JPH04121778U - printed circuit board pad - Google Patents

Abstract

(57) [Summary] [Purpose] To form a pad connected to a signal line pattern and a pad connected to a solid pattern such as a power supply or ground to have the same heat capacity. [Structure] By forming and connecting a lead pattern portion between a solid pattern such as a power supply or ground pattern and a pad, the heat capacity is made equal to that of a pad connected to another signal line pattern.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to pads of printed circuit boards for reflow soldering of surface mount components. The heat capacity between the pad connected to the signal pattern and the pad connected to the solid pattern Concerning pads on printed circuit boards with equal amounts.

0002

[Conventional technology]

Conventionally, printing involves soldering and joining surface mount components such as flat ICs and chips. On the board, patterns for signal lines, power supply, ground, etc. formed on this printed circuit board. Pads to be connected to the leads of the surface mount components are formed corresponding to the respective leads. Faith The number pattern is formed with extremely fine dimensions, and the power and ground patterns are It is generally formed in a pattern.

0003 In addition, the pads corresponding to power and ground are connected to the pads as shown in Figure 5 or 6. Pad 5 of the rat IC or pad 8 of the chip and a solid pattern for power supply, ground, etc. 4 was designed to be directly connected.

0004

[Problem that the idea aims to solve]

The above conventional power supply, ground, etc. pads are directly connected to the solid pattern. , there is a difference in heat capacity between the signal pattern and the pad connected to it, resulting in a difference in the soldering of the pad. gender becomes uneven. For this reason, when performing reflow soldering work, Pads may have unsoldered parts, or pads with low heat capacity may cause solder to flow. There is a risk that solder short may occur due to movement.

[0005] The purpose of this invention is to connect pads and signals connected to solid patterns such as power supply and ground. Make the heat capacity equal between the pattern and the connected pad to prevent unsoldered areas and solder shorts. An object of the present invention is to provide a pad for a printed circuit board that can prevent the occurrence of such problems.

[0006]

[Means to solve the problem]

The pad of the printed circuit board of this invention is a solid pattern with pads such as power supply and ground. A drawer pattern section is provided between the two for connection.

[0007]

【Example】

Next, the present invention will be explained with reference to the drawings.

[0008] Figure 1 is a diagram of the mounting state of a flat IC, Figure 2 is a diagram of the mounting state of a chip, and Figure 3 is a diagram of the present invention. Figure 4 shows a flat IC pad connection state diagram of an embodiment of the present invention. FIG. 3 is a diagram of a pad connection state.

[0009] As shown in FIGS. 1(A) and 1(B), the printed circuit board 1 has a flash mounted on it, which is a mounted component. A plurality of pads 3 are formed according to the leads 2a of the IC 2. By joining lead 3 and lead 2a by reflow soldering, flat IC 2 can be made. It is surface mounted on the printed circuit board 1.

0010 The pad 3 is connected to a signal pattern formed on the printed circuit board 1. It is composed of a pad 5 connected to a solid pattern 4 for power supply, ground, etc. There is. Furthermore, as shown in FIG. 3, there is a pull-out putter between the solid pattern 4 and the pad 5. A contact portion 6 is formed. In this way, connect the solid pattern 4 and pad 5 directly. By connecting the pad 5 through the drawer pattern part 6 without having to It can be formed to have the same thermal capacity as pad 3, which is connected to the signal pattern of It is Noh.

[0011] In addition, as shown in FIGS. 2(A), (B) and FIG. Similarly, when bonding to the solid pattern 4, the pad 8 connected to the solid pattern 4 and this solid pattern A pull-out pattern portion 6 is formed between the ring 4 and the lead-out pattern portion 6 .

0012

[Effect of the idea] As explained above, the present invention has a drawer pattern section between the solid pattern and the pad. By forming pads connected to the solid pattern and other signal patterns, The thermal efficiency is the same as that of the connected pad, and the mounting area can be fixed by reflow soldering. The effect of reducing the occurrence of solder shorts and unsoldered parts when joining products. There is.

[Brief explanation of drawings]

FIG. 1 is a diagram of a mounting state of a flat IC.

FIG. 2 is a diagram of a chip mounting state.

FIG. 3 is a diagram of a flat IC pad connection state according to an embodiment of the present invention.

FIG. 4 is a diagram illustrating a chip pad connection state according to an embodiment of the present invention.

FIG. 5 is a diagram of a conventional flat IC pad connection state.

FIG. 6 is a diagram of a conventional chip pad connection state.

[Explanation of symbols]

1 Printed circuit board 2 Flat IC 3,5,8 pad 4 Solid pattern 6 Drawer pattern section 7 chips

Claims (2)

[Scope of utility model registration request] Claim 1: In the pads of a printed circuit board that connect surface-mounted components, the heat capacities of the pads connected to the signal pattern, the pads connected to the power supply solid pattern, and the pads connected to the ground solid pattern are made equal. A printed circuit board pad characterized by: 2. A lead pattern portion is formed between a power supply solid pattern and a pad connected to this solid pattern, and between a ground solid pattern and a pad connected to this solid pattern, respectively. The printed circuit board pad according to claim 1.