JPH04120263U - electronic circuit assembly - Google Patents

Abstract

(57) [Summary] [Purpose] In electronic circuit assemblies that are integrally constructed by connecting multiple printed circuit boards (referred to as PCBs), it is possible to improve the heat dissipation effect of power semiconductors and reduce assembly man-hours. The objective is to obtain a cost effective electronic circuit assembly. [Structure] In the present invention, electronic circuit patterns for each of a plurality of PCBs and connection patterns for connecting the PCBs are formed on a flexible printed circuit board (referred to as FPC), and the FPC is formed on a nickel-plated metal plate. A structure in which a plurality of PCBs are connected by fixing the insulated surfaces of the conductor layers, and a tab or electrode lead for heat radiation of the power semiconductor is directly soldered to the nickel-plated metal plate through a hole provided in the FPC. It is.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to an electronic circuit assembly, and in particular, connects multiple PCBs using FPC to form an integrated circuit. It is constructed with a power semiconductor and is equipped with a power semiconductor.

0002

[Conventional technology]

FIG. 3 is a plan view showing an example of a conventional electronic circuit assembly. 4 shows a cross-sectional view, and each of the three PCBs 1, 2, and P has an electronic circuit pattern ( (not shown) is formed, and a power semiconductor 3 is formed on the electronic circuit pattern forming surface of the PCB 1. The terminal 3-1 of the power semiconductor 3 is fixed to the connection round of the electronic circuit pattern. PCB, 1 and 2 and P are connected by wire 4. Ru.

0003

[Problem that the idea aims to solve]

In the conventional electronic circuit assembly shown in FIGS. 3 and 4, power semiconductor The case is fixed to the surface of the PCB with the electronic circuit pattern, and the heat of the power semiconductor is Since the structure is such that heat is dissipated through the insulating layer of the case and PCB, sufficient heat dissipation is possible. Due to the problem of not having any There is a problem in that it requires a lot of man-hours and costs are high. This invention improves the heat dissipation effect of power semiconductors, reduces assembly man-hours, and lowers costs. The purpose is to obtain an electronic circuit assembly that can be reduced in size.

0004

[Means to solve the problem]

The electronic circuit assembly of the present invention includes multiple PCBs on a nickel-plated metal plate. An FPC that also has an electronic circuit pattern for each and a connection pattern between the PCB. Connect multiple PCBs by fixing them, and connect the terminals of the power semiconductor to the connection round of the FPC. Subsequently, a hole provided in the FPC with a heat dissipation tab or electrode lead of the power semiconductor, or The structure is soldered to the plated surface of the nickel-plated metal plate through the notch. The above objective will be achieved through the development of

[0005]

[Effect]

Electronic circuit patterns for each of multiple PCBs and connection patterns for connecting the PCBs The connection work between PCBs can be omitted by fixing and connecting FPCs that have also been formed. nickel-plated metal plate for heat dissipation tabs or electrode leads of power semiconductors. The heat dissipation effect can be enhanced by directly soldering the plated surface of the

[0006]

【Example】

Figure 1 is a plan view showing an example of an electronic circuit assembly implementing the present invention, and Figure 2 is the same. FIG. 3 is a cross-sectional view of the drawing.

[0007] In Figures 1 and 2, 6, 7, and N are nickel-plated metal plates, and 3 is electric power. semiconductor, 3-1 is a terminal of the power semiconductor 3, 3-2 is a tab or electrode lead for heat dissipation, 5 is the FPC, 5-1 is the conductor layer, 5-2 is the insulating layer, and 5-3 is the hole made in the FPC. Ru.

[0008] The FPC 5 that connects multiple PCBs has an electronic circuit pattern for each PCB. The circuit pattern connecting between the CBs is also integrally formed, and the power semiconductor 3 A hole 5-3 is provided through which the heat dissipation tab or electrode lead 3-2 can pass through, and the FPC Metal plates 6, 7, N are plated with nickel on the surface 5-2 where the conductor layer of No. 5 is insulated. It is fixed to the plated surface and connected integrally, and the terminal 3-1 of the power semiconductor 3 is connected to the FP. Connect the heat dissipation tab or electrode lead 3-2 to the corresponding connection round of the FP. The plating surface of the metal plate 6 which is nickel plated through the through hole 5-3 provided in C5. It is soldered directly to the

[0009]

[Effect of the idea]

Since the electronic circuit assembly of the present invention has the above-mentioned structure, it is similar to that of power semiconductors. This has the effect of increasing the heat dissipation effect and reducing assembly man-hours and costs.

[Brief explanation of drawings]

FIG. 1 is a plan view of an electronic circuit assembly according to the present invention.

FIG. 2 is a sectional view of an electronic circuit assembly according to the present invention.

FIG. 3 is a plan view of an electronic circuit assembly according to the prior art.

FIG. 4 is a cross-sectional view of an electronic circuit assembly according to the prior art.

[Explanation of symbols]

1, 2, P: Printed wiring board (PCB) 3: Power semiconductor 3-1: Power semiconductor terminals 3-2: Tab or electrode lead for heat radiation of power semiconductor 4: Connection wire 5: Flexible base material printed circuit board (FPC) 5-1: FPC conductor layer 5-2: FPC insulation layer 5-3: Hole provided in FPC 6, 7, N: Nickel plated metal plate

Claims (1)

[Scope of utility model registration request] Claim 1: In an electronic circuit assembly in which a plurality of printed circuit boards (referred to as PCBs) are connected and integrally formed using a flexible substrate printed circuit board (referred to as FPC), the conductor layer of the FPC is connected to an insulated surface. is fixed to the plated surface of a nickel-plated metal plate, a terminal of a power semiconductor is connected to the surface of the FPC on which the conductor layer is provided, and a tab or electrode lead for heat dissipation of the power semiconductor is attached to the FPC. An electronic circuit assembly characterized by a structure in which the electronic circuit assembly is fixed to the plated surface of the nickel-plated metal plate through a provided hole or notch.