JPH10135647A - Pattern cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern cutter which can cut at least inner layer patterns of a high density multilayer printed board very precisely and automatically with high reliability. SOLUTION: This cutter is composed of a Y-axis movement table 17 to be mounted with a printed board 1, a spindle motor 14 wherein a Z-axis movement means 18 driven by a servo motor 53 is held by a fixed member 65 which constitutes an Xaxis movement means 16, a drill 11 installed on the spindle motor, a driving controlling section 50 which positions the tip of the drill 11 on the substrate and then drives the drill to let it cut an at least inner layer pattern 4, a conduction detecting section 52 with its one contactor being connected to a lower layer conductor 5 existing just under the inner layer pattern to be cut and the other contact connected to the drill 11, and a numerical control data supplying terminal 23 which stores pattern cutting conditions for performing a series of operations including a transmission of data to the driving controlling section 50, positioning, pattern cutting, and other operations.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern cutting apparatus for a printed circuit board, and more particularly to a pattern cutting apparatus suitable for changing the design of an inner layer pattern of a printed circuit board having a multi-layered wiring pattern via an insulating layer. It is.

[0002]

2. Description of the Related Art The function of pattern cutting accompanying a change in the design of a printed circuit board can be changed by modifying the existing printed circuit board. Therefore, it is indispensable to reduce the number of man-hours for the change. This technology is also necessary for shortening and responding to customers when a problem occurs.

As a conventional method for cutting a printed circuit board, for example, as disclosed in Japanese Patent Application Laid-Open No. Sho 59-175187, when a pattern is cut on a printed circuit board, a short circuit of a circuit is prevented by cutting chips of a copper foil pattern by an end mill. Therefore, a square cutting jig with a hollow center is attached to the outer periphery of the end mill, the square cutting jig is pressed against the pattern, and a part of the pattern is cut in advance with the square cutting jig before the square cutting jig. There has been proposed a method of performing a pattern cut by rotating an end mill in a cutting jig.

In Japanese Patent Application Laid-Open No. 60-198798, a cylindrical end mill cutter having an inner diameter larger than the outer diameter of a through hole is provided at the tip of a cutter head, and the distance to a printed circuit board is measured by an optical distance measuring mechanism. In addition, a method has been proposed in which the center of the rotation axis of the cutter head is positioned at the center of a through-hole grid on a printed circuit board to perform pattern cutting.

Furthermore, Japanese Patent Application Laid-Open No. Sho 60-150688 proposes a method including a stopper for limiting the length of a portion where the end of an end mill for cutting a pattern cuts into the inside of the pattern to an arbitrary length.

All of these methods prevent the instability of the cut depth due to manual work and shorten the work time, but do not consider the cutting of the inner layer pattern on a multilayer printed circuit board. Further, it is difficult to apply the present invention to a mounting board on which components are mounted.

Further, for example, Japanese Patent Application Laid-Open No. Sho 59-181089 proposes a method in which a pattern is cut by a rotary cutter while detecting the conductive state of a pattern, and the cutting is stopped when a non-conductive state is detected. A probe for detecting conduction is provided on a cutter cover that moves up and down in parallel with the rotary cutter, and the probe comes in contact with a pattern on a printed circuit board by descending together with the cutter cover, and is further pushed into the pattern to conduct. Although it is possible to detect the conduction by contacting the probe with the surface layer pattern, it is difficult to detect the conduction by contacting the probe with the inner layer pattern of the multilayer printed circuit board. In addition, since it is difficult to lower the cutter cover equipped with the probe and the cutter to the narrow part of the mounting board on which the components are mounted, it is applied to the pattern cutting of the inner layer of the multilayer printed circuit board and the pattern cutting of the already mounted board. Can not.

Japanese Patent Application Laid-Open No. 4-269890 discloses a contact having one end contacting a pattern and a cutter having the other end functioning as a contact. A resistance value detection unit for detecting the resistance value of the pattern between the blades, and an automatic setting unit for operating the cutter in accordance with the resistance value detected by the resistance value detection unit. A method has been proposed in which the operation of the cutter is not permitted when the detection unit does not detect the resistance value.

However, since this method has an automatic setting unit for operating the cutter in accordance with the resistance value, it is possible to detect the resistance value of the surface layer pattern on the surface of the printed circuit board and operate the cutter. It is difficult to detect the resistance value of the inner layer pattern on the printed circuit board, and it cannot be applied to pattern cutting of the inner layer.

Therefore, in the method of cutting while measuring the resistance value between the contacts, it is possible to prevent a cut error of the surface layer pattern and confirm the completion of the cut by detecting the conduction of the pattern to be cut or detecting the resistance value. But,
The problem at the time of cutting the inner layer pattern in the multilayer printed circuit board is not considered at all and is difficult to implement.

