JPH04122482A - Control of washing apparatus - Google Patents
Control of washing apparatusInfo
- Publication number
- JPH04122482A JPH04122482A JP24480990A JP24480990A JPH04122482A JP H04122482 A JPH04122482 A JP H04122482A JP 24480990 A JP24480990 A JP 24480990A JP 24480990 A JP24480990 A JP 24480990A JP H04122482 A JPH04122482 A JP H04122482A
- Authority
- JP
- Japan
- Prior art keywords
- water
- washing
- pure water
- tank
- cleaning device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005406 washing Methods 0.000 title claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 101
- 238000004140 cleaning Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 6
- 150000007514 bases Chemical class 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract description 12
- 238000011109 contamination Methods 0.000 abstract description 5
- 241000894006 Bacteria Species 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000003643 water by type Substances 0.000 abstract 1
- 244000005700 microbiome Species 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000035755 proliferation Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 239000008235 industrial water Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- KIZFHUJKFSNWKO-UHFFFAOYSA-M calcium monohydroxide Chemical compound [Ca]O KIZFHUJKFSNWKO-UHFFFAOYSA-M 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000033444 hydroxylation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
水洗いのための水槽を有した洗浄装置の管理方法に関し
、
装置の複雑化を招かずに水槽内での微生物の繁殖を抑制
し、被洗浄体の汚染を防止することを目的とし、
水槽に溜めた水を用いて被洗浄体の水洗いを行う洗浄装
置において、水洗いの休止期間中ば、塩基化合物を添加
することにより、前記水槽内に滞留する水を弱アルカリ
性に保つごとによって構成される。[Detailed Description of the Invention] [Summary] A method for managing a cleaning device having a water tank for washing, which suppresses the proliferation of microorganisms in the tank without complicating the device and prevents contamination of objects to be cleaned. In a cleaning device that uses water stored in a water tank to wash the object to be cleaned, a basic compound is added to remove the water remaining in the water tank during the rest period of washing. It consists of keeping it slightly alkaline.
本発明は、水洗いのための水槽を有した洗浄装置の管理
方法に関する。The present invention relates to a method of managing a cleaning device having a water tank for washing with water.
電子部品の製造における洗浄工程では、薬液などを洗い
落とすために純水（イオン交換水）が用いられる。In the cleaning process in the manufacture of electronic components, pure water (ion-exchanged water) is used to wash away chemicals and the like.
純水を長時間にわたって滞留さゼると、微生物の繁殖に
よって純水の流路が汚染され、これを清浄化するために
大量の清浄な純水が必要となる。If pure water is retained for a long period of time, the pure water flow path will be contaminated by the proliferation of microorganisms, and a large amount of clean pure water will be required to purify this.
しかし、休日などのように洗浄装置の作動を停止する期
間は、洗浄装置内での純水の滞留が避けられない。However, during periods when the cleaning device is not operating, such as during holidays, it is unavoidable that pure water remains in the cleaning device.
一般に、洗浄装置では、純水の有効利用を図るために、
−度洗浄に用いた純水を水槽に溜め、これをくみ出して
再度洗浄に用いるというように、純水を循環させるよう
になっている。このような洗浄装置では、その作動を停
止すると、水槽内で純水が滞留して微生物が繁殖する。Generally, in cleaning equipment, in order to effectively utilize pure water,
- The pure water used for cleaning is stored in a water tank and pumped out to be used again for cleaning, so that the pure water is circulated. In such a cleaning device, when the operation is stopped, pure water remains in the water tank and microorganisms breed.
そこで、洗浄装置の作動の停止に際して水槽の排水を行
うことが考えられるが、実際には、水槽を完全に乾燥さ
せることは困難であり、水槽内に少量の純水が残ること
によってかえって微生物の繁殖が進んだり、汚染物質が
水槽の壁面に凝縮されて付着する恐れがある。Therefore, it is possible to drain the water tank when the cleaning device stops operating, but in reality, it is difficult to completely dry the tank, and a small amount of pure water remaining in the tank may actually cause microorganisms to grow. There is a risk that breeding will progress and contaminants may condense and adhere to the walls of the aquarium.
