JPH04112595A - Discriminating method of printed wiring board - Google Patents
Discriminating method of printed wiring boardInfo
- Publication number
- JPH04112595A JPH04112595A JP23175290A JP23175290A JPH04112595A JP H04112595 A JPH04112595 A JP H04112595A JP 23175290 A JP23175290 A JP 23175290A JP 23175290 A JP23175290 A JP 23175290A JP H04112595 A JPH04112595 A JP H04112595A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- printed wiring
- wiring board
- identification
- discriminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 238000005553 drilling Methods 0.000 claims description 8
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 ある。[Detailed description of the invention] Industrial applications be.
従来の技術
近年、電子部品における生産の自動化、多品種少量化が
大きく進んでおり、プリント配線板も、生産管理のため
に品番、ロット番号、ロフト内の通し番号等を付与する
必要性が高まってきた。Conventional technology In recent years, production automation and high-mix low-volume production of electronic components have progressed significantly, and there is an increasing need to assign product numbers, lot numbers, serial numbers within lofts, etc. to printed wiring boards for production control purposes. Ta.
以下に従来のロット番号等の付与と識別の方法について
説明する。The conventional method of assigning and identifying lot numbers, etc. will be explained below.
第3図と第4図は従来の識別方法を示したものである。FIGS. 3 and 4 show conventional identification methods.
第3図は、バーコードによる識別方法を用いた例で、1
はプリント配線板、11はバーコードによる識別部であ
る。これは、ロット番号やロット内の通し番号等の情報
をバーコード化し、そのバーコードを印刷したシールを
プリント配線板の端部等の所定の位置にはりつけ、上か
ら透明な樹脂をのせて硬化させることで、形成される。Figure 3 shows an example using the barcode identification method.
1 is a printed wiring board, and 11 is an identification section using a bar code. This involves converting information such as lot numbers and serial numbers within a lot into barcodes, attaching a sticker with the barcode printed to a predetermined position such as the edge of a printed wiring board, and then placing a transparent resin on top and hardening it. It is formed by this.
また、第4図は文字による識別方法を用いた例で、1は
プリント配線板、12は文字による識別部である。これ
は必要な情報を英数字に置き換え、また番号などはその
まま、UV硬化型や熱硬化型のインクで、所定の位置に
書き込むか押印し、インクを硬化させることで、形成さ
れる。Further, FIG. 4 shows an example using the character identification method, where 1 is a printed wiring board and 12 is a character identification section. This is formed by replacing the necessary information with alphanumeric characters and leaving the numbers as they are by writing or stamping them in a predetermined position with UV-curing or thermosetting ink, and then curing the ink.
発明が解決しようとする課題
しかしながら、上記の方法では製造の工数か増えるため
、リードタイムが長くなると共にコストも上がるという
問題点を有していた。Problems to be Solved by the Invention However, the above method has the problem of increasing the number of manufacturing steps, leading to longer lead times and higher costs.
本発明は上記従来の問題点を解決するもので、工数を増
やすことなく識別部を設けることのできる、プリント配
線板の識別方法を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and aims to provide a printed wiring board identification method in which an identification section can be provided without increasing the number of man-hours.
課題を解決するための手段
この目的を達成するために本発明のプリント配線板の識
別方法は、スルーホール等の穴をあける際に、行列状に
並へた複数個の穴による製品の識別部を同時に設けると
いう方法をとっている。Means for Solving the Problems In order to achieve this object, the printed wiring board identification method of the present invention uses a method for identifying a product using a plurality of holes arranged in a matrix when drilling holes such as through holes. We are taking a method of providing both at the same time.