[0011]

In each of the above-mentioned prior arts, there has been proposed a method for preventing a work error due to a manual operation for a surface layer pattern cut of a printed circuit board and performing the pattern cut reliably. However, as the density of printed circuit boards increases and the number of layers increases, it is important to improve the yield. For this reason, circuit design changes are indispensable. It is necessary to cut with.

The conventional inner layer pattern is cut by carefully using a drill by hand and carefully checking the cut state while visually checking the cut state, or by attaching a drill or end mill to a spindle head by a mechanical device, Attempts have been made to mount the head movably with a positioning motor and cut the specified amount based on the cut depth data from the board surface.However, variations in the layer thickness accuracy of the printed board, the effects of warpage, deflection, and the inner layer pattern Due to the effect of the bending of the printed circuit board due to the cutting force of the drill at the time of cutting, the variation in the cutting depth is large,
Incomplete cutting of the inner layer pattern or damage to the back surface pattern due to excessive cutting may occur.

In positioning the printed circuit board,
There is a method to support the warpage and deflection of the printed circuit board by supporting it from below the printed circuit board with a backup pin, and to prevent the influence of the bending of the printed circuit board due to the cutting force of the drill when cutting the inner layer pattern. In such a mounting board, interference between the backup pin and the component lead or the component itself occurs, and positioning is difficult.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned conventional problems, and more specifically, the effects of variations in thickness accuracy of a multi-layer printed circuit board having high density, warpage, deflection, and the like. By making it possible to feed the drill to the cutting depth required for inner layer pattern cutting without being affected by the bending of the printed circuit board due to the cutting force of the drill, there is no need to forcibly warp or warp the printed circuit board, An object of the present invention is to provide a pattern cutting device which can cut an inner layer pattern even on a mounting board and can reduce the number of remodeling steps accompanying a design change.

[0015]

According to the present invention, there is provided a pattern cutting apparatus capable of automatically cutting at least an inner layer pattern of a multilayer printed circuit board by numerical control. A spindle motor having a drill or an end mill detachably attached thereto, an X-axis moving means having a fixed member supporting a spindle motor and a height detection sensor,
A Y-axis moving table on which a board mounting pallet is placed,
Drive control means for positioning the cutting edge of the drill or end mill at a predetermined position on the printed circuit board according to the pattern cut position information and cutting at least the inner layer pattern, and numerical control data storing at least pattern cut conditions including the pattern cut position information A connection terminal (hereinafter abbreviated as an NC data supply terminal) and one contact connected to a lower conductor present directly below an inner layer pattern to be cut on a printed circuit board, and the other contact connected to a drill or an end mill. The spindle motor is supported by a fixed member via a servomotor so as to be movable in the Z-axis direction, and the mounted drill or end mill is
Based on the pattern cut position information transmitted from the C data supply terminal, the drive control means determines the cut position and starts cutting, cuts a predetermined inner layer pattern, passes through the insulating layer immediately below, and is provided on the back surface. The cutting is stopped based on the conduction signal detected by the conduction detecting means when the tip of the lower layer conductor comes into contact with the lower conductor, and the servo motor is operated to move the drill or the end mill above the substrate. Features.

The Y-axis moving table is desirably provided with an automatic exchange means capable of detachably attaching a drill or an end mill to a spindle motor according to the type of a printed circuit board. Alternatively, the end mill can be automatically selected.

Further, a spindle motor and a height detection sensor are supported on a fixed member constituting the X-axis moving means, and a cutting dust suction nozzle is provided so that cutting chips can be discharged after the cutting of the inner layer pattern is completed. With such a configuration, the problem of the short circuit of the circuit due to the cutting waste is solved, and a highly reliable pattern cutting can be realized.

Further, the positioning of the cut dust suction nozzle can be easily performed by the drive control means as in the case of pattern cutting. At this time, if the nozzle is moved in the Z-axis (vertical direction) by, for example, an air cylinder, and the nozzle is moved closer to the cut position on the surface of the printed circuit board, suction and exhaust can be performed more effectively.

More specifically, for example, when cutting an inner layer pattern, a component lead (in the case of a mounted board) or a through hole of a printed board is inserted into a lower conductor existing directly below the inner layer pattern layer to be cut. A contact (clip) that can be energized through the motor and a spindle motor that can be moved up and down with a drill or end mill having the function of the other contact and that can be energized, and this drill or end mill is a spindle motor Starts from the surface of the printed circuit board positioned by the cut position data, and after passing through the inner layer pattern to be cut (after the cut),
Continuity detecting means for detecting conduction when the tip of the drill or end mill comes into contact with the lower conductor is provided, and after detecting conduction when the tip of the drill or end mill contacts the lower conductor, feeding of the drill or end mill is performed. The inner layer pattern without being affected by the layer thickness accuracy, warpage and deflection of the substrate, and without damaging the pattern on the back surface by providing a drive control means capable of stopping and raising the This makes it possible to easily perform pattern cutting of a mounting board, which is difficult to back up with a jig.