したがって、従来においては、洗浄装置の作動を長時間
停止する場合には、水槽を含む純水の流路をオゾン水溶
液で満たし、オゾンの酸化作用によって微生物を死滅さ
せていた（特開平２−９７０２２号公報）。Therefore, in the past, when the operation of the cleaning equipment was to be stopped for a long time, the flow path of pure water including the water tank was filled with an aqueous ozone solution, and the microorganisms were killed by the oxidizing effect of ozone (Japanese Patent Application Laid-Open No. 2-97022 Publication No.).
しかし、従来では、オゾン発生手段及びオゾン水溶液の
供給用配管などの付加によって、洗浄装置が複雑化する
とともに大型で高価になるという問題があった。However, in the past, there has been a problem that the cleaning device becomes complicated, large and expensive due to the addition of ozone generating means and piping for supplying an aqueous ozone solution.
また、オゾン水溶液の酸化作用により洗浄装置の各部が
劣化するという問題があった。Further, there was a problem in that various parts of the cleaning device deteriorated due to the oxidizing effect of the ozone aqueous solution.
本発明は、上述の問題に鑑の、洗浄装置の複’ＡＩ化を
招くことなく水槽内での微生物の繁殖を抑制し、被洗浄
体の汚染を防止することを目的としている。In view of the above-mentioned problems, the present invention aims to suppress the propagation of microorganisms in a water tank and prevent contamination of objects to be cleaned without causing the need for multiple AI cleaning devices.
本発明に係る方法は、上述の課題を解決するため、第１
図及び第２図に示すように、水槽２０３０に溜めた水を
用いて被洗浄体３の水洗いを行う洗浄装置１において、
水洗いの休止期間中は、塩基化合物の添加によって前記
水槽２０．３０内に滞留する水Ｗ２．Ｗ３を弱アルカリ
性に保つ。In order to solve the above-mentioned problems, the method according to the present invention has the following advantages:
As shown in FIG. 2 and FIG. 2, in the cleaning device 1 that washes the object 3 to be cleaned using water stored in a water tank 2030,
During the pause period of water washing, water W2. Keep W3 slightly alkaline.
固体又は液体の塩基化合物を添加することにより、水槽
２０．３０内に滞留する水Ｗ２．Ｗ３が弱アルカリ性と
され、水槽２０．３０内での微生物の繁殖が抑えられる
。By adding a solid or liquid basic compound, the water W2. remaining in the water tank 20.30 is reduced. W3 is made weakly alkaline, and the growth of microorganisms in the water tank 20.30 is suppressed.
以下、本発明の実施例を図面を参照しつつ説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第２図は本発明に係る洗浄装置１の構成倚模式％式％
洗浄装置１は、薬液槽１０．１次水洗槽２０．２次水洗
槽３０、及び乾燥槽４０などから構成されており、プラ
ズマデイスプレィパネルのガラス基板３の洗浄手段とし
て製造ラインに組み込まれている。FIG. 2 is a schematic diagram of the structure of the cleaning device 1 according to the present invention. It is incorporated into the manufacturing line as a cleaning means for the glass substrate 3 of the plasma display panel.
ガラス基板３は、図示しない搬送手段によっ゛ζ矢印Ｍ
１方向に搬送され、洗浄装置１を通過する間に、まず、
薬液槽１０においてポンプＩＩによってノズル１２から
噴出される水酸化ナトリウム（Ｎ ａ ＯＨ）の水溶液
によって油成分などの汚れが洗い落とされ、続いて、１
次水洗槽２０及び２次水洗槽３０において水酸化すＩ・
リウム水溶液が洗い流される。その後、乾燥槽４０内で
乾燥したガラス基板３は、洗浄装置１から送り出される
。The glass substrate 3 is transported by a transport means (not shown) in the direction of arrow M
While being conveyed in one direction and passing through the cleaning device 1, first,
In the chemical tank 10, dirt such as oil components is washed away by an aqueous solution of sodium hydroxide (N a OH) spouted from the nozzle 12 by the pump II, and then
Hydroxylation occurs in the secondary washing tank 20 and the secondary washing tank 30.
The lium aqueous solution is washed away. Thereafter, the glass substrate 3 dried in the drying tank 40 is sent out from the cleaning device 1.
１次水洗槽２０は、ノズル２２．２３．１次水洗槽２０
の内部で水Ｗ２を循環させるためのポンプ２１、及びオ
ーバーフロー排水口２５などから構成されている。The primary water washing tank 20 includes nozzles 22, 23, and 23.
