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図は本発明の詳細な説明図、第２図は本発明の方法
の手順を示すフローチャート図である。FIG. 1 is a detailed explanatory diagram of the present invention, and FIG. 2 is a flow chart diagram showing the procedure of the method of the present invention.
第１図、および第２図に図示するように、本発明の方法
は製品領域データ処理装置７とは別個に検査領域の穴開
は回数、穴開は位置を記憶した検査領域データ処理装置
１１を設ける。As shown in FIGS. 1 and 2, the method of the present invention uses an inspection area data processing device 11 that stores the number of holes to be drilled in the inspection area and the position of each hole, separately from the product area data processing device 7. will be established.
そして製品領域データ処理装置７には、製品領域のスル
ーホールの穴開は回数、穴開は位置を記憶しておく。こ
れらの検査領域データ処理装置１１、および製品領域デ
ータ処理装置７は何れもパーソナルコンピュータを用い
ると良い。The product area data processing device 7 stores the number of times and the position of the through holes in the product area. It is preferable that both the inspection area data processing device 11 and the product area data processing device 7 use personal computers.
そして製品領域データ処理装置７の命令に基づき、数値
制御装置８を作動させて製品領域に所定の回数穴開は加
工する。そしてドリルの寿命に該当する所定の回数だけ
製品領域に穴開けすると数値制御装置８よりドリル交換
の警報が出され、この時点で検査領域データ処理装置１
１からの命令に切り換えて数値制御装置８を作動し、検
査領域の所定位置に所定の回数だけ穴開は加工する。Based on the commands from the product area data processing device 7, the numerical control device 8 is operated to drill holes in the product area a predetermined number of times. When holes are drilled in the product area a predetermined number of times corresponding to the lifespan of the drill, a warning to replace the drill is issued from the numerical control device 8, and at this point, the inspection area data processing device 1
The numerical control device 8 is operated by switching to the command from 1, and holes are drilled at a predetermined position in the inspection area a predetermined number of times.
そして検査領域の穴開は加工を終了した時点でドリルを
新しい製品と交換する。When drilling holes in the inspection area is completed, the drill is replaced with a new one.
その後、製品領域と検査領域のスルーホールの穴開は加
工を終了したプリント基板を無電解、および電解メツキ
してスルーホール内にスルーホール導体層を形成する。Thereafter, through-holes in the product area and inspection area are formed by electroless plating and electrolytic plating of the processed printed circuit board to form a through-hole conductor layer in the through-holes.
次いでこのプリント基板より検査領域を切り出し、この
検査領域を研磨してスルーホールの断面を検査する。そ
してこの検査領域にスミアが発生していない場合には、
製品領域にもスミアが発生していないと保証されるので
、高信顛度の穴開は加工ができる。Next, an inspection area is cut out from this printed circuit board, this inspection area is polished, and the cross section of the through hole is inspected. If no smear occurs in this inspection area,
It is ensured that the product area is also smear-free, so drilling with high reliability can be performed.
以上述べたように本発明の方法によれば、ドリルの寿命
が到達した、新しい製品と交換する以前のドリルにて検
査領域の穴開は加工が実施されているので、検査領域の
スルーホールの穴開は状態を検査することで製品領域の
穴開は加工状態が保証され、高信頬度の穴開は加工がで
きる。As described above, according to the method of the present invention, holes in the inspection area are drilled using a drill that has reached the end of its service life and before being replaced with a new product. By inspecting the condition of the holes, the processing condition of the holes in the product area is guaranteed, and the holes with high reliability can be processed.
以上の説明から明らかなように本発明によれば、製品領
域にスミア等の発生しない高信顛度の穴開は加工方法が
でき、プリント基板の製品歩留まりが大幅に向上する効
果がある。As is clear from the above description, according to the present invention, it is possible to form holes with high reliability without causing smear or the like in the product area, which has the effect of greatly improving the product yield of printed circuit boards.
第１図は本発明の詳細な説明図、
第２１は本発明の方法の手順を示すフローチャート図、
第３図は従来の方法の説明図、
第４図は従来の方法の手順を示すフローチャート図、
第５図はプリント基板の模式的平面図である。
図において、
５は製品領域穴開は加工データ、６は検査領域穴開は加
工データ、７は製品領域データ処理装置、８は数値制御
装置、１１は検査領域データ処理装置を示す。Fig. 1 is a detailed explanatory diagram of the present invention, Fig. 21 is a flowchart diagram showing the procedure of the method of the present invention, Fig. 3 is an explanatory diagram of the conventional method, and Fig. 4 is a flowchart diagram showing the procedure of the conventional method. , FIG. 5 is a schematic plan view of the printed circuit board. In the figure, 5 indicates processing data for drilling holes in the product area, 6 indicates processing data for drilling holes in the inspection area, 7 indicates a product area data processing device, 8 indicates a numerical control device, and 11 indicates an inspection area data processing device.