Further, by providing an automatic exchange function of a drill or an end mill, it is possible to cope with not only the cutting of the inner layer pattern but also various kinds of cuts such as the cutting of the surface layer pattern, the cutting of the through hole and the small diameter via hole, and the like. A data supply terminal that is online via a printed circuit board design change system and a host computer, and is configured to transmit cut data of the inner layer pattern cut from this data supply terminal to the drive control means online. By automatically accumulating the cut position data in the data supply terminal and enabling the automatic creation and supply of necessary NC data as needed, it can be applied to the pattern cutting work of multi-product printed circuit boards (including mounting boards). It becomes possible.

[0021]

FIG. 1 is a block diagram showing an embodiment of the present invention.
3 will be described with reference to FIG. FIG. 1 is an external perspective view illustrating an overall outline of a pattern cutting apparatus according to the present invention,
FIG. 2 is an overall operation flow chart for operating this apparatus, and FIG. 3 is a view for explaining the principle of pattern cutting.

The apparatus configuration shown in FIG. 1 uses pattern cutting conditions (surface layer pattern, inner layer pattern, cut depth, hole diameter, etc.).
NC data supply terminal 23 that manages the creation of the pattern and the number of pattern-cut substrates, and can transmit and receive various types of work information to and from the apparatus main body; a substrate mounting pallet 30 for fixing and holding the multilayer printed circuit board 1 is mounted and driven in one direction Y-axis moving table 17; operation panel 33 for instructing operation of the apparatus main body;
A board height detection sensor 19 for detecting the height of the printed circuit board 1 in order to know a pattern cutting work start position; a spindle motor 14 for attaching and detaching and rotating an end mill 12 for performing a pattern cutting work on the printed circuit board 1; A cut dust suction nozzle 22 for removing cut dust generated from the pattern cut position; a drill post A34 for storing and holding the end mill 12 separated from the spindle motor 14 when replacing the end mill 12 of the spindle motor 14 with a different diameter type; The above-mentioned separated end mill 12 is transferred from the post A34 to the drill post B35 accommodating and holding a plurality of drills 11 (not shown) of different diameters or end mills 12, and the drill 11 or the drill 11 selected arbitrarily from the drill post B35. Drill the end mill 12 Z-axis 18 of the spindle motor 14 held by the servo motor (not shown) to move the spindle motor 14 in the vertical direction in accordance with the above-noted pattern cutting conditions; Drill exchange chuck 31 for transferring the preparative A34;
A camera 20 that captures an image of a point when teaching a pattern cutting state and a pattern cutting position of the printed circuit board 1 when the pattern cutting operation is completed; a monitor 21 that monitors an image of the camera 20; a board height detection sensor 19, a camera 20, X-axis moving means 16 that holds the Z-axis 18, the cut suction nozzle 22, and the drill exchange chuck 31, each of which holds the spindle motor 14 by a servo motor (not shown) on a fixed member 65 and drives in the X-axis direction;
6 and the above-mentioned NC data supply terminal 23, and an on-line and off-line, and a touch panel 32 for selecting and setting the apparatus main body 36 in a manual operation mode or the like.

This apparatus receives pattern cut position information from the NC data supply terminal 23, positions the cutting edge of a drill or end mill at a predetermined position on a printed circuit board, and at least drives and cuts an inner layer pattern. Means (including a control system for the X-axis, Y-axis, and Z-axis), one of the contacts is connected to a lower-layer conductor immediately below an inner-layer pattern to be cut on a printed circuit board, and the other contact is a drill or an end mill. Are provided, but they are not shown in this figure (described in FIG. 3).

The Y-axis moving table is provided with automatic exchange means capable of detachably mounting a drill or an end mill on a spindle motor according to the type of a printed circuit board. That is, the drill exchange chuck 3 shown in FIG.
1 is a drill post B for removing the drill 11 or the end mill 12 separated from the spindle motor 14 for replacement.
35 to the drill post A34 or vice versa.
When the end mill 12 is separated from the spindle motor 14, the end mill 12 separated from the spindle motor 14 is stored and held when exchanging the end mill 12 with the spindle motor 14. It is. This makes it possible to automatically select a drill or an end mill according to various kinds of cuts.

FIG. 2 shows an example of an operation flowchart of the pattern cutting apparatus having the configuration of FIG. The operation of the pattern cutting apparatus will be described below in the order of the steps shown in FIG.

First, the power switch of the operation panel 33 shown in FIG. 1 is turned on to turn on the apparatus body 36 and the NC data supply terminal 23 (see S1 in FIG. 2).
Next, on the touch panel 32, online, offline,
A mode for manual operation is selected (see S2 in FIG. 2).