It is comprised of a pump 21 for circulating water W2 inside, an overflow drain port 25, and the like.
ノズル２２は、後述の純水供給源２からハルツ５０を介
して供給される純水Ｗ１を下方のガラス基板３に向けて
噴出し、ノズル２３は、ポンプ２１によって１次水洗槽
２０の底部から汲め上げられた水Ｗ２をガラス基板３に
向けて噴出する。また、オーバーフロー排水口２５は、
１次水洗槽２０の底部に所定量（１００Ｎ程度）の水Ｗ
２が溜まるように適当な位置に設けられている。The nozzle 22 sprays pure water W1 supplied from a pure water supply source 2 (to be described later) via a HARTZ 50 toward the glass substrate 3 below, and the nozzle 23 sprays pure water W1 from the bottom of the primary washing tank 20 by the pump 21. The pumped water W2 is spouted toward the glass substrate 3. In addition, the overflow drain port 25 is
A predetermined amount (about 100N) of water W is placed at the bottom of the primary washing tank 20.
2 is placed at an appropriate position so that it can accumulate.
１次水洗槽２０においては、ノズル２２による注水とオ
ーバーフロー排水口２５による排水とによって水Ｗ２の
清浄度が所定範囲内に保たれる。In the primary washing tank 20, the cleanliness of the water W2 is maintained within a predetermined range by water injection through the nozzle 22 and drainage through the overflow drain port 25.
２次水洗槽３０は、１次水洗槽２０と同様の構成とされ
、純水Ｗ］を噴出するノズル３２、ポンプ３１によって
汲み」二げられた水Ｗ３を噴出するノズル３３、及びオ
ーバーフロー排水口３５を有している。The secondary rinsing tank 30 has the same configuration as the primary rinsing tank 20, and includes a nozzle 32 that spouts pure water W, a nozzle 33 that spouts water W3 pumped by the pump 31, and an overflow drain port. It has 35.
純水供給源２は、イオン交換樹脂などによって工業用水
から純水Ｗ１を生成する純水生成装置２Ａ、純水生成装
置２人に工業用水を給水する給水管２Ｂ、純水Ｗ１を洗
浄装置１に供給するための配管２Ｃから構成されている
。The pure water supply source 2 includes a pure water generating device 2A that generates pure water W1 from industrial water using an ion exchange resin, a water supply pipe 2B that supplies industrial water to two people in the pure water generating device, and a cleaning device 1 that supplies the pure water W1 to the pure water generating device 2B. It is composed of a pipe 2C for supplying the water.
配管２Ｃは、純水生成装置２Ａの出水側と入水側とに連
通し、純水Ｗ１は純水生成装置２Ａと配管２Ｃからなる
流路内を循環する。つまり、純水供給源２の内部では、
純水Ｗ１の腐敗を防止するため、純水Ｗ１は休日であっ
ても絶えず流動状態とされる。The piping 2C communicates with the water outlet side and the water inlet side of the pure water generating device 2A, and the pure water W1 circulates in a flow path made up of the pure water generating device 2A and the piping 2C. In other words, inside the pure water supply source 2,
In order to prevent decomposition of the pure water W1, the pure water W1 is constantly kept in a fluid state even on holidays.
第１図は本発明に係る洗浄装置１の管理方法を示す図で
ある。FIG. 1 is a diagram showing a method of managing a cleaning device 1 according to the present invention.
上述したように、洗浄装置１の使用に際しては、バルブ
５０を開けてノズル２２．３２から純水Ｗ１を噴出させ
るとともに、ポンプ２１．３１を作動させてノズル２３
．３３から水Ｗ２．Ｗ３を噴出させる。この状態でガラ
ス基板３を搬送し、ガラス基板３に対して、薬液洗浄、
１次及び２次水洗、及び乾燥を行う。As described above, when using the cleaning device 1, the valve 50 is opened to eject pure water W1 from the nozzle 22.32, and the pump 21.31 is operated to spray the pure water W1 from the nozzle 23.
．． 33 to water W2. Spray W3. In this state, the glass substrate 3 is transported, and the glass substrate 3 is subjected to chemical cleaning,
Perform primary and secondary water washing and drying.
ここで、例えば休日などにおいて、プラズマデイスプレ
ィパネルの製造ラインの稼働が長時間停止する場合には
、洗浄装置１の作動も停止される。Here, when the operation of the plasma display panel manufacturing line is stopped for a long time, for example on holidays, the operation of the cleaning device 1 is also stopped.
