JPH04109597U - circuit board - Google Patents

Abstract

(57) [Summary] [Purpose] To perform high-density electronic component mounting without interference between electronic circuits using a multilayer board. [Structure] In a multilayer board, a part of the inner layer is used as a shield layer, and electronic components constituting an electronic circuit are mounted on both sides of the multilayer board. [Effect] Electronic circuits can be made smaller, thinner, and more densely mounted.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to circuit boards for mounting electronic circuits, etc., and in particular seals on multilayer boards. It is designed to have a de-effect.

0002

[Conventional technology]

In recent years, many small portable electronic devices have been developed and produced. mobile electronic like this Devices are required to be equipped with high-density, high-performance electronic circuits. Therefore, the circuit board A shield plate, etc. is used on the board to prevent interference between circuits due to electromagnetic dielectric, etc. There is.

0003

[Problem that the idea aims to solve]

The mounting method using shield plates, etc., as described above, makes it possible to reduce the size and weight of portable electronic devices. However, there were limits to the pursuit of thinner, lower cost designs.

0004

[Means to solve the problem]

In order to solve the above problem, in this invention, a part of the inner layer of the multilayer board is sealed. By providing a hard layer, it has a shielding effect, etc., which allows for high-density and high-density electronic circuits. Enables high-performance implementation.

[0005]

[Effect]

According to the above configuration, the shield layer of the multiple layers of the mounted circuit board protects against electromagnetic waves. Shield from static electricity, etc.

[0006]

【Example】

Embodiments of the present invention will be described below based on the drawings. The circuit board 1 in FIG. 1 is composed of a multilayer board, which will be described later. The components of the transmitting circuit 2 consisting of a resistor 5, an IC 6, etc. are mounted on one side of the board, Also, on the other side, a receiving circuit 3 consisting of a resistor 5, an IC 6, a capacitor 7, etc. is mounted. This is what I did.

[0007] FIG. 2 shows a detailed cross-sectional view of the circuit board 1, which has multiple layers as a whole and conductors. It is composed of layers 10 to 15 and an insulating layer 20. However, the conductor layer 10 of the multilayer substrate 1 12 and 13 out of 15 are shield layers 12 and 13. In the example shown, The circuit board (multilayer board) 1 has a six-layer structure, but the number of layers is limited to this. Needless to say, this cannot be determined.

[0008]

[Effect of the idea]

According to the present invention, the circuit board itself can have a shielding effect, and the electronic circuit board can have a shielding effect. Even when circuit boards are mounted on both sides of a circuit board, the shielding effect of the circuit board prevents electronic The influence of interference due to mutual electromagnetic induction between circuits can be reduced. Also, circuit board No shielding plate other than the plate is required, making portable electronic devices smaller, thinner, and lighter. It has various effects such as contributing to cost reduction and cost reduction.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a circuit board according to an embodiment of the present invention.

FIG. 2 is a detailed cross-sectional view of the circuit board of the present invention.

[Explanation of symbols] 1 Circuit board (multilayer board) 2 Transmission circuit 3 Receiving circuit 5 Resistance 6 IC 7 Capacitor 10, 11, 14, 15 conductor layer 12, 13 Shield layer 20 Insulating layer

Claims (1)

[Scope of utility model registration request] 1. A multilayer board composed of a plurality of conductor layers and insulating layers, characterized in that circuit components are mounted on both sides of the multilayer board using one or more internal conductor layers as a shield layer. .