Using the operation panel 33, origin return is performed to adjust each device to the operation origin position (see S3 in FIG. 2). The multilayer printed board 1 for pattern cutting is set on the board mounting pallet 30 (see S4 in FIG. 2), and
A continuity detecting clip 1 for applying a voltage to a conductor layer immediately below an inner layer pattern to be cut on a printed circuit board 1
3 (not shown, specifically described in FIG. 4) is attached to the printed circuit board 1.

Thereafter, an operation start (see S5 in FIG. 2) of the apparatus main body 36 is instructed by using the operation panel 33. The board height of the printed circuit board 1 is measured by the board height detection sensor 19 (see S6 in FIG. 2), and the cutting conditions such as the surface layer / inner layer / cut depth are determined from the data transferred by the NC data supply terminal 23. After the selection (see S7 in FIG. 2), a cut start (see S8 in FIG. 2) is commanded on the operation panel 33.

The cutting operation is performed up to the cut condition selection instruction value, the cut is completed (see S9 in FIG. 2), and when the cut condition selection instruction value and various conditions match, the substrate is discharged (S10 in FIG. 2).
See). If they do not match, review the cutting conditions or repeat the cutting operation until they match.

After discharging, monitor the cut state at a predetermined position.
1 (see S11 in FIG. 2) and recut (S11 in FIG. 2).
12), the work is repeated from the start of cutting (see S8 in FIG. 2). If re-cutting (see S12 in FIG. 2) is not possible, the printed board 1 is moved to the board setting position (see S13 in FIG. 2), and the number of cuts is compared with the set value (the number of cuts = set value (see FIG. 2). 2) (S14)), if they match, the operation is terminated (see S15 in FIG. 2). If they do not match, the process is repeated from the substrate set (see S4 in FIG. 2) until they match.

FIG. 3 is a schematic diagram of a main part of the apparatus for specifically explaining an example of an apparatus configuration when the inner layer pattern 4 of the multilayer printed circuit board 1 is cut using the pattern cutting apparatus of FIG. 1 and an operation method thereof. It is a thing. Thereby, the cut of the inner layer pattern 4 is completed without being affected by the layer thickness accuracy such as the warpage and bending of the printed board 1 and the mounting board 2 and the thickness of the core 8 and without damaging the back surface pattern 57. Can be.

First, a printed board 1 serving as a sample for pattern cutting has a ground layer (hereinafter abbreviated as G layer) 5 as a center layer, a prepreg 9 thereon, an inner layer 56 having an inner layer pattern 4 formed thereon, a core 8, A surface layer 55 on which the surface layer pattern 3 is formed is sequentially stacked, and a lower surface pattern 57 having a similar structure is formed in a lower portion on the opposite side symmetrically with the upper portion.

The main configuration of the pattern cutting device is as follows.
A servo motor control unit 50 for controlling the servo motor 53, a servo motor 53 connected to the servo motor 53, and the spindle motor 14 attached to the servo motor 53 via a ball screw 54 so that the spindle motor 14 is perpendicular to the printed circuit board surface ( Z to move up and down)
Shaft moving means and spindle motor rotation speed control unit 51
And a continuity detecting unit 52, and the-side terminal (contact) of the continuity detecting unit 52 is
, And the + terminal is connected to the G layer 5 of the printed circuit board 1. The + side terminal (contact) connected to the lower conductor (here, the G layer 5) immediately below the inner layer pattern to be cut on the substrate is, for example, a clip 13 as shown in FIG. It consists of.

The + side terminal of the conduction detecting section 52 is connected to the G layer 5 in the printed circuit board 1 and is connected to the servo motor control section 50 and the spindle motor rotation speed control section 51 for feedback. Connected. Further, a drill 11 that enables automatic replacement is mounted at the tip of the spindle motor 14.

An operation procedure for cutting the inner layer pattern 4 will be described. First, the printed circuit board 1 is positioned by NC data (position information stored in the NC data terminal 23 in FIG. 1), and the servo motor control unit 50 controls the servo motor. 53 is driven to perform feed control via a ball screw 54 in the direction of the Z axis 18 which is a direction perpendicular to the substrate surface.

The number of revolutions of the spindle motor 14 is controlled by the spindle motor revolution number control unit 51, and cutting is started on the printed circuit board 1 by using a drill 11 at its tip which is automatically changed according to the type of cutting of the printed circuit board 1. I do. Further, when the cutting of the inner layer pattern 4 to be cut is completed and the G layer 5 and the drill 11 come into contact with each other, the conduction detection unit 52 detects conduction and transmits an output signal to the servo motor control unit 50. The servo motor control unit 50 that has received this output signal stops the feed of the drill 11 and raises the drill 11.