すなわち、時点Ｌｌにおいて、バルブ５０を閉じて純水
Ｗ１の供給を絶ち、各ポンプ１１，２１３１をオフする
。That is, at time Ll, the valve 50 is closed to cut off the supply of pure water W1, and each pump 11, 2131 is turned off.
このように洗浄袋Ｗ１の作動を停止すると、各水洗槽２
０．３０のそれぞれの底部に水Ｗ２．Ｗ３が滞留する。When the operation of the washing bag W1 is stopped in this way, each washing tank 2
Water at the bottom of each of 0.30 W2. W3 stays.
この状態で長時間（例えば１日以上）放置すると、水Ｗ
２．Ｗ３の中で微生物が繁殖する。上述したように各水
洗槽２０．３０では水Ｗ２．Ｗ３を循環させるので、微
生物が繁殖すると、再び洗浄装置Ｊによるガラス基板３
の洗浄を開始したときに、ガラス基板３に微生物が付着
してプラズマデイスプレィパネルの不良が発生ずる。If left in this state for a long time (for example, more than one day), water
2. Microorganisms multiply inside W3. As mentioned above, in each washing tank 20.30, water W2. Since the W3 is circulated, when microorganisms multiply, the glass substrate 3 is removed by the cleaning device J again.
When cleaning is started, microorganisms adhere to the glass substrate 3, resulting in a defective plasma display panel.
そこで、洗浄装置Ｉにおいては、洗浄の休止期間の初期
の時点Ｌ２で各水洗槽２０．３０に錠剤状のＮａＯＨ（
０，］グラム程度）を１粒ずつ投入する。Therefore, in the cleaning apparatus I, tablet-shaped NaOH (
0,] grams) one by one.
これにより、各水洗槽２０．３０の底部に滞留する水Ｗ
２．Ｗ３はＰＨ９程度の弱アルカリ性となり、洗浄の休
止期間中における微生物の繁殖が抑えられる。As a result, water W remaining at the bottom of each washing tank 20.30
2. W3 has a slightly alkaline pH of about 9, which suppresses the growth of microorganisms during the pause period of washing.
休日が終わって製造ラインの稼働を再開する際には、洗
浄装置１については、洗浄の再開に先立って各水洗槽２
０．３０の弱アルカリ性の水Ｗ２Ｗ３を純水Ｗ１と入れ
換える。ずなわち時点ｔ３でバルブ５を開いて各水洗槽
２０．３０に純水供給源２から純水Ｗ１を注水する。When restarting the production line after a holiday, each washing tank 2 of the washing device 1 should be
0.30 weakly alkaline water W2W3 is replaced with pure water W1. That is, at time t3, the valve 5 is opened and pure water W1 is poured from the pure water supply source 2 into each washing tank 20.30.
この注水とオーバーフロー排水口２５．３５による排水
とによって、水Ｗ２．Ｗ３のアルカリ濃度が下がり、注
水開始時点の水Ｗ２．Ｗ３の量とほぼ同量の純水Ｗ１を
各水洗槽２０．３０に注水した頃に水Ｗ２．Ｗ３は純水
Ｗ１と入れ代わる。By this water injection and drainage through the overflow drain port 25.35, water W2. The alkali concentration of W3 decreases, and the water W2. When approximately the same amount of pure water W1 as W3 was poured into each washing tank 20.30, water W2. W3 replaces pure water W1.
なお、水の入れ換えに際して、別に設けた排出口によっ
て排水を行ってもよいし、ポンプ２１３１を作動させて
もよい。Note that when replacing the water, drainage may be performed through a separately provided outlet, or the pump 2131 may be operated.
その後、時点ｔ４でガラス基板３を搬送し、ガラス基板
３の洗浄を再開する。Thereafter, at time t4, the glass substrate 3 is transported and cleaning of the glass substrate 3 is restarted.
上述の実施例によれば、洗浄の再開に際して、比較的少
量の純水Ｗ１を注水するだけで、各水洗槽２０．３０を
使用可能状態とすることができ、迅速に洗浄を再開する
ことができる。According to the above-described embodiment, each washing tank 20.30 can be put into a usable state by simply pouring a relatively small amount of pure water W1 when restarting cleaning, and cleaning can be restarted quickly. can.
