JPS63227100A - Construction of cubicle of electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a case structure of an electronic device, and particularly to a case structure of an electrically shielded electron carrier.

(Prior Art) Electronic equipment, especially radio equipment, is usually electrically shielded with a shield case or the like to prevent interference from external radio waves. Conventionally, the housing of such an electronic device has been constructed as shown in FIG.

That is, a pair of upper and lower housings 1 made of synthetic resin or the like.
A printed wiring board 2 is provided inside a and 1b via legs 13, and various electronic components 4 are mounted on circuits formed on this printed wiring board 2. A shield case 5 is attached to this printed wiring board 2 for electrical shielding, and this shield case 5 and the housing 1
A certain amount of space is provided between the inner surface of a and the inner surface of a.

According to the conventional casing 1 configured as described above, a printed wiring board 3 and a shield case 5 are disposed inside, and there is a space between the printed wiring board 3 and the shield case 5 so that the shield case 5 does not come into contact with the inner surface of the casing 1a. Because it is necessary to provide an interval,
There has been a problem in that it is difficult to make the housing 1 thinner and smaller. Furthermore, since the shield case 5 is required, there is also a drawback that the cost is high.

Another conventional housing structure is one in which a circuit pattern is directly formed on the inner surface of a housing made of synthetic resin or the like. Although this structure is effective in making the casing thinner and smaller, other means must be provided for electrical shielding, making it unsuitable for radio equipment and the like.

Another conventional housing structure is one in which the housing is made of a metal member and a circuit pattern is formed on the metal member making up the housing via an insulating member. With this structure, a sufficient electrical shielding effect cannot be obtained, and furthermore, when the casing is made of a metal member, it is difficult to mold the casing, and it is also heavy and costly.

(Problems to be Solved by the Invention) The present invention solves a problem with the case structure of conventional electronic carriers; when a printed wiring board and a shield case are attached inside, the case becomes large and has a certain size. The problem is that high-density mounting is not possible in the case, that electrical shielding effects cannot be obtained just by forming a circuit pattern on the inside of the case, and that if the case is made of metal materials, it is difficult to mold and the cost is high. The purpose of the present invention is to provide a cylindrical structure for electronic equipment that can be made thinner and smaller, and has an electrical shielding effect.

[Structure of the Invention (Means for Solving the Problems)] In order to achieve the above object, the present invention provides a three-layer integrated housing in which a shielding layer made of an electrical shielding member is sandwiched between non-metallic members. The device comprises a housing and a circuit pattern formed on the inner surface of the housing to mount electronic components.

(Function) According to the above structure, the casing is formed by molding using a material formed in three layers by sandwiching the electrical shielding member between non-metallic members, and the inner surface of the casing, which is a non-metallic member, is Since a circuit pattern for mounting electronic components is formed on the casing, an electrical shielding effect can be obtained, and the casing can be made thinner and smaller.

(Example) Hereinafter, an example of the housing structure of an electronic device according to the present invention will be described with reference to the drawings.

FIG. 1 shows an embodiment of the present invention. In this figure, the second
Components that are the same or equivalent to those of the conventional example shown in the figures are designated by the same reference numerals. A pair of upper and lower housings 1a.

1b is formed by molding using a three-layered material in which a metal plate 8 is sandwiched between synthetic resin layers 6 and 7, respectively. This metal plate 8 serves as a shielding layer having an electrical shielding effect.

Circuit patterns 9a and 9b are formed on the inner surfaces of the casings 1a and 1b, respectively, by known means. Electronic components 4 are mounted on these circuit patterns 9a and 9b, and a pair of upper and lower housings 1a and '1b are joined together.

Next, the operation of this embodiment will be explained. Since the casings 1a and 1b are provided with a metal plate 8 having an electrical shielding effect, the casings 1a and 1b themselves have an electrical shielding effect, and there is no need to provide a separate shield plate. Furthermore, since the circuit patterns 9a and 9b are formed on the casings 1a and lb, respectively, there is no need to provide a separate printed wiring board.

According to this embodiment, since there is no need to separately provide a shield plate and a printed wiring board, the casings 1a and 1b can be made thinner and smaller, and a sufficient electrical shielding effect can also be obtained. . Therefore, material costs and assembly costs can be reduced, making it possible to reduce costs. In particular, wireless devices such as cordless phones and mobile phones are required to be small, thin, lightweight, and have an electrical shielding effect, so if the housing structure of this example is used for these wireless devices, the effect will be large. It is.

[Effects of the Invention] As described above, according to the present invention, the casing of an electronic device is made of a material formed by sandwiching a shielding layer made of an electrical shielding member between non-metallic members, and the inside of the casing is Since the circuit pattern is formed on the surface, the casing structure can be made thinner and smaller, and a sufficient electrical shielding effect can be obtained. .

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing an embodiment of the casing structure of an electronic device according to the present invention, and FIG. 2 is a longitudinal sectional view showing the casing structure of a conventional electronic device. 1... Housing 4... Electronic components 6. 7... Synthetic resin layer (non-metallic member) 8... Metal plate ('aheikuni) 9... Circuit pattern agent Patent attorney Nori Chika Ken Kanshu Sanno - Figure 1 Figure 2

Claims (1)

[Claims] The present invention is comprised of a three-layer integrated housing with a shielding layer made of an electrical shield material sandwiched between non-metallic members, and a circuit pattern formed on the inner surface of the housing for mounting electronic components. Characteristic electronic device housing structure.