[0037]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described more specifically below with reference to the embodiments shown in FIGS. <Embodiment 1> FIGS. 4A to 4D are schematic views of an essential part schematically showing an embodiment in which an inner layer pattern is cut by using the pattern cutting apparatus shown in FIG. 1. FIG. The operation at the time of cutting the inner layer pattern will be described below with reference to FIGS. 4A to 4D and FIG.

The printed circuit board 1 set on the board mounting pallet 30 (see FIG. 1) or the mounting board 2 on which the electronic components 60 and the like are mounted on the printed circuit board 1 are cut by the NC data as described with reference to FIG. After being moved to the position to be performed and positioned, the drill 11 starts rotating at a certain number of rotations set by the spindle motor 14 and the spindle motor rotation number controller 51 (FIGS. 4A and 5).
S20).

After the rotation speed of the drill 11 reaches the set rotation speed, the drill 11 is lowered at a certain set feed speed by the servo motor 53 and servo motor control unit 50 for vertical movement of the drill (FIGS. 4B and 5). S21).

With the lowering of the drill 11, the inner layer pattern 4 of the printed board 1 or the mounting board 2 is cut.
Further, the drill 11 continues descending even after the inner layer pattern is cut.
The descent is continued until the tip of the drill 11 contacts the layer (ground layer) 5. The drill 11 comes into contact with the G layer 5, and a current flows between the drill 11 and the G layer 5 by the conduction detecting clip 13 previously attached to the lead portion or the like of the mounted component 60, and the conduction state is detected. The rotation of the drill vertical servomotor 53 detected by the part 52 is stopped and the drill 11 is stopped.
Is stopped (S22, 23, 2 in FIGS. 4C and 5).
4).

After the descent of the drill 11 is stopped, the drill 11 is raised by the drill vertical servomotor 53. When the drill 11 reaches the rising point, the rotation of the drill 11 is stopped by the spindle motor rotation speed control unit 51, and the inner layer pattern cut is completed (see S25 and S26 in FIGS. 4D and 5).

Embodiment 2 FIGS. 6A to 6E show Embodiment 1.
FIG. 7 is a schematic diagram of an essential part schematically showing an example of an apparatus for further cutting a surface layer pattern in addition to the inner layer pattern cutting, and an operation example thereof. FIG. 7 is an operation flow diagram when the surface layer pattern is cut. Hereinafter, the operation at the time of cutting the surface layer pattern will be described with reference to FIGS. 6A to 6E and FIG.

First, an NC data supply terminal capable of managing the creation of pattern cutting conditions (surface layer pattern, inner layer pattern, cut depth, hole diameter, etc.), the number of pattern cut substrates, etc., and capable of transmitting and receiving various operation information with the apparatus main body. When the pattern cutting condition supplied from the reference numeral 23 (see FIG. 1) is the surface layer pattern cutting, the drill 11 is automatically changed by the automatic drill changing function.
From the end mill 12 for surface layer pattern cutting.

Next, the fixing member 6 constituting the X-axis moving means
5 and the substrate mounting pallet 30 (see FIG. 1) placed on the Y-axis moving table by the cut position coordinate data transmitted from the NC data terminal 23 to the drive control unit (not shown) to cut the surface layer. The substrate height detection sensor 19 is moved to the cut coordinate position on the pattern 3 (see S30 in FIGS. 6A and 7).

Here, the air cylinder 64 is operated to lower the substrate height detection sensor 19 and contact the surface layer pattern 3 to be cut to measure the lowering value of the substrate height detection sensor 19 (FIGS. 6B and 7). See S31). After measuring the descending value, the air cylinder 64 is operated, the substrate height detection sensor 19 is returned to the original position, the fixing member 65 is moved on the X axis, and the end mill 12 is moved to the cut coordinate position of the surface layer pattern 3 to be cut. (S32 and S3 in FIGS. 6C and 7)
3).

Next, the feed amount of the servo motor 53 is determined based on the descending value measured by the substrate height detection sensor 19 and the thickness of the surface layer pattern 3 and the core 8 which are known in advance. To work. By operating the spindle motor 14 at the same time, the end mill 12
Is rotated while rotating to cut the pattern of the surface layer pattern 3 (see S34 in FIGS. 6D and 7).

At this time, the core 8 is partially cut by the end mill 12, but the inner layer pattern 4 is not affected. After the cutting is completed, the end mill 12 is moved up to the original position and stopped by operating the servo motor 53, and the surface layer pattern cutting is completed (see S35 in FIGS. 6E and 7). Hereinafter, similarly, the board height detection sensor 19 is moved to the next cut position coordinates (see S36 in FIG. 7).