上述の実施例によれば、洗浄の休止期間中において、各
水洗槽２０．３０の水Ｗ２．Ｗ３は弱アルカリ性とされ
るので、水Ｗ２．Ｗ３を酸性とすることによって微生物
の繁殖を抑える場合に比べて水洗槽２０．３０の内壁の
劣化が少ない。According to the embodiment described above, during the pause period of washing, the water W2. of each washing tank 20.30. Since W3 is considered to be weakly alkaline, water W2. Compared to the case where the proliferation of microorganisms is suppressed by making W3 acidic, there is less deterioration of the inner wall of the washing tank 20.30.
上述の実施例において、各水洗槽２０．３０の水Ｗ２．
Ｗ３をＰＨ８〜９程度の弱アルカリ性としてもよい。こ
のとき、Ｎａ ＯＨに代えてＣａ０Ｈ（水酸化カルシウ
ム）、ＫＯＨ（水酸化カリうム）などの固体又は液体の
塩基化合物を水Ｗ２゜Ｗ３に添加することができる。In the embodiment described above, the water W2. of each washing tank 20.30.
W3 may be slightly alkaline with a pH of about 8 to 9. At this time, a solid or liquid basic compound such as CaOH (calcium hydroxide) or KOH (potassium hydroxide) can be added to the water W2°W3 instead of NaOH.
上述の実施例においては、プラズマディスプレイパネル
の製造ラインに組み込まれた洗浄装置１を例示したが、
液晶表示装置やホログラム装置などの製造に用いる洗浄
装置にも本発明を適用することができる。In the above-mentioned embodiment, the cleaning device 1 incorporated in a plasma display panel production line was illustrated, but
The present invention can also be applied to cleaning devices used for manufacturing liquid crystal display devices, hologram devices, and the like.
本発明によれば、洗浄装置の複雑化を招くことなく水槽
内での微生物の繁殖を抑制することができ、被洗浄体の
汚染を防止することができる。According to the present invention, it is possible to suppress the proliferation of microorganisms in the water tank without complicating the cleaning device, and it is possible to prevent contamination of the object to be cleaned.
第１図は本発明に係る洗浄装置の管理方法を示す図、
第２図は本発明に係る洗浄装置の構成を模式的に示す図
である。
図において、
■は洗浄装置、
３はガラス基板（被洗浄体）
２０は１次水洗槽（水槽）、
■
３０ば２次水洗槽（水槽）、
Ｗ３は水である。FIG. 1 is a diagram showing a cleaning device management method according to the present invention, and FIG. 2 is a diagram schematically showing the configuration of the cleaning device according to the present invention. In the figure, ① is a cleaning device, 3 is a glass substrate (object to be cleaned), 20 is a primary washing tank (water tank), ③ 30 is a secondary washing tank (water tank), and W3 is water.
Claims (1)
体（３）の水洗いを行う洗浄装置（１）において、 水洗いの休止期間中は、塩基化合物を添加 することにより、前記水槽（２０）（３０）内に滞留す
る水（Ｗ２）（Ｗ３）を弱アルカリ性に保つ ことを特徴とする洗浄装置の管理方法。(1) In the cleaning device (1) for washing the object to be cleaned (3) using water stored in the water tanks (20) and (30), during the suspension period of water washing, by adding a basic compound, the A method for managing a cleaning device, characterized in that water (W2) (W3) staying in water tanks (20) (30) is kept slightly alkaline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24480990A JP2902465B2 (en) | 1990-09-13 | 1990-09-13 | Cleaning device management method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24480990A JP2902465B2 (en) | 1990-09-13 | 1990-09-13 | Cleaning device management method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04122482A true JPH04122482A (en) | 1992-04-22 |
| JP2902465B2 JP2902465B2 (en) | 1999-06-07 |
Family
ID=17124271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24480990A Expired - Fee Related JP2902465B2 (en) | 1990-09-13 | 1990-09-13 | Cleaning device management method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2902465B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113960963A (en) * | 2021-09-06 | 2022-01-21 | 无锡太湖学院 | Cleaning and assembly line linkage control system |
-
1990
- 1990-09-13 JP JP24480990A patent/JP2902465B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113960963A (en) * | 2021-09-06 | 2022-01-21 | 无锡太湖学院 | Cleaning and assembly line linkage control system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2902465B2 (en) | 1999-06-07 |
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