JPH0410672Y2 - - Google Patents
Info
- Publication number
- JPH0410672Y2 JPH0410672Y2 JP1985185326U JP18532685U JPH0410672Y2 JP H0410672 Y2 JPH0410672 Y2 JP H0410672Y2 JP 1985185326 U JP1985185326 U JP 1985185326U JP 18532685 U JP18532685 U JP 18532685U JP H0410672 Y2 JPH0410672 Y2 JP H0410672Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- multilayer capacitor
- external electrodes
- capacitor element
- insulating paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 43
- 239000003973 paint Substances 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985185326U JPH0410672Y2 (pt) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985185326U JPH0410672Y2 (pt) | 1985-11-29 | 1985-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6292631U JPS6292631U (pt) | 1987-06-13 |
JPH0410672Y2 true JPH0410672Y2 (pt) | 1992-03-17 |
Family
ID=31133847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985185326U Expired JPH0410672Y2 (pt) | 1985-11-29 | 1985-11-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0410672Y2 (pt) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS423554Y1 (pt) * | 1965-03-31 | 1967-03-02 | ||
JPS4323499Y1 (pt) * | 1965-03-31 | 1968-10-03 | ||
JPS5796502A (en) * | 1980-12-08 | 1982-06-15 | Nitto Kogyo Kk | Chip holder used for coating step of leadless electric part chip and method of producing leadless coated electronic part chip using same holder |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6038273Y2 (ja) * | 1977-01-11 | 1985-11-15 | 株式会社村田製作所 | 筒形端子 |
-
1985
- 1985-11-29 JP JP1985185326U patent/JPH0410672Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS423554Y1 (pt) * | 1965-03-31 | 1967-03-02 | ||
JPS4323499Y1 (pt) * | 1965-03-31 | 1968-10-03 | ||
JPS5796502A (en) * | 1980-12-08 | 1982-06-15 | Nitto Kogyo Kk | Chip holder used for coating step of leadless electric part chip and method of producing leadless coated electronic part chip using same holder |
Also Published As
Publication number | Publication date |
---|---|
JPS6292631U (pt) | 1987-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0410672Y2 (pt) | ||
JPS6214667Y2 (pt) | ||
JPH0349387Y2 (pt) | ||
JPH043479Y2 (pt) | ||
JP3309831B2 (ja) | インダクタンス素子 | |
JPH0349388Y2 (pt) | ||
JPH09306744A (ja) | チップ状インダクタ | |
JP2513561Y2 (ja) | 半田付け用ランド | |
JPS6133624Y2 (pt) | ||
JPS61158910U (pt) | ||
JPH0427121Y2 (pt) | ||
JPH069475Y2 (ja) | 電子部品のキャップ端子 | |
JPH0338802Y2 (pt) | ||
JP2575563Y2 (ja) | 貫通形電子部品 | |
JPS60221920A (ja) | チツプ型セラミツクヒユ−ズの製造方法 | |
JPH0617227U (ja) | 貫通形コンデンサ | |
JPH0429586Y2 (pt) | ||
JPH051066Y2 (pt) | ||
JPS63311716A (ja) | ヒュ−ズ付積層セラミックコンデンサ | |
JPH0543537Y2 (pt) | ||
JPS5814696Y2 (ja) | コイル筒と整流子板の結合構造 | |
JPH0555087A (ja) | モールドチツプタンタル固体電解コンデンサ | |
JPH11219846A (ja) | 表面実装部品とその製造方法 | |
JPS61162952U (pt) | ||
JPS60221921A (ja) | チツプ型セラミツクヒユ−ズの製造方法 |