<Embodiment 3> FIGS. 8 (a) to 8 (d)
FIG. 9 is a schematic view of an essential part schematically showing an example of an apparatus for cutting through holes and small-diameter VIA holes in addition to the inner layer pattern cutting of Example 1, and FIG. FIG. 5 is an operation flow chart of FIG. Hereinafter, the operation at the time of cutting through holes and small-diameter VIA holes will be described with reference to FIGS. 8A to 8D and FIG.

First, the height of the upper surface of the printed board 1 or the mounting board 2 set on the board mounting pallet 30 (see FIG. 1) is measured (see S40 to S43 in FIG. 9). In addition,
The automatic drill exchange and measurement operations have been described with reference to the surface layer pattern cutting operation of the second embodiment, and a description thereof will be omitted.

Next, the drill 11 is moved and positioned above the small-diameter via hole 7 where the drill 11 is cut according to the cut position coordinate data (see FIG. 8A and S44 in FIG. 9). The drill 11 starts rotating at a certain number of rotations set by the spindle motor 14 and the spindle motor rotation number control unit 51, and the drill 11 is used for drilling up and down based on the previously measured substrate upper surface position information and online pattern cutting conditions. The servo motor 53 is moved down to a predetermined position to cut the small-diameter via hole 7 (FIGS. 8B to 8C).
(D), see S45 and S46 in FIG. 9).

After the descent of the drill 11 has been stopped, the drill 11 is raised by the drill vertical servomotor 53. When the drill 11 reaches the rising point, the rotation of the drill 11 is stopped by the spindle motor rotation speed control unit 51, and the cutting of the small diameter VIA hole is completed.

Thereafter, the above-described operation is repeated until all the cutting operations are completed.
Alternatively, the work of taking out the mounting board 2 is completed (S in FIG. 9).
47, 48). It should be noted that V also applies to the through hole 6.
It is operated by the same operation as the IA hole 7 and cut.

<Embodiment 4> FIG. 10 is a diagram showing a configuration in which a design change data online supply system is added to the pattern cutting apparatus of each embodiment described above and its flow.

The configuration includes a change database 120 in which a product designer registers design change data (for example, a target product name, a changed portion, a change content, etc.) and an L in the change database 120.
The device 12 of the present invention that is online via the AN 121, the data relay unit 122, and the NC data supply terminal 23
4 and a control unit 125 in the control unit 4.

In the data flow, the change data is automatically stored in the NC data supply terminal 23 from the change database 120 via the LAN 121 and the data relay unit 122 according to the work schedule. During operation, the NC data supply terminal 23
Then, when the product name is input, the changed data is automatically transferred to the control unit 125 in the apparatus 124 of the present invention. Work is performed using this changed data.

<Embodiment 5> FIG. 11 shows that the lead 131 of the mounted component 60
And a similar conduction detection clip (not shown) is provided on the other side of the inner layer pattern 4.
The inner layer pattern 4 can be cut without being affected by warpage, torsion, and variations in layer thickness accuracy of the printed board 1 or the mounting board 2 by the inner layer conduction detecting section 81 which can confirm the conduction of the inner layer. 5 is a different embodiment of the present invention.

The difference from the second embodiment shown in FIG.
As shown in FIG. 1A, the drill 11 having the conduction detecting mechanism 132 is lowered from the state where the conduction of the inner layer pattern 4 is detected by the inner layer conduction detecting section 81 to a position where the drill 11 comes into contact with the inner layer pattern 4. 81 (see FIG. 11).
(b)).

Here, the drill 11 is further lowered by the known thickness of the inner layer pattern 4 to cut the inner layer pattern 4 (see FIG. 11C). When the drill 11 is raised, the conduction detection clip 13 attached to the lead portion 131 of the mounted component 60 is provided on one side, and the same conduction detection clip (not shown) is provided on the other side, and the conduction of the inner layer pattern 4 is confirmed. The non-conductive state is detected by the possible inner-layer conduction detecting section 81, and it can be confirmed that the inner-layer pattern 4 has been cut.
According to the present embodiment, it is possible to cope with the cutting of the inner layer pattern 4 of the printed board 1 or the mounting board 2 having variations in warpage, twist, and layer thickness accuracy.

<Embodiment 6> This embodiment is an embodiment in which a pattern cut by a press cut method is added to the apparatus shown in FIG. 1. FIG. 12 is a cross-sectional view showing the components of a press die used for press cut. FIG. This embodiment has a function of cutting through holes and small-diameter via holes of the third embodiment shown in FIG. 8 by press cutting. FIG.
FIGS. 13A to 13C are operation diagrams of the press cutting method for through holes and small-diameter via holes.

The structure of the press die will be described with reference to FIG. 12. An upper die set 141 is provided at the top, a punch plate 142 is provided below the die set 141, a punch 140 embedded in the punch plate 142 and penetrating the printed board 1, and a printed board 1 , An ejector plate 144 that presses the ejector plate 144, a spring 143 that applies a pressing force to the ejector plate 144, a die plate 145 that engages with the punch 140 and cuts the printed circuit board 1, and a lower die set 146 at the bottom.