作用
この方法によれば、識別部を設ける工程か穴あけの工程
に含まれるため、識別部を設ける工程を独立して作る必
要がなくなり、また特に材料を用意する必要もなくなる
。そこで、材料費1人件費およびリードタイムを節減す
ることができる。Effect: According to this method, the step of providing the identification portion is included in the step of drilling holes, so there is no need to create the step of providing the identification portion independently, and there is no need to prepare any particular materials. Therefore, material costs, labor costs, and lead time can be reduced.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第1図は本発明の一実施例におけるプリント配線板の識
別部を示すものである。第1図において、1はプリント
配線板、2は配線パターン、3はランド部に設けたスル
ーホール、4はプリント配線板1内に設けられた識別部
である。なお、図中の黒丸は穴かおいていることを示し
ている。第2図はプリント配線板の穴加工機の構成を示
し、5は穴加工機本体、6は穴加工の情報入力部である
。FIG. 1 shows an identification part of a printed wiring board in one embodiment of the present invention. In FIG. 1, 1 is a printed wiring board, 2 is a wiring pattern, 3 is a through hole provided in a land portion, and 4 is an identification portion provided within the printed wiring board 1. Note that the black circles in the figure indicate holes. FIG. 2 shows the configuration of a hole processing machine for printed wiring boards, where 5 is the main body of the hole processing machine and 6 is an information input section for hole processing.
以下、実施例について詳しく説明する。Examples will be described in detail below.
本発明によるプリント配線板の識別部は、行列状に並ぺ
た複数個の穴により構成される。第1図は、識別部とし
て、プリント配線板の端部に、列に等間隔で10箇所の
穴あけ位置を設定し、この各人あけ位置の穴の有無で識
別のための情報を書き込むように構成したものである。The identification portion of the printed wiring board according to the present invention is composed of a plurality of holes arranged in a matrix. In Figure 1, as an identification section, ten hole positions are set at equal intervals in a row at the end of a printed wiring board, and information for identification is written based on the presence or absence of holes at each hole position. It is composed of
識別のための情報は、ロット番号やロット内の通し番号
なと数値の場合が多いので、数値を2進法で表わし、1
とOの数字の組み合わせにすることができる。Identification information is often numerical values such as lot numbers and serial numbers within a lot, so numerical values are expressed in binary notation and 1
It can be a combination of the numbers O and O.
この1とOの数字を穴の有無でおきかえると、上記のよ
うな識別部の構成の場合、十進数でOから1023まで
の数を表現できることになる。第1図に挙げた例では、
次のようになる。If the numbers 1 and O are replaced depending on the presence or absence of a hole, in the case of the configuration of the identification section as described above, numbers from O to 1023 can be expressed in decimal notation. In the example given in Figure 1,
It will look like this:
“・・ζ:・・・X″Jご二1C1・ぐ、〕1・に)1
101000101=>833”次に、この識別部の形
成方法について説明する。スルーホール等の穴加工は通
常、数値制御による穴加工機が用いられる。穴加工機は
第2図のように各種情報の入力部と加工機本体から成る
。"...ζ:...X"JGo21C1・gu,]1・ni)1
101000101=>833" Next, we will explain how to form this identification part. For drilling holes such as through holes, a numerically controlled drilling machine is usually used. The drilling machine collects various information as shown in Figure 2. Consists of input section and processing machine body.
情報の入力は、紙テープや磁気ディスクなどによる場合
と、据え付けのキーホードによる場合かある。制御はマ
イクロコンピュータで行なう。本方法の実施には、識別
部の形成のためのソフトウェアを制御部に組み込み、識
別のだめの情報や識別部を形成する位置の情報を、磁気
ディスクやキーボードから入力するようにする。Information can be entered using paper tapes, magnetic disks, etc., or using a fixed key fob. Control is performed by a microcomputer. To implement this method, software for forming the identification section is installed in the control section, and information on the identification section and information on the position where the identification section is to be formed are inputted from a magnetic disk or a keyboard.
以上のように本実施例によれば、プリント配線板の識別
のための数値を穴の有無で表現し、識別部の穴の加工に
はソフトウェアを穴加工機に組み込むことによって、ス
ルーホール等の穴加工時に、穴加工機に入力する情報を
ふやすだけで識別部を設けることができ、識別部を設け
るための工程を単独に作る必要がない。As described above, according to this embodiment, the numerical value for identifying a printed wiring board is expressed by the presence or absence of a hole, and the holes in the identification part are processed by incorporating software into the hole processing machine. The identification section can be provided by simply increasing the information input to the hole processing machine during hole processing, and there is no need to create a separate process for providing the identification section.