Claims (1)
データ（５）を記憶し、該製品領域穴開け加工データ（
５）により数値制御装置（８）を作動させて前記プリン
ト基板の製品領域（３）に穴開けする製品領域データ処
理装置（７）と、 該プリント基板の検査領域（４）の検査領域穴開け加工
データ（６）を記憶し、該検査領域穴開け加工データ（
６）により数値制御装置（８）を作動させて前記プリン
ト基板の検査領域（３）に穴開けする検査領域データ処
理装置（１１）とを備え、前記製品領域データ処理装置
（７）の命令で数値制御装置（８）を作動させて前記製
品領域に所定の回数穴開け加工を行い、 前記数値制御装置（８）で設定され、ドリル寿命に該当
する所定の穴開け回数にドリルの穴開け回数が到達した
時点で、前記検査領域データ処理装置（１１）の命令に
切り換えて、数値制御装置（８）を作動させてプリント
基板の検査領域（４）に所定の回数の穴開け加工を行っ
た後、 前記寿命の到達したドリルを、新しいドリルと交換する
ようにしたことを特徴とするプリント基板の穴開け加工
方法。[Claims] Product area drilling processing data (5) of the product area (3) of the printed circuit board is stored, and the product area drilling processing data (
a product area data processing device (7) that operates a numerical control device (8) to make a hole in the product area (3) of the printed circuit board according to 5); and an inspection area drilling device in the inspection area (4) of the printed circuit board. The machining data (6) is stored, and the inspection area drilling machining data (
and an inspection area data processing device (11) that operates a numerical control device (8) to make a hole in the inspection area (3) of the printed circuit board according to the instruction of the product area data processing device (7). Operate the numerical control device (8) to drill holes in the product area a predetermined number of times, and increase the number of holes to be drilled by the drill to the predetermined number of holes set by the numerical control device (8) and corresponding to the drill life. At the time when the inspection area data processing device (11) reached the instruction, the numerical control device (8) was activated to perform drilling a predetermined number of times in the inspection area (4) of the printed circuit board. A method for drilling holes in a printed circuit board, characterized in that: the drill that has reached the end of its service life is replaced with a new drill.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24206490A JPH04122508A (en) | 1990-09-11 | 1990-09-11 | Method for drilling printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24206490A JPH04122508A (en) | 1990-09-11 | 1990-09-11 | Method for drilling printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04122508A true JPH04122508A (en) | 1992-04-23 |
Family
ID=17083745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24206490A Pending JPH04122508A (en) | 1990-09-11 | 1990-09-11 | Method for drilling printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04122508A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107635362A (en) * | 2017-09-21 | 2018-01-26 | 无锡深南电路有限公司 | A kind of method for improving the more interlayer alignment abilities of PCB |
-
1990
- 1990-09-11 JP JP24206490A patent/JPH04122508A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107635362A (en) * | 2017-09-21 | 2018-01-26 | 无锡深南电路有限公司 | A kind of method for improving the more interlayer alignment abilities of PCB |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20150099443A (en) | Backdrilling method, and backdrilling apparatus | |
| CN107484356A (en) | A kind of preparation method of the sandwich aluminium base of thick copper | |
| CN106961806B (en) | The production method for burying copper billet is substituted in a kind of wiring board | |
| CN111107712B (en) | Method for reducing through hole Stub by controlling electroplating depth | |
| CN109195313A (en) | A kind of Novel back drilling testing hole production method | |
| CN104582288A (en) | PCB back drilling plate back drilling depth detecting method | |
| CN108770238B (en) | Inner layer graph design method for improving copper pulling in drilling | |
| CN104507257A (en) | Printed circuit board (PCB) molding method | |
| CN108521724A (en) | A kind of production method of high flexure high density flexible printed wiring board | |
| CN107770974A (en) | A kind of design of level to level alignment degree detection module | |
| CN108551731A (en) | Production method of the aperture without the exposed non-metallic hole of base material on a kind of wiring board | |
| CN110893629B (en) | Method for manufacturing circuit board and drilling machine | |
| CN109982511B (en) | Manufacturing method of PCB (printed Circuit Board) convenient for detecting whether copper-free hole is drilled in missing mode or not | |
| JPH04122508A (en) | Method for drilling printed board | |
| KR100964150B1 (en) | Method for creating through hole in Printed Circuit Board | |
| CN209299584U (en) | A kind of solderability pcb board | |
| JP4117390B2 (en) | Manufacturing method of multilayer printed wiring board with cavity | |
| JPH10135647A (en) | Pattern cutter | |
| JPH0719176Y2 (en) | Circuit board | |
| CN105228349B (en) | A method of improve without golden on copper hole | |
| CN111343779B (en) | Back drilling hole performance detection method | |
| CN114501804B (en) | Back drilling depth control method for 5G precise circuit board | |
| JPS6320645B2 (en) | ||
| CN117545186A (en) | Processing method of non-plated hole of bonding pad | |
| KR20000041057A (en) | Method for detecting badness of printed circuit board |