The upper part of the printed circuit board 1 is
7. The lower part is called the lower mold 148. The press die constituted by these components is attached to a press machine (not shown), and press cutting is performed by giving up and down movements from the press machine.

Next, the operation of the through-hole press cutting method will be described with reference to FIG. In addition, small diameter VIA
The same applies to the case of the hole cut, and a description thereof will be omitted.) First, as shown in FIG. 13A, the upper die 147 descends from above the printed circuit board 1 placed on the die plate 145, and the ejector plate 144
Press the printed circuit board 1 with.

Next, as shown in FIG. 13B, the upper die 147 is further lowered and penetrated through the through hole 6 of the printed circuit board 1 by the punch 140 to perform press press cutting. Next, as shown in FIG.
0 comes off the printed circuit board 1, and the press cut is completed.

According to the present invention, by providing the above-described press machine near the spindle motor 14 in FIG. 1, it is possible to cut through holes and small-diameter VIA holes in a short time.

[0065]

As described in detail above, the intended object has been achieved by the present invention. In other words, it is necessary to send the drill to the cutting depth required for the inner layer pattern cutting without being affected by variations in the layer thickness accuracy of the multilayer printed circuit board, warpage, bending, and the bending of the printed circuit board due to the cutting force of the drill. By making it possible, there is no need to forcibly warp or warp the printed circuit board, and it is possible to cut the inner layer pattern even on the mounting board, and a pattern cutting device that can reduce the number of remodeling steps associated with design changes Could be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of a pattern cutting apparatus.

FIG. 2 is an overall operation flowchart of the pattern cutting apparatus.

FIG. 3 is an explanatory diagram of a pattern cutting operation.

FIG. 4A is an operation diagram when an inner layer pattern is cut.

FIG. 4B is an operation diagram when an inner layer pattern is cut.

FIG. 4C is an operation diagram when an inner layer pattern is cut.

FIG. 4D is an operation diagram when an inner layer pattern is cut.

FIG. 5 is an operation flow diagram when an inner layer pattern is cut.

FIG. 6A is an operation diagram when a surface layer pattern is cut.

FIG. 6B is an operation diagram when a surface layer pattern is cut.

FIG. 6C is an operation diagram when a surface layer pattern is cut.

FIG. 6D is an operation diagram when a surface layer pattern is cut.

FIG. 6E is an operation diagram when a surface layer pattern is cut.

FIG. 7 is an operation flow chart when a surface layer pattern is cut.

FIG. 8 is an operation diagram when a through hole and a small diameter VIA hole are cut.

FIG. 9 is an operation flowchart when cutting through holes and small-diameter via holes;

FIG. 10 is a configuration diagram of a design change data supply system.

FIG. 11 is an operation diagram when an inner layer pattern is cut (alternative to the conduction detection method).

FIG. 12: Alternative to through-hole, small-diameter VIA hole cut

FIG. 13A is an operation explanatory view of FIG. 12;

FIG. 13B is an explanatory diagram of the operation in FIG. 12;

13C is an explanatory diagram of the operation in FIG. 12;

[Explanation of symbols]

1 ... printed circuit board 2 ... mounting board
3: Surface layer pattern, 4: Inner layer pattern, 5: G layer (ground layer), 6: Through hole, 7: Small diameter VIA hole, 8: Core, 9: Prepreg, 10: Solder resist, 11: Drill, 12
... end mill, 13 ... conduction detection clip, 1
4 ... Spindle motor, 15 ... Table,
16: X-axis moving means, 17: Y-axis moving table, 18: Z-axis, 19: board height detection sensor, 20: camera, 21: monitor,
22: cut waste suction nozzle, 23: NC data supply terminal, 30: substrate mounting pallet, 31
... Drill exchange chuck, 32 ... Touch panel,
33: Operation panel, 34: Drill post A, 35: Drill post B, 36: Device body, 50: Servo motor control unit, 51: Spindle motor rotation speed control unit, 52: Conduction detection unit
53: servo motor, 54: ball screw, 55: surface layer, 56: inner layer,
57: back surface pattern, 60: mounted component, 64: cylinder, 65: fixing member, 81: inner layer conduction detection unit, 120
... change database, 121 ... LAN, 122 ...
Data relay unit, 124 ... device of the present invention, 125
... Control part, 131 ... Lead part, 132
... Conduction detection mechanism, 140 ... Punch, 141 ...
Upper die set, 142 ... Punch plate, 1
43 ... spring, 144 ... ejector plate, 145 ... die plate, 146 ...
Lower die set, 147 ... Upper die, 1
48 ... lower mold.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Satoru Otani 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture

