JPH04117496U - Chip-shaped circuit component mounting device - Google Patents

Abstract

(57) [Summary] (with amendments) [Purpose] Guide case 6 of template 6 from container 1 side
To prevent static electricity from being charged on the lower surface of a distributor 2 that distributes chip-like circuit components to 1. [Structure] A chip-shaped circuit component is sent from a container 1 through guide tubes 21, 21, . . . of a distributor 2 into a guide case 61 of a template 6. Thereafter, while the template 6 is moved below the suction head 8 by the slide mechanism 66, the tip of the brush-like contactor 26 comes into contact with the lower surface of the distributor 2, removing static electricity there. Furthermore, a chip-shaped circuit component is mounted on the circuit board 9 by the suction head 8 .

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention is a device that mounts chip-shaped circuit components on a circuit board. This invention relates to improvements for reliably distributing and mounting circuit components on circuit boards.

0002

[Conventional technology]

Conventionally, when mounting chip-shaped circuit components on a predetermined position on a circuit board, automatic This was done using a dynamic mounting device as follows. i.e. multiple containers The chip-shaped circuit components stored in bulk inside are piped to the distributor. Take out the guide tubes one by one and place them in the designated position on the template. They are each sent to a concave storage part formed in the area and received there. This storage compartment is for each It is arranged to match the position where chip-shaped circuit components are mounted on the circuit board. and , the chips stored in the storage section are moved by a component moving means having a suction head. The loop-shaped circuit components are moved to the circuit board while retaining their relative positions when stored. , will be installed. This allows each chip-shaped circuit component to be placed in a predetermined position on the circuit board. are installed on each. Adhesive is applied to the circuit board in advance at the locations where chip-shaped circuit components are to be mounted. Then, solder the mounted circuit components while temporarily fixing them with this adhesive. cormorant.

0003 In the template, a recess is formed to receive the chip-shaped circuit component. 3, the guide case 6 is placed on the baseboard 60 of the template 6. 1 is installed. Template 6 is a distribution of multi-mounter device When the vacuum case is inserted directly under the template 6, The lower surface side of the template 6 is maintained at negative pressure. In this state, the distribution The chip-shaped circuit component a falling through the guide tube 21 of the computer 2 is guided. It is collected in case 61. At this time, from the guide tube 21 to the bottom of the guide case 61 Air is drawn into the back side of the template 6 through the through hole 63 formed in the section. The chip-shaped circuit component a is sent to the guide case 61 by this air flow.

0004 After that, when the template moves below the suction head 8, the suction The head descends, and the chip-shaped circuit component a received in the predetermined position of the template is Each is sucked into the set nozzle of the suction head. The template is then supported. After retracting from under the suction head, the circuit board is inserted under it and the suction head is removed. The head descends and picks up the chip-shaped circuit components that are attracted to the tip of the set nozzle onto the circuit board. Place it on top of the circuit board and temporarily fix it with adhesive applied to the circuit board in advance. After that, The head returns to the upper position.

[0005]

[Problem that the invention is trying to solve]

By the way, it falls from the distributor 2 side and passes through the template 6. Until the chip-shaped circuit component a is attracted and held by the application head, static electricity becomes charged. Such charged chip-shaped circuit components a are sent one after another, and As the templates are received one after another into the guide case 61, the lower surface of the template 2 also becomes electrically charged. I end up. Then, as shown by the two-dot chain line in Fig. 3, the chip-shaped circuit component a is not stored in the guide case 61, and the frame 22 of the distributor 2 It may stick to the bottom surface of the .

[0006] The frame 22 of the distributor 2 is made of metal and is inherently conductive. The body is actually coated with resin paint, etc. on its underside, and this paint film becomes electrically charged. The static electricity attracts the chip-shaped circuit component a. And in this way, the guide case The chip-shaped circuit component a is not received in the space 61 and the distributor 2 is closed. If it remains stuck to the bottom surface of the frame 22, a part of the guide case 61 may become chip-shaped. The circuit proceeds to the next operation without being stored, resulting in a so-called missing item. , chip-shaped circuit components are not mounted correctly on the circuit board. Therefore, the present invention was devised to solve the above problem, and its purpose is to A chip-shaped circuit part that can eliminate static electricity that has accumulated on the bottom surface of the tributary. The purpose of the present invention is to provide a product mounting device.

[0007]

[Means to solve the problem]

That is, in order to achieve the above object, in the present invention, chip-shaped circuit components are A plurality of containers 1, 1... stored in a shape, and chips stored in each container 1, 1... a distributor 2 for distributing and supplying shaped circuit components, and the distributor A storage section for receiving chip-shaped circuit components supplied from 2 was placed at a predetermined position. A conveyor 7 that conveys the template 6, the circuit board 9, and the template 6. The circuit components stored in the storage section are picked up from inside the storage section and mounted on the circuit board 9. In the chip-shaped circuit component mounting device equipped with a suction head 8 that Place the plate near the template 6, facing upward and touching the bottom surface of the distributor 2. A chip-shaped circuit component mouse characterized in that a contactor 26 for eliminating static electricity is arranged. We propose a new client device. In this case, it is desirable that the contactor 26 has a brush shape.

[0008]

[Effect]

In the chip-shaped circuit component mounting device of the present invention, the template 6 is When moving from directly below the revuter 2 to the suction head 8, the template A contact 26 for static electricity removal near the distributor 2 is connected to the distributor 2. Since it comes into contact with the bottom surface, the static electricity charged there is removed. Also, like this By removing static electricity from the bottom surface of the distributor 2, the chip-shaped circuit component a is accommodated. The template 6 to be stored, especially the guide case 61 side thereof, is also less likely to be charged. Note that if a brush-like object is used as the contactor 26, the contactor 26 will be distributed. It evenly contacts the bottom surface of the viewer 2, achieving a reliable static neutralization effect.

[0009]

【Example】

Next, embodiments of the present invention will be specifically described with reference to the drawings. An overview of the entire mounting device for chip-shaped circuit components according to an embodiment of the present invention is shown in Figure 1. has been done. That is, a plurality of containers 1 containing chip-shaped circuit components in bulk are arranged. A delivery section 11, which is an escapement, is connected to this via a tube 10. has been done. Furthermore, a distributor 2 is arranged below this delivery section 11. ing.

0010 This distributor 2 has a fixed frame fixed under the delivery section 11. The template 6 is arranged parallel to the template 23 under the template 23, and the template 6 is removably attached to the lower surface side. It has a movable frame 22 to which it is attached, and these fixed frames 23 and movable frames The beam 22 consists of four flexible columns of equal length whose four corners are connected to each other. connected. A vibrator 24 that vibrates the movable frame 22 is connected to the movable frame 22. , whereby the movable frame 22 is horizontally vibrated. Furthermore, a chip-shaped circuit component is proposed between the fixed frame 23 and the movable frame 22. Inside, flexible guide tubes 21, 21, . . . for conveyance are installed.

[0011] Below the movable frame 22 is a template placed on a template frame 65. 6 is inserted and fixed. This template 6 is a circuit of a chip-shaped circuit component. A guide case 61 is arranged on the baseboard 60 according to the mounting position on the board. It is. Then, this template 6 is inserted directly under distributor 2. When the lower end of the guide tube 21 connected to the movable frame 22 is located above each guide case 61 of the template 6.

0012 Also, at this time, the vacuum case 4 is placed under the template 6, and the The lower side of rate 6 is maintained at negative pressure. Therefore, from the guide tube 21 to the guide tube Air is drawn to the back side of the template 6 through the hole formed at the bottom of the base 61. This creates an air flow. Here, the chips sent from the 1st side of each container Due to its gravity and the air flow, the shaped circuit component a moves toward the distributor 2. is sent through the guide tube 21 of the template 6 and is housed in the guide case 61 of the template 6. will be paid.

