JPH0410737B2 - - Google Patents
Info
- Publication number
- JPH0410737B2 JPH0410737B2 JP26146784A JP26146784A JPH0410737B2 JP H0410737 B2 JPH0410737 B2 JP H0410737B2 JP 26146784 A JP26146784 A JP 26146784A JP 26146784 A JP26146784 A JP 26146784A JP H0410737 B2 JPH0410737 B2 JP H0410737B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- silicon
- alkaline solution
- bonded
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- 239000012670 alkaline solution Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 238000005987 sulfurization reaction Methods 0.000 claims description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 12
- 229910052697 platinum Inorganic materials 0.000 description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26146784A JPS61139032A (ja) | 1984-12-11 | 1984-12-11 | シリコン・エツチング法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26146784A JPS61139032A (ja) | 1984-12-11 | 1984-12-11 | シリコン・エツチング法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61139032A JPS61139032A (ja) | 1986-06-26 |
| JPH0410737B2 true JPH0410737B2 (enExample) | 1992-02-26 |
Family
ID=17362304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26146784A Granted JPS61139032A (ja) | 1984-12-11 | 1984-12-11 | シリコン・エツチング法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61139032A (enExample) |
-
1984
- 1984-12-11 JP JP26146784A patent/JPS61139032A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61139032A (ja) | 1986-06-26 |
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