Claims (9)

[Claims] 1. A pattern cutting apparatus capable of automatically cutting at least an inner layer pattern of a multilayer printed circuit board by numerical control, comprising: a spindle motor having a detachable drill or an end mill;
An X-axis moving means supporting a spindle motor and a height detection sensor on a fixed member, a Y-axis moving table on which a substrate mounting pallet is mounted, and a cutting edge of a drill or an end mill on a printed circuit board according to pattern cut position information. Drive control means for positioning at a position and cutting at least an inner layer pattern, a numerical control data supply terminal storing a pattern cutting condition including at least pattern cutting position information, and an inner layer pattern to be cut on one of the contacts by a printed circuit board And a conduction detecting means connected to the lower conductor existing immediately below and the other contact connected to a drill or an end mill. The spindle motor is connected to a fixed member via a servomotor.
The drill or end mill is supported so as to be movable in the axial direction, and the cut is started by the drive control means based on the pattern cut position information transmitted from the numerical control data supply terminal. Then, a predetermined inner layer pattern is cut, and further, the cutting is stopped based on a conduction signal detected by the conduction detecting means when the tip of the inner layer pattern passes through the insulating layer immediately below and contacts the lower layer conductor provided on the back surface thereof. A pattern cutting apparatus configured to move the drill or the end mill above the substrate by operating the servo motor. 2. A pattern cutting apparatus according to claim 1, wherein said Y-axis moving table is provided with automatic exchange means capable of detachably attaching a drill or an end mill to a spindle motor according to the type of a printed circuit board. 3. A fixing member constituting the X-axis moving means,
2. The pattern cutting device according to claim 1, further comprising a spindle motor and a height detection sensor, and a cutting dust suction nozzle arranged to discharge cutting chips after the cutting of the inner layer pattern is completed. 4. A configuration in which a numerical control data supply terminal storing the pattern cut condition is made online via a printed circuit board design change system and a host computer to transmit the pattern cut data to the drive control means.
2. The pattern cutting apparatus according to claim 1, wherein cut position data accompanying a design change is automatically stored in said numerical control data supply terminal, and necessary numerical control data can be automatically created and supplied as needed. 5. A variety of pattern cut types are provided in the cut position data transmitted from the numerical control data supply terminal to the drive control means, and an automatic exchange function of a drill or an end mill is provided. 3. A drill or an end mill can be automatically selected at the same time.
Or, the pattern cutting device according to 4. 6. The method according to claim 6, wherein the height detection sensor is constituted by a contact-type sensor, and when the pattern cutting is performed, by taking in the surface height data of the printed board, the height of the printed board is adjusted with respect to the horizontally mounted printed board surface. By correcting the downward moving distance data of the spindle that rotates a drill or end mill that can move vertically up and down from above, correcting the data for each cutting position, and performing the cut, it is affected by the warpage of the printed circuit board. 2. The pattern cutting apparatus according to claim 1, wherein the pattern can be cut without requiring a backup. 7. A contact type height detection sensor, wherein when performing an inner layer pattern cut, the surface height data of a printed circuit board is taken before cutting, and after the inner layer pattern is cut, the height detection sensor is contacted. By inserting the child into the counterbored hole that has been cut and capturing the counterbore hole bottom depth data, it is possible to compare the surface height data and the counterbore hole bottom depth data of the substrate, and to actually measure the cut depth, Furthermore, by owning the fixed cut depth data in advance, the fixed cut depth data is compared with the actually measured cut depth data, and the pass / fail judgment of the cut depth and the presence / absence detection of cut chips are automatically performed. The pattern cutting device according to claim 5, wherein the pattern cutting device is enabled. 8. A first contact which can be supplied with electric current through component leads or through holes at both ends of the pattern in order to supply a weak current to the pattern itself to be cut, and has a function as a second contact. The drill or end mill has a spindle motor that can be moved up and down and is mounted in a state where it can be energized, and the drill or end mill is driven by the spindle motor and has a conduction detection unit that detects conduction due to contact with the pattern to be cut. As a result, the drill or end mill comes into contact with the pattern to be cut, and it is possible to send the drill or end mill by the pre-specified cut depth from the position where conduction is detected, without being affected by the layer thickness accuracy, warpage, or deflection of the printed circuit board. The pattern can be cut without damaging the pattern on the back In, yet after cutting completion, conduction detecting means pattern cutting apparatus according to any one claims 5 to 7 made it possible to prevent the uncut by confirming that there is no continuity in the pattern itself by. 9. A press-type punching mechanism capable of penetrating through holes and small-diameter via holes, and a backup mechanism capable of supporting only directly below the through holes and small-diameter via holes from below the punched through holes and small-diameter via holes. 9. The pattern cutting device according to claim 1, further comprising a press cutting device provided.