JPH0411624B2 - - Google Patents
Info
- Publication number
- JPH0411624B2 JPH0411624B2 JP61142962A JP14296286A JPH0411624B2 JP H0411624 B2 JPH0411624 B2 JP H0411624B2 JP 61142962 A JP61142962 A JP 61142962A JP 14296286 A JP14296286 A JP 14296286A JP H0411624 B2 JPH0411624 B2 JP H0411624B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- magnetic field
- facing
- targets
- sputtering apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14296286A JPS63468A (ja) | 1986-06-20 | 1986-06-20 | 対向タ−ゲツト式スパツタ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14296286A JPS63468A (ja) | 1986-06-20 | 1986-06-20 | 対向タ−ゲツト式スパツタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63468A JPS63468A (ja) | 1988-01-05 |
JPH0411624B2 true JPH0411624B2 (cs) | 1992-03-02 |
Family
ID=15327707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14296286A Granted JPS63468A (ja) | 1986-06-20 | 1986-06-20 | 対向タ−ゲツト式スパツタ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63468A (cs) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006070623A1 (ja) * | 2004-12-28 | 2006-07-06 | Fts Corporation | 対向ターゲット式スパッタ装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006336029A (ja) * | 2005-05-31 | 2006-12-14 | Fts Corporation:Kk | 連続スパッタ装置および連続スパッタ方法 |
JP6579796B2 (ja) * | 2015-05-18 | 2019-09-25 | 長州産業株式会社 | ミラートロンスパッタ装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5747870A (en) * | 1980-09-04 | 1982-03-18 | Fujitsu Ltd | Magnetron sputtering method for ferromagnetic material |
JPS5922788B2 (ja) * | 1981-01-30 | 1984-05-29 | 株式会社日立製作所 | プレ−ナマグネトロン方式のスパッタリング装置及びその方法 |
JPS58164781A (ja) * | 1982-03-23 | 1983-09-29 | Teijin Ltd | 対向タ−ゲツト式スパツタ装置 |
-
1986
- 1986-06-20 JP JP14296286A patent/JPS63468A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006070623A1 (ja) * | 2004-12-28 | 2006-07-06 | Fts Corporation | 対向ターゲット式スパッタ装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS63468A (ja) | 1988-01-05 |
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