なお、実施例では、10箇所の穴の有無を2進法の1と
0の数値におきかえたが、これは単に1024通りの記
号として考えてもよい。また、実施例では識別部を1列
10個の穴の有無としたか、これをmxnの行列のよう
にしてもよい。In the embodiment, the presence or absence of holes at 10 locations was replaced with binary values of 1 and 0, but this may simply be considered as 1024 symbols. Further, in the embodiment, the identification part is made to have 10 holes in one column or not, but it may be made into an mxn matrix.
発明の効果
以上のように本発明は、スルーホール等の穴をあける際
に、行列状に並へた複数個の穴による製品の識別部を同
時に設けることにより、識別部を設けるための工程を単
独に作る必要がなくなり、コストやリードタイムを節減
できる、優れたプリント配線板の識別方法を実現できる
ものである。Effects of the Invention As described above, the present invention simplifies the process of providing the identification portion by simultaneously providing the identification portion of the product using a plurality of holes arranged in a matrix when drilling holes such as through holes. This makes it possible to realize an excellent method for identifying printed wiring boards, which eliminates the need to manufacture them separately and reduces costs and lead time.
第1図は本発明の一実施例におけるプリント配線板の識
別方法を示す平面図、第2図は穴加工機の概略図、第3
図、第4図は従来のプリント配線板の識別方法を示す平
面図である。
1・・・・・・プリント配線板、3・・・・・・スルー
ホール、4・・・・・・識別部。FIG. 1 is a plan view showing a printed wiring board identification method in an embodiment of the present invention, FIG. 2 is a schematic diagram of a hole drilling machine, and FIG.
4 are plan views showing a conventional printed wiring board identification method. 1...Printed wiring board, 3...Through hole, 4...Identification section.
Claims (1)
バイヤホールの穴をあける際に、行列状に並べた複数個
の穴によるロット番号等の製品の識別部を同時に設ける
プリント配線板の識別方法。A printed wiring board identification method that simultaneously provides a product identification part such as a lot number using a plurality of holes arranged in a matrix when drilling component insertion holes, through holes, or via holes in a printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23175290A JPH04112595A (en) | 1990-08-31 | 1990-08-31 | Discriminating method of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23175290A JPH04112595A (en) | 1990-08-31 | 1990-08-31 | Discriminating method of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04112595A true JPH04112595A (en) | 1992-04-14 |
Family
ID=16928482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23175290A Pending JPH04112595A (en) | 1990-08-31 | 1990-08-31 | Discriminating method of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04112595A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000032019A1 (en) * | 1998-11-20 | 2000-06-02 | Pmj Cencorp, Llc | Depaneling system having multiple router stations |
JP2003051650A (en) * | 2001-08-06 | 2003-02-21 | Ibiden Co Ltd | Printed wiring board, multilayer printed wiring board and manufacturing method therefor |
JP2012256752A (en) * | 2011-06-09 | 2012-12-27 | Ngk Spark Plug Co Ltd | Multilayer wiring board and method for manufacturing the same |
US9006580B2 (en) | 2011-06-09 | 2015-04-14 | Ngk Spark Plug Co., Ltd. | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
-
1990
- 1990-08-31 JP JP23175290A patent/JPH04112595A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000032019A1 (en) * | 1998-11-20 | 2000-06-02 | Pmj Cencorp, Llc | Depaneling system having multiple router stations |
US6357108B1 (en) | 1998-11-20 | 2002-03-19 | Pmj Cencorp, Llc | Depaneling system having multiple router stations |
JP2003051650A (en) * | 2001-08-06 | 2003-02-21 | Ibiden Co Ltd | Printed wiring board, multilayer printed wiring board and manufacturing method therefor |
JP2012256752A (en) * | 2011-06-09 | 2012-12-27 | Ngk Spark Plug Co Ltd | Multilayer wiring board and method for manufacturing the same |
US9006580B2 (en) | 2011-06-09 | 2015-04-14 | Ngk Spark Plug Co., Ltd. | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
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