JPH0411624B2 - - Google Patents

Info

Publication number
JPH0411624B2
JPH0411624B2 JP61142962A JP14296286A JPH0411624B2 JP H0411624 B2 JPH0411624 B2 JP H0411624B2 JP 61142962 A JP61142962 A JP 61142962A JP 14296286 A JP14296286 A JP 14296286A JP H0411624 B2 JPH0411624 B2 JP H0411624B2
Authority
JP
Japan
Prior art keywords
target
magnetic field
facing
targets
sputtering apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61142962A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63468A (ja
Inventor
Sadao Kadokura
Kazuhiko Pponjo
Akio Kusuhara
Hiroshi Aoyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP14296286A priority Critical patent/JPS63468A/ja
Publication of JPS63468A publication Critical patent/JPS63468A/ja
Publication of JPH0411624B2 publication Critical patent/JPH0411624B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP14296286A 1986-06-20 1986-06-20 対向タ−ゲツト式スパツタ装置 Granted JPS63468A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14296286A JPS63468A (ja) 1986-06-20 1986-06-20 対向タ−ゲツト式スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14296286A JPS63468A (ja) 1986-06-20 1986-06-20 対向タ−ゲツト式スパツタ装置

Publications (2)

Publication Number Publication Date
JPS63468A JPS63468A (ja) 1988-01-05
JPH0411624B2 true JPH0411624B2 (fr) 1992-03-02

Family

ID=15327707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14296286A Granted JPS63468A (ja) 1986-06-20 1986-06-20 対向タ−ゲツト式スパツタ装置

Country Status (1)

Country Link
JP (1) JPS63468A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006070623A1 (fr) * 2004-12-28 2006-07-06 Fts Corporation Dispositif de pulverisation avec cibles face a face

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006336029A (ja) * 2005-05-31 2006-12-14 Fts Corporation:Kk 連続スパッタ装置および連続スパッタ方法
JP6579796B2 (ja) * 2015-05-18 2019-09-25 長州産業株式会社 ミラートロンスパッタ装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5747870A (en) * 1980-09-04 1982-03-18 Fujitsu Ltd Magnetron sputtering method for ferromagnetic material
JPS57126969A (en) * 1981-01-30 1982-08-06 Hitachi Ltd Target structure of planer magnetron type sputtering apparatus and method for controlling magnetic flux thereof
JPS58164781A (ja) * 1982-03-23 1983-09-29 Teijin Ltd 対向タ−ゲツト式スパツタ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5747870A (en) * 1980-09-04 1982-03-18 Fujitsu Ltd Magnetron sputtering method for ferromagnetic material
JPS57126969A (en) * 1981-01-30 1982-08-06 Hitachi Ltd Target structure of planer magnetron type sputtering apparatus and method for controlling magnetic flux thereof
JPS58164781A (ja) * 1982-03-23 1983-09-29 Teijin Ltd 対向タ−ゲツト式スパツタ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006070623A1 (fr) * 2004-12-28 2006-07-06 Fts Corporation Dispositif de pulverisation avec cibles face a face

Also Published As

Publication number Publication date
JPS63468A (ja) 1988-01-05

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