[0013] The template 6 placed on the template frame 65 is moved to the slide mechanism 66. , move directly below the distributor 2 and directly below the suction head 8. It will be done. As a result, the chip-shaped circuit components are placed directly under the distributor 2. After each template 6 is received in a predetermined guide case 61, the template 6 is Move to the bottom of the action head 8. There, the chips were collected in the information case 61. The shaped circuit components are respectively attracted to the set nozzles of the suction head 8. After that, After the conveyor plate is retracted from under the suction head 8, the conveyor plate is placed under the suction head 8. The circuit board 9 transported by the arm 7 is inserted. And suction head 8 However, the chip-shaped circuit component attracted to the tip of the set nozzle 81 is placed on the circuit board 9. be installed on.

[0014] Here, in the present invention, as shown in FIG. A contact 2 for static electricity removal is placed near the template 6 placed on the plate frame 65. 6 is placed. In the illustrated embodiment, the contact holding portion 2 is placed on the template frame 65. 5 is constructed, and the brush-shaped contact 26 is projected upward from this contact holding part 25. It is set up. As a result, when the contactor 26 is under the distributor 2, , so that its tip touches the bottom surface of the frame 22 of the distributor 2. are doing.

[0015] The contact 26 is an elastic flock made of resin or the like that is soft and has some stiffness. For example, a material containing a carbon component to impart electrical conductivity is preferable. and contact By making the child holding part 25 side electrically conductive with the frame 22, the holding part 25 The contactor 26 is grounded to the frame 22 via.

[0016] In Figure 2, the template 6 is inserted into the suction head from directly below the distributor 2. When moving to the left in the figure as shown by the arrow toward the contact 26 represents the state in which is in contact with the lower surface of the frame 22 of the distributor 2. . That is, as the template frame 65 moves by the slide mechanism 66, , the contact 26 is configured to wipe the entire bottom surface of the frame 22 of the distributor 2. Make contact. When the contactor 26 contacts the lower surface of the frame 22, it becomes electrically charged. The static electricity passing through the contacts 26 escapes to the template frame 65 side and is eliminated. In addition, as shown by the two-dot chain line in the figure, the chip-shaped circuit component a is placed on the bottom surface of the frame 22. , and it remains even when template 6 is moved. , also contacts it, removes the static electricity, and transfers the chip-shaped circuit component a to the frame 22. Brush it off from the bottom.

[0017]

[Effect of the idea]

As explained above, according to the present invention, the lower surface of the distributor 6 is charged. It is possible to remove static electricity caused by static electricity, so chip circuit components can be securely attached to the circuit board. A mounting device that can be mounted is obtained.

[Brief explanation of drawings]

FIG. 1 is a schematic perspective view showing a chip-shaped circuit component mounting device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the lower part of the distributor and the main parts of the template moving from below, showing an embodiment of the present invention;

FIG. 3 is a sectional view of a main part of a lower part of a distributor and a template that moves from below, showing a conventional example.

[Explanation of symbols]

1 container 2 Distributor 6 Template 9 Circuit board 7 conveyor 8 Suction head 26 Contactor

Claims (2)

[Reference number] 0020936-01 [Scope of utility model registration request] 1. A plurality of containers (1), (1)... in which chip-shaped circuit components are stored in bulk, each container (1),
(1) A distributor (2) that distributes and supplies the chip-shaped circuit components stored in... and a storage section that receives the chip-shaped circuit components supplied from the distributor (2) are arranged at predetermined positions. template (6)
a conveyor (7) for conveying the circuit board (9); and a suction system for sucking the circuit components stored in the storage section of the template (6) from inside the storage section and mounting them on the circuit board (9). In the chip-shaped circuit component mounting device comprising a head (8), a contactor (26) for eliminating static electricity is arranged near the template (6) and contacts the lower surface of the distributor (2) facing upward. A chip-shaped circuit component mounting device characterized by: 2. In claim 1, the contact (26)
A chip-shaped circuit component mounting device, characterized in that the is